JPS6459842A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS6459842A
JPS6459842A JP62216852A JP21685287A JPS6459842A JP S6459842 A JPS6459842 A JP S6459842A JP 62216852 A JP62216852 A JP 62216852A JP 21685287 A JP21685287 A JP 21685287A JP S6459842 A JPS6459842 A JP S6459842A
Authority
JP
Japan
Prior art keywords
semiconductor element
radiators
film tape
faces
screws
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62216852A
Other languages
Japanese (ja)
Other versions
JPH0715962B2 (en
Inventor
Kenzo Hatada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP62216852A priority Critical patent/JPH0715962B2/en
Publication of JPS6459842A publication Critical patent/JPS6459842A/en
Publication of JPH0715962B2 publication Critical patent/JPH0715962B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Abstract

PURPOSE:To make a semiconductor device small-sized by a method wherein radiators are formed on both faces of a semiconductor element in order to enhance heat-dissipating efficiency. CONSTITUTION:A semiconductor element 1 is mounted on a film tape 12; a cutout hole is made in a position where the semiconductor element 1 is to be mounted. A group of leads protruding at this hole are bonded to electrodes of the semiconductor element 1. A terminal lead 13 used to take out an input/ output signal of the semiconductor element 1 is formed at one end of the film tape 12. Recessed parts 14, 15 which coincide with the semiconductor element 1 and the film tape 12 are formed in radiators 10, 11. First, both faces of the film tape 12 where the semiconductor element 1 is mounted, i.e. both faces of the semiconductor element 1, are sandwiched between the radiators 10, 11; the radiators 10 and 11 are fixed by using screws 16. Then, L-shaped jigs 17, 18 used to fix the radiators to a circuit board are fixed to the radiators 10, 11 by using screws 19.
JP62216852A 1987-08-31 1987-08-31 Semiconductor device Expired - Fee Related JPH0715962B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62216852A JPH0715962B2 (en) 1987-08-31 1987-08-31 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62216852A JPH0715962B2 (en) 1987-08-31 1987-08-31 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS6459842A true JPS6459842A (en) 1989-03-07
JPH0715962B2 JPH0715962B2 (en) 1995-02-22

Family

ID=16694916

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62216852A Expired - Fee Related JPH0715962B2 (en) 1987-08-31 1987-08-31 Semiconductor device

Country Status (1)

Country Link
JP (1) JPH0715962B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5109318A (en) * 1990-05-07 1992-04-28 International Business Machines Corporation Pluggable electronic circuit package assembly with snap together heat sink housing
US5449587A (en) * 1988-12-15 1995-09-12 Mitsui Toatsu Chemicals, Incorporated Compact disk-write once type optical recording media
US6233150B1 (en) * 1998-12-28 2001-05-15 Foxconn Precision Components Co., Ltd. Memory module assembly
DE10244791A1 (en) * 2002-09-26 2004-04-15 Robert Bosch Gmbh Electronic power component cooling device, has heat-sink provided with metal-filled channels for conducting signals of component to external environment

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5449587A (en) * 1988-12-15 1995-09-12 Mitsui Toatsu Chemicals, Incorporated Compact disk-write once type optical recording media
US5109318A (en) * 1990-05-07 1992-04-28 International Business Machines Corporation Pluggable electronic circuit package assembly with snap together heat sink housing
US6233150B1 (en) * 1998-12-28 2001-05-15 Foxconn Precision Components Co., Ltd. Memory module assembly
DE10244791A1 (en) * 2002-09-26 2004-04-15 Robert Bosch Gmbh Electronic power component cooling device, has heat-sink provided with metal-filled channels for conducting signals of component to external environment
DE10244791B4 (en) * 2002-09-26 2009-03-26 Robert Bosch Gmbh Device for cooling electronic components

Also Published As

Publication number Publication date
JPH0715962B2 (en) 1995-02-22

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees