JPS64782B2 - - Google Patents

Info

Publication number
JPS64782B2
JPS64782B2 JP58129040A JP12904083A JPS64782B2 JP S64782 B2 JPS64782 B2 JP S64782B2 JP 58129040 A JP58129040 A JP 58129040A JP 12904083 A JP12904083 A JP 12904083A JP S64782 B2 JPS64782 B2 JP S64782B2
Authority
JP
Japan
Prior art keywords
cavity
holder
processed
cooling
small holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58129040A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6020438A (ja
Inventor
Iwao Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jeol Ltd
Original Assignee
Nihon Denshi KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Denshi KK filed Critical Nihon Denshi KK
Priority to JP58129040A priority Critical patent/JPS6020438A/ja
Publication of JPS6020438A publication Critical patent/JPS6020438A/ja
Publication of JPS64782B2 publication Critical patent/JPS64782B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3435—Target holders (includes backing plates and endblocks)

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
JP58129040A 1983-07-15 1983-07-15 材料保持装置 Granted JPS6020438A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58129040A JPS6020438A (ja) 1983-07-15 1983-07-15 材料保持装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58129040A JPS6020438A (ja) 1983-07-15 1983-07-15 材料保持装置

Publications (2)

Publication Number Publication Date
JPS6020438A JPS6020438A (ja) 1985-02-01
JPS64782B2 true JPS64782B2 (enExample) 1989-01-09

Family

ID=14999608

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58129040A Granted JPS6020438A (ja) 1983-07-15 1983-07-15 材料保持装置

Country Status (1)

Country Link
JP (1) JPS6020438A (enExample)

Also Published As

Publication number Publication date
JPS6020438A (ja) 1985-02-01

Similar Documents

Publication Publication Date Title
US9576824B2 (en) Etching chamber with subchamber
JP3440108B2 (ja) 真空加工処理装置および真空加工処理方法
US5145303A (en) Method and apparatus for reducing particulate contamination in processing chambers
US6008113A (en) Process for wafer bonding in a vacuum
JPS5953659B2 (ja) 真空室中回転体の往復動機構
JPH054666A (ja) 通気孔を設けた半導体ウエーハ用真空カセツト
JPH0238251B2 (enExample)
JP3121915B2 (ja) 封止装置
CN102230155A (zh) 可分离式腔体
JP6056673B2 (ja) ガス処理装置
WO1995016800A1 (en) Apparatus for heating or cooling wafers
US5150734A (en) Processing apparatus at reduced pressure and valve used therefor
WO2001010733A1 (en) Inverted pressure vessel with horizontal through loading
JPH08195428A (ja) 真空吸着装置
KR100353499B1 (ko) 급속 열처리(ｒｔｐ) 시스템용 팽창성 엘라스토머 요소
JPS64782B2 (enExample)
JPH10147863A (ja) 成膜装置とそのターゲット交換方法
JPH05301137A (ja) 真空チャック
JPH10303099A (ja) 基板処理装置
KR20180017592A (ko) 열 탈착 시스템 및 이를 이용한 기판 분석 방법
WO2018168201A1 (ja) 基板処理装置
US11508610B2 (en) Substrate support with edge seal
CN217200771U (zh) 真空吸附组件和绑定设备
CN221529907U (zh) 晶片表面阴阳离子的收集装置
US5043148A (en) Transfer device