JPS6477521A - Manufacture of perforated body film - Google Patents

Manufacture of perforated body film

Info

Publication number
JPS6477521A
JPS6477521A JP23424087A JP23424087A JPS6477521A JP S6477521 A JPS6477521 A JP S6477521A JP 23424087 A JP23424087 A JP 23424087A JP 23424087 A JP23424087 A JP 23424087A JP S6477521 A JPS6477521 A JP S6477521A
Authority
JP
Japan
Prior art keywords
resin
base
metal film
holes
perforated body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23424087A
Other languages
Japanese (ja)
Inventor
Kenichi Ogawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Instruments Inc
Original Assignee
Seiko Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instruments Inc filed Critical Seiko Instruments Inc
Priority to JP23424087A priority Critical patent/JPS6477521A/en
Publication of JPS6477521A publication Critical patent/JPS6477521A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To highly densely and easily made holes several ten micrometers in diameter on a thin film by a method wherein resin is applied on a base, on which metal film is formed, and an infinite number of holes are formed on the resin by means of photolithography and, after that, the metal film is removed. CONSTITUTION:As a base 1, a polished glass or corrosion-resistant metal plate is used. A metal film 2 is formed on the base by wet plating, metallizing or dry plating. Resin 3 is applied on the base, on which the metal film 2 is formed. Next, photoresist 4 is applied on the applied resin. The photoresist is exposed through a mask, which is made conforming to the shape and layout of holes in the aimed perforated body, and, after that, developed. By etching the resin in the portion exposed by development, an infinite number of holes are made. After that, resist 4 is removed. Finally, by separating the resin part from the base through the etching with chemical, which does not attack the resin on the metal film, a perforated body film is obtained.
JP23424087A 1987-09-18 1987-09-18 Manufacture of perforated body film Pending JPS6477521A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23424087A JPS6477521A (en) 1987-09-18 1987-09-18 Manufacture of perforated body film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23424087A JPS6477521A (en) 1987-09-18 1987-09-18 Manufacture of perforated body film

Publications (1)

Publication Number Publication Date
JPS6477521A true JPS6477521A (en) 1989-03-23

Family

ID=16967876

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23424087A Pending JPS6477521A (en) 1987-09-18 1987-09-18 Manufacture of perforated body film

Country Status (1)

Country Link
JP (1) JPS6477521A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2737927A1 (en) * 1995-08-17 1997-02-21 Commissariat Energie Atomique METHOD AND DEVICE FOR FORMING HOLES IN A LAYER OF PHOTOSENSITIVE MATERIAL, ESPECIALLY FOR THE MANUFACTURE OF ELECTRON SOURCES
US6467152B1 (en) * 1999-12-11 2002-10-22 Hughes Electronics Corp. Method of fabricating a microwave microstrip/waveguide transition structure
US7753568B2 (en) * 2007-01-23 2010-07-13 Foxconn Technology Co., Ltd. Light-emitting diode assembly and method of fabrication
CN103446683A (en) * 2013-09-16 2013-12-18 武汉龙飞翔科技产品制造有限公司 Five-prevention oxygen-enriched mask

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2737927A1 (en) * 1995-08-17 1997-02-21 Commissariat Energie Atomique METHOD AND DEVICE FOR FORMING HOLES IN A LAYER OF PHOTOSENSITIVE MATERIAL, ESPECIALLY FOR THE MANUFACTURE OF ELECTRON SOURCES
EP0759631A1 (en) * 1995-08-17 1997-02-26 Commissariat A L'energie Atomique Process and apparatus for the fabrication of holes in a layer of photosensitive material, especially for the fabrication of electron sources
US6467152B1 (en) * 1999-12-11 2002-10-22 Hughes Electronics Corp. Method of fabricating a microwave microstrip/waveguide transition structure
US7753568B2 (en) * 2007-01-23 2010-07-13 Foxconn Technology Co., Ltd. Light-emitting diode assembly and method of fabrication
CN103446683A (en) * 2013-09-16 2013-12-18 武汉龙飞翔科技产品制造有限公司 Five-prevention oxygen-enriched mask

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