JPS6475682A - Method for replenishing copper to chemical copper plating liquid - Google Patents
Method for replenishing copper to chemical copper plating liquidInfo
- Publication number
- JPS6475682A JPS6475682A JP23230187A JP23230187A JPS6475682A JP S6475682 A JPS6475682 A JP S6475682A JP 23230187 A JP23230187 A JP 23230187A JP 23230187 A JP23230187 A JP 23230187A JP S6475682 A JPS6475682 A JP S6475682A
- Authority
- JP
- Japan
- Prior art keywords
- chamber
- copper
- anode
- plating
- ions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1617—Purification and regeneration of coating baths
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23230187A JPS6475682A (en) | 1987-09-18 | 1987-09-18 | Method for replenishing copper to chemical copper plating liquid |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23230187A JPS6475682A (en) | 1987-09-18 | 1987-09-18 | Method for replenishing copper to chemical copper plating liquid |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6475682A true JPS6475682A (en) | 1989-03-22 |
Family
ID=16937067
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23230187A Pending JPS6475682A (en) | 1987-09-18 | 1987-09-18 | Method for replenishing copper to chemical copper plating liquid |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6475682A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2721309A1 (fr) * | 1994-06-21 | 1995-12-22 | Centre Nat Rech Scient | Procédé et dispositif de diffusion d'ions cuivriques pour le traitement d'un milieu liquide salé. |
-
1987
- 1987-09-18 JP JP23230187A patent/JPS6475682A/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2721309A1 (fr) * | 1994-06-21 | 1995-12-22 | Centre Nat Rech Scient | Procédé et dispositif de diffusion d'ions cuivriques pour le traitement d'un milieu liquide salé. |
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