JPS6480089A - Semiconductor laser - Google Patents

Semiconductor laser

Info

Publication number
JPS6480089A
JPS6480089A JP23645287A JP23645287A JPS6480089A JP S6480089 A JPS6480089 A JP S6480089A JP 23645287 A JP23645287 A JP 23645287A JP 23645287 A JP23645287 A JP 23645287A JP S6480089 A JPS6480089 A JP S6480089A
Authority
JP
Japan
Prior art keywords
layer
semiconductor laser
type
type gaas
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23645287A
Other languages
Japanese (ja)
Inventor
Yoshifumi Tsunekawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP23645287A priority Critical patent/JPS6480089A/en
Publication of JPS6480089A publication Critical patent/JPS6480089A/en
Pending legal-status Critical Current

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  • Semiconductor Lasers (AREA)

Abstract

PURPOSE:To obtain a semiconductor laser, which oscillates in a stable fundamental transverse mode and has a low-noise characteristic and moreover, a high- optical output characteristic, by a method wherein the film thickness of a waveguide layer is formed into the optimized thickness. CONSTITUTION:A structure consisting of an n-type GaAs buffer layer 202, an n-type AlxGa1-xAs first clad layer 203, an AlyGa1-yAs active layer (x>y) 204, an AluGa1-uAs waveguide layer 205, a p-type AlzGa1-zAs second clad layer (z>y) 206 and a p-type GaAs contact layer 207 is formed continuously on an n-type GaAs substrate 201. Then, a mask 208 for rib etching is formed into the form of a part 209 shown by oblique lines. Subsequently, the layers 207 and 206 are etched away. Subsequently, an ZnSe buried layer 210, which is a III-VI compound semiconductor layer, is grown. Then, this is etched away into a striped form. Lastly, the formation of a p side electrode 211, a substrate polishing process on the rear of the substrate and the formation of an n side electrode 212 are performed to complete a semiconductor laser.
JP23645287A 1987-09-21 1987-09-21 Semiconductor laser Pending JPS6480089A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23645287A JPS6480089A (en) 1987-09-21 1987-09-21 Semiconductor laser

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23645287A JPS6480089A (en) 1987-09-21 1987-09-21 Semiconductor laser

Publications (1)

Publication Number Publication Date
JPS6480089A true JPS6480089A (en) 1989-03-24

Family

ID=17000957

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23645287A Pending JPS6480089A (en) 1987-09-21 1987-09-21 Semiconductor laser

Country Status (1)

Country Link
JP (1) JPS6480089A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04276682A (en) * 1990-12-20 1992-10-01 American Teleph & Telegr Co <Att> Semiconductor laser device provided with it and its manufacture

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04276682A (en) * 1990-12-20 1992-10-01 American Teleph & Telegr Co <Att> Semiconductor laser device provided with it and its manufacture

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