JPS647580A - Photo-semiconductor module - Google Patents

Abstract

PURPOSE:To facilitate a die-bonding and a wire-bonding operation of a photo- detecting element by a method wherein the position alignment of a mount is performed through an electrode pin of a header and a hole or a cutout provided at the mount. CONSTITUTION:A through-hole, which is used for position alignment and fixing of a photo-detecting element mount 5 with electrode pins 10 and 11 of a header, is provided at the photo-detecting element mount 5, and a photodetecting element 2 is previously mounted at a required position on the mount 5, whereby the position alignment of the photodetecting element with a laser 1 is accomplished. Therefore, a die-bonding and a wire-bonding of the photo-detecting element 2 to the mount 5 are performed independently of the header 3, so that the workability is not deteriorated and a coupling efficiency between the laser 1 and the photo-detecting element 2 is not sacrificed by a mount component of the laser. By these processes, not only a wire-bonding operation can be done between parallel planes but also the connection of an electrode and position alignment and fixing of the mount 5 can be accomplished at the same time through using a solder 22 of a conductive material.