JPS6471137A - Tablet for sealing semiconductor with resin and method of sealing semiconductor resin using said tablet - Google Patents
Tablet for sealing semiconductor with resin and method of sealing semiconductor resin using said tabletInfo
- Publication number
- JPS6471137A JPS6471137A JP62228832A JP22883287A JPS6471137A JP S6471137 A JPS6471137 A JP S6471137A JP 62228832 A JP62228832 A JP 62228832A JP 22883287 A JP22883287 A JP 22883287A JP S6471137 A JPS6471137 A JP S6471137A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- tablet
- piston
- cylinder
- air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
PURPOSE:To prevent mixing into an IC of air among particles when the IC is sealed by housing a solid resin into a vacuum vessel under a vacuum, deaerating air among particles and heating and compressing the solid resin at a self welding temperature. CONSTITUTION:A heater 31 is conducted and a tablet molding machine 32 is heated at a temperature lower than the welding temperature of a powdered resin 33, and the resin 33 is injected into a cylinder 20 for the molding machine 32. The position of a piston 25 is adjusted, an exhaust valve 27 is moved downward, a vacuum pump 23 is operated, air in a cylinder chamber A and a vacuum introducing chamber B is exhausted, and each chamber A, B is evacuated. The resin 33 is compressed by the exhaust valve 27, the piston 25 and the cylinder 20. A fusion layer 35 is shaped around the resin 33 by the pressure and temperature of the resin by the resin 33 from sections brought into contact with the cylinder 20, the piston 25 and the exhaust valve 27. A cover 21 is removed, the piston 25 is elevated, and a completed tablet 36 is extracted. Accordingly, the tablet capable of preventing mixing into an IC of air among particles is acquired.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62228832A JPH0713983B2 (en) | 1987-09-10 | 1987-09-10 | Tablet for semiconductor resin encapsulation and semiconductor resin encapsulation method using the same |
| US07/107,336 US4826931A (en) | 1986-10-09 | 1987-10-09 | Tablet for resin-molding semiconductor devices |
| US07/271,905 US4963307A (en) | 1986-10-09 | 1988-11-16 | Method for producing a tablet for resin-molding semiconductor devices and resin-molding method making use of the tablet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62228832A JPH0713983B2 (en) | 1987-09-10 | 1987-09-10 | Tablet for semiconductor resin encapsulation and semiconductor resin encapsulation method using the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6471137A true JPS6471137A (en) | 1989-03-16 |
| JPH0713983B2 JPH0713983B2 (en) | 1995-02-15 |
Family
ID=16882556
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62228832A Expired - Lifetime JPH0713983B2 (en) | 1986-10-09 | 1987-09-10 | Tablet for semiconductor resin encapsulation and semiconductor resin encapsulation method using the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0713983B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03178405A (en) * | 1989-08-11 | 1991-08-02 | Hitachi Chem Co Ltd | Manufacture of tablet of thermosetting resin molding material for sealing semi conductor |
| JPH03236919A (en) * | 1990-02-15 | 1991-10-22 | Matsushita Electric Works Ltd | Preheating device for thermosetting resin molding material |
| JP2010162710A (en) * | 2009-01-13 | 2010-07-29 | Sumitomo Heavy Ind Ltd | Resin sealing device and resin sealing method |
| JP2011037031A (en) * | 2009-08-06 | 2011-02-24 | Sumitomo Heavy Ind Ltd | Resin sealing device and resin sealing method |
| WO2019189464A1 (en) * | 2018-03-29 | 2019-10-03 | 日立化成株式会社 | Method for manufacturing molded article, and method for manufacturing electronic component device |
-
1987
- 1987-09-10 JP JP62228832A patent/JPH0713983B2/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03178405A (en) * | 1989-08-11 | 1991-08-02 | Hitachi Chem Co Ltd | Manufacture of tablet of thermosetting resin molding material for sealing semi conductor |
| JPH03236919A (en) * | 1990-02-15 | 1991-10-22 | Matsushita Electric Works Ltd | Preheating device for thermosetting resin molding material |
| JP2010162710A (en) * | 2009-01-13 | 2010-07-29 | Sumitomo Heavy Ind Ltd | Resin sealing device and resin sealing method |
| JP2011037031A (en) * | 2009-08-06 | 2011-02-24 | Sumitomo Heavy Ind Ltd | Resin sealing device and resin sealing method |
| WO2019189464A1 (en) * | 2018-03-29 | 2019-10-03 | 日立化成株式会社 | Method for manufacturing molded article, and method for manufacturing electronic component device |
| JP6648868B1 (en) * | 2018-03-29 | 2020-02-14 | 日立化成株式会社 | Method for manufacturing molded article and method for manufacturing electronic component device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0713983B2 (en) | 1995-02-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313111 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080215 Year of fee payment: 13 |