JPS6473724A - Fixation of wafer - Google Patents

Fixation of wafer

Info

Publication number
JPS6473724A
JPS6473724A JP62229584A JP22958487A JPS6473724A JP S6473724 A JPS6473724 A JP S6473724A JP 62229584 A JP62229584 A JP 62229584A JP 22958487 A JP22958487 A JP 22958487A JP S6473724 A JPS6473724 A JP S6473724A
Authority
JP
Japan
Prior art keywords
wafer
specimen base
base
specimen
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62229584A
Other languages
Japanese (ja)
Other versions
JP2555093B2 (en
Inventor
Seitaro Oishi
Toshiaki Takemoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP62229584A priority Critical patent/JP2555093B2/en
Publication of JPS6473724A publication Critical patent/JPS6473724A/en
Application granted granted Critical
Publication of JP2555093B2 publication Critical patent/JP2555093B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Jigs For Machine Tools (AREA)
  • Drying Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE:To enable the bonding and cleaning up time of wafers to be cut down by a method wherein a central hole for drawing a vacuum, cooling water inlet and outlet encircling the hole are provided in a specimen base holding a wafer while a wafer is attracted to the specimen base through the intermediary of a heat sink made of a flexible graphite sheet. CONSTITUTION:A hole (a) for drawing a vacuum vertically passing through a specimen base 2 is made in the central position of the base 2 while a cooling water reservoir with downward water inlet (b) and outlet (c) is provided inside the surface side of the specimen base 2. When such a specimen base 2 is structured and a wafer 1 is attracted thereto, a heat sink made of a flexible graphite sheet is laid between the wafer 1 and the specimen base 2 and then the peripheral part of wafer 1 is tightened by metallic fixtures 3 with fixing bolts 4 provided on the sides of the specimen base 2. By the application of such a jig to an ion beam processor, the quality of device can be unified eliminating the dispersion in the quality due to the personal difference in skill level.
JP62229584A 1987-09-16 1987-09-16 Wafer fixing device Expired - Fee Related JP2555093B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62229584A JP2555093B2 (en) 1987-09-16 1987-09-16 Wafer fixing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62229584A JP2555093B2 (en) 1987-09-16 1987-09-16 Wafer fixing device

Publications (2)

Publication Number Publication Date
JPS6473724A true JPS6473724A (en) 1989-03-20
JP2555093B2 JP2555093B2 (en) 1996-11-20

Family

ID=16894473

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62229584A Expired - Fee Related JP2555093B2 (en) 1987-09-16 1987-09-16 Wafer fixing device

Country Status (1)

Country Link
JP (1) JP2555093B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6012509A (en) * 1996-06-04 2000-01-11 Tokyo Electron Limited Mechanism and method for holding a substrate on a substrate stage of a substrate treatment apparatus
JP2007288101A (en) * 2006-04-20 2007-11-01 Tokyo Seimitsu Co Ltd Prober, wafer holding method therein, and highly thermally conductive sheet

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53106576A (en) * 1977-02-28 1978-09-16 Nec Corp Ion etching device
JPS58137225A (en) * 1982-02-09 1983-08-15 Anelva Corp Substrate loading/unloading mechanism

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53106576A (en) * 1977-02-28 1978-09-16 Nec Corp Ion etching device
JPS58137225A (en) * 1982-02-09 1983-08-15 Anelva Corp Substrate loading/unloading mechanism

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6012509A (en) * 1996-06-04 2000-01-11 Tokyo Electron Limited Mechanism and method for holding a substrate on a substrate stage of a substrate treatment apparatus
JP2007288101A (en) * 2006-04-20 2007-11-01 Tokyo Seimitsu Co Ltd Prober, wafer holding method therein, and highly thermally conductive sheet

Also Published As

Publication number Publication date
JP2555093B2 (en) 1996-11-20

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees