JPH0716950B2 - Tablet manufacturing method - Google Patents

Tablet manufacturing method

Info

Publication number
JPH0716950B2
JPH0716950B2 JP61106069A JP10606986A JPH0716950B2 JP H0716950 B2 JPH0716950 B2 JP H0716950B2 JP 61106069 A JP61106069 A JP 61106069A JP 10606986 A JP10606986 A JP 10606986A JP H0716950 B2 JPH0716950 B2 JP H0716950B2
Authority
JP
Japan
Prior art keywords
molding
processing means
temperature
tablet
molded body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61106069A
Other languages
Japanese (ja)
Other versions
JPS62261405A (en
Inventor
国人 酒井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP61106069A priority Critical patent/JPH0716950B2/en
Publication of JPS62261405A publication Critical patent/JPS62261405A/en
Publication of JPH0716950B2 publication Critical patent/JPH0716950B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B11/00—Making preforms
    • B29B11/06—Making preforms by moulding the material
    • B29B11/12—Compression moulding

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は半導体集積回路等（以下ICと記す）を封止す
る樹脂からなるタブレツトの製造方法の改良に関するも
のである。TECHNICAL FIELD The present invention relates to an improvement in a method for manufacturing a tablet made of a resin for encapsulating a semiconductor integrated circuit or the like (hereinafter referred to as an IC).

〔従来の技術〕[Conventional technology]

第５図ないし第７図は、例えば特開昭59−139633号公報
に示された従来の真空タブレツト成形機および成形物を
示す断面図で、図において、（１）は主にエポキシ樹脂
と無機質充てん剤の混合物粒子である粉末樹脂、（２）
はシリンダ、（３）は粉末樹脂（１）を圧縮するための
ピストン、（４）はこのピストン（３）外周とシリンダ
（２）内周とを封止するピストンリング、（５）はピス
トン（３）で圧縮された後に、後述するタブレツト
（６）をシリンダ（２）外へ押出すための圧送ピスト
ン、（７）はこの圧送ピストン（６）外周とシリンダ
（２）内周との間を封止するピストンリング、（８）は
粉末樹脂（１）をシリンダ（２）内へ注入するためのホ
ツパ、（９）はシリンダ（２）内に排気口（10）を介し
て真空を導入する真空ポンプ、（６）は粉末樹脂を圧縮
硬化して成形された軟化温度が80℃〜100℃のタブレツ
トで円柱状に成形されている。（11）は粉末樹脂（４）
の粒子部分における粒子間の粒子空間、（12）はタブレ
ツト（６）中の粒子空間（11）に含まれる粒子間空気で
ある。5 to 7 are sectional views showing a conventional vacuum tablet molding machine and a molded product disclosed in, for example, JP-A-59-139633, in which (1) is mainly an epoxy resin and an inorganic material. Powder resin, which is a mixture particle of filler, (2)
Is a cylinder, (3) is a piston for compressing the powdered resin (1), (4) is a piston ring that seals the outer circumference of the piston (3) and the inner circumference of the cylinder (2), and (5) is a piston ( After being compressed in 3), a pressure-feeding piston for pushing out a tablet (6) described later to the outside of the cylinder (2), and (7) between the outer circumference of this pressure-feeding piston (6) and the inner circumference of the cylinder (2). A piston ring for sealing, (8) a hopper for injecting the powdered resin (1) into the cylinder (2), and (9) introducing a vacuum into the cylinder (2) through an exhaust port (10). The vacuum pump (6) is formed into a cylindrical shape with a tablet having a softening temperature of 80 ° C to 100 ° C formed by compressing and hardening powder resin. (11) is powder resin (4)
The particle space (12) between the particles in the particle portion of (1) is the air between particles contained in the particle space (11) in the tablet (6).

次にタブレツトの製造工程について説明する。まず、ピ
ストン（３）をホツパ（８）の位置よりも後方に位置さ
せて、必要量計量した粉末樹脂（１）をホツパ（８）に
注入し、シリンダ（２）内へ粉末樹脂（１）を挿入す
る。次にピストン（３）を第６図のようにホツパ（８）
の位置よりも前方に位置させて停止させ、真空ポンプ
（９）を運転させる。この真空ポンプ（９）の運転によ
つてシリンダ（２）内の空気や、粉末樹脂（１）内に存
在する空気が外部へ排気され、シリンダ（２）内や粉末
樹脂（１）の粒子間が真空にされる。ここで、再びピス
トン（20）を前進させ、粉末樹脂（１）を1000kg/cm2程
度の圧力で圧縮する。この圧力で粉末樹脂（１）は粒子
の間の粒子空間（11）が押しつぶされ、粒子間の粒子空
間（11）が極めて小となる。シリンダ（２）内は真空状
態であるため、粒子間空気（12）も外部へ排気され、粒
子空間（11）もシリンダ（２）内も真空状態で維持さ
れ、粉末樹脂（１）の粒子空間（11）には空気は全く、
存在せず、真空状態のタブレツト（６）が成形される。Next, the manufacturing process of the tablet will be described. First, the piston (3) is positioned rearward of the position of the hopper (8), and the powder resin (1) measured in a necessary amount is injected into the hopper (8), and the powder resin (1) is introduced into the cylinder (2). Insert. Next, attach the piston (3) to the hopper (8) as shown in FIG.
The vacuum pump (9) is operated by arranging it in front of the position (1) and stopping it. By the operation of the vacuum pump (9), the air in the cylinder (2) and the air present in the powder resin (1) are exhausted to the outside, and the air in the cylinder (2) and the particles of the powder resin (1) are discharged. Is evacuated. Here, the piston (20) is advanced again, and the powder resin (1) is compressed at a pressure of about 1000 kg / cm 2 . This pressure causes the powder resin (1) to crush the particle spaces (11) between the particles, and the particle spaces (11) between the particles become extremely small. Since the inside of the cylinder (2) is in a vacuum state, the interparticle air (12) is also exhausted to the outside, the inside of the particle space (11) and the inside of the cylinder (2) are maintained in a vacuum state, and the particle space of the powdered resin (1) is maintained. There is no air in (11),
The absent, vacuum tablet (6) is molded.

〔発明が解決しようとする問題点〕[Problems to be solved by the invention]

従来のタブレツトの製造方法では、タブレツトには真空
状態では全く空気が存在することがないが、タブレツト
は固形粉末を機械的に圧縮することにより粒子間が密着
しているだけであり、このタブレツトを大気中に取り出
した場合、内部の粒子空間と外部の粒子空間とが小さな
隙間で連通しているため、内部の粒子空間に直ちに空気
が侵入し、ICをこのタブレツトで封止した場合、ICの内
部に粒子間空気が混入し、ICの内部や表面にボイドが発
生し、ICの製造歩留りが低下するという問題点があつ
た。In the conventional method for manufacturing a tablet, air does not exist at all in the vacuum state in the tablet, but the tablet only adheres between the particles by mechanically compressing the solid powder. When taken out into the atmosphere, the internal particle space and the external particle space communicate with each other through a small gap, so air immediately enters the internal particle space, and if the IC is sealed with this tablet, the There is a problem that interparticle air is mixed inside and voids are generated inside or on the surface of the IC, which reduces the manufacturing yield of the IC.

この発明は上記のような問題点を解消するためになされ
たもので、ICの封止時に粒子間空気がICの内部に混入す
ることを防止できるタブレツトの製造方法を得ることを
目的とする。The present invention has been made to solve the above problems, and an object of the present invention is to obtain a method for manufacturing a tablet that can prevent interparticle air from being mixed into the inside of an IC when the IC is sealed.

〔問題点を解決するための手段〕[Means for solving problems]

この発明に係るタブレットの製造方法は、加熱手段を備
え粉末状または粒状の成形用樹脂を真空中で加圧成形す
る加工手段を、成形用樹脂の軟化温度よりも低いがこの
軟化温度に近接する温度に昇温する工程と、成形用樹脂
を加工手段に投入する工程と、加工手段を真空吸引する
工程と、加工手段に投入された成形用樹脂を成形体に加
圧成形し、この成形体の内部が密封されるように成形時
の加圧状態でかつ加工手段の上記温度で成形体の外周表
面層が自己融着するまで保持する工程と、を備えたもの
である。In the tablet manufacturing method according to the present invention, the processing means, which is provided with a heating means and press-molds the powdery or granular molding resin in a vacuum, is close to the softening temperature of the molding resin, although it is lower than the softening temperature. A step of raising the temperature to a temperature, a step of introducing the molding resin into the processing means, a step of vacuum suction of the processing means, and a pressure molding of the molding resin introduced into the processing means into a molded body. And a step of holding the outer peripheral surface layer of the molded body in a pressurized state at the time of molding so as to seal the inside of the molded body and at the above temperature of the processing means until the outer peripheral surface layer of the molded body is self-fused.

また、粉末状または粒状の成形用樹脂を、この成形用樹
脂の軟化温度よりも低いがこの軟化温度に近接する温度
に昇温する工程と、昇温された成形用樹脂を、真空中で
加圧成形する加工手段に投入する工程と、加工手段を真
空吸引する工程と、成形用樹脂を脱気し加工手段で成形
体に加圧成形するとともにこの成形体の内部が密封され
るようにその外周表面層が自己融着するまで加圧保持す
る工程と、を備えたものである。In addition, a step of heating the powdery or granular molding resin to a temperature lower than the softening temperature of the molding resin but close to the softening temperature, and heating the molding resin in a vacuum. The step of introducing into the processing means for pressure molding, the step of vacuum suction of the processing means, the degassing of the molding resin and the pressure molding into a molded body by the processing means, and the inside of this molded body being sealed A step of pressurizing and holding until the outer peripheral surface layer is self-fused.

〔作用〕[Action]

この発明におけるタブレツトの製造方法は、真空容器内
に真空下で収容された粉状又は粒状の半導体封止用樹脂
が真空容器内で加熱圧縮されて粒子間が融着され、粒子
間空気が除去された状態で維持される。The method for producing a tablet according to the present invention is a powdery or granular semiconductor encapsulating resin housed under vacuum in a vacuum container, which is heated and compressed in the vacuum container to fuse particles to each other and remove interparticle air. Is maintained in the state in which it was maintained.

〔実施例〕〔Example〕

以下、この発明の一実施例を図について説明する。第１
図ないし第４図において、（20）はシリンダ室（Ａ）を
有するシリンダ、（21）はこのシリンダ（20）にボルト
（22）を介して結合された上部カバーで、弁座（21a）
と真空導入室（Ｂ）を有している。（23）は真空導入室
（Ｂ）に排気口（24）を介して真空を導入する真空ポン
プ、（25）はシリンダ（20）内を摺動するピストン、
（26）はピストン（25）とシリンダ（20）間を封止する
ピストンリング、（27）は弁座（21a）に離接する排気
弁、（28）はこの排気弁（27）と弁座（21a）間を封止
する弁リング、（29）は排気弁（27）と上部カバー（2
1）との間を封止する排気リング、（30）はシリンダ（2
0）と上部カバー（21）とを封止する封止リング、（3
1）はシリンダ（20）の外周に配置され、シリンダ（2
0）等を加熱するヒータ、（32）は上記のシリンダ（2
0），上部カバー（21），ピストン（25）等により構成
されるタブレツト成形機、（33）は直径が0.1〜2mmの粒
子が混合された軟化温度が80℃〜100℃の粉末樹脂、（3
4）は粉末樹脂（33）の粒子相互間の接触海面に形成さ
れる粒子空間、（35）は粉末樹脂（33）の外周部がタブ
レツト成形機（32）の熱により自己融着された融着層、
（36）はタブレツトである。An embodiment of the present invention will be described below with reference to the drawings. First
In FIGS. 4 to 4, (20) is a cylinder having a cylinder chamber (A), (21) is an upper cover connected to the cylinder (20) via bolts (22), and has a valve seat (21a).
And a vacuum introduction chamber (B). (23) is a vacuum pump that introduces a vacuum into the vacuum introducing chamber (B) through the exhaust port (24), (25) is a piston that slides in the cylinder (20),
(26) is a piston ring that seals between the piston (25) and the cylinder (20), (27) is an exhaust valve that contacts and separates from the valve seat (21a), and (28) is this exhaust valve (27) and valve seat ( 21a) a valve ring that seals between the two, (29) an exhaust valve (27) and an upper cover (2
Exhaust ring that seals between (1) and (30) is cylinder (2
0) and the upper cover (21) for sealing the sealing ring, (3
1) is arranged on the outer circumference of the cylinder (20) and the cylinder (2
(32) is a heater for heating (0) etc.
0), an upper cover (21), a piston (25), and the like, a tablet molding machine (33) is a powder resin having a softening temperature of 80 ° C to 100 ° C mixed with particles having a diameter of 0.1 to 2 mm, ( 3
4) is a particle space formed on the sea surface where the particles of the powder resin (33) are in contact with each other, and (35) is a fusion product in which the outer periphery of the powder resin (33) is self-bonded by the heat of the tablet molding machine (32). Layering,
(36) is a tablet.

次に動作について説明する。まず、第１図のようにヒー
タ（31）に通電してタブレツト成形機（32）を粒末樹脂
（33）の融着温度よりも低い温度60℃に加温し、このタ
ブレツト成形機（32）のシリンダ（20）内に粉末樹脂
（33）を注入し、第２図のようにシリンダ（20）と上部
カバー（21）とをボルト（22）で結合して密閉する。次
に、ピストン（25）の位置調整した後、排気弁（27）を
下方に動かし、弁座（21a）と排気弁（27）とを十分に
開放し、真空ポンプ（23）を運転し、シリンダ室（Ａ）
及び真空導入室（Ｂ）の空気を排気口（24）を介して排
気し、各室（Ａ）（Ｂ）を真空にする。次に、この真空
度は２〜３秒程度で0.5Torr以下になるので、排気弁（2
7）を上方向へ変位させて弁リング（28）で排気弁（2
7）と上部カバー（21）の弁座（21a）とを封止させ、シ
リンダ室（Ａ）内を真空保持する。ここで、第３図のよ
うにピストン（25）を上方に移動させ、排気弁（27）と
ピストン（25）とシリンダ（20）とで粉末樹脂（33）を
1000kg/cm2程度の圧力で圧縮する。粉末樹脂（33）にで
きていた粒子空間（34）はこの圧力によつて小となる
が、例えば外部の粒子空間とは連通している。ところ
が、圧縮を10秒以上継続すると、シリンダ（20），ピス
トン（25），排気弁（27）に接触している部分から粉末
樹脂（33）がこの圧力と温度によつて、第４図のように
周囲に融着層（35）が形成される。次に、上部カバー
（21）を取りはずしてピストン（25）を上昇させ、完成
したタブレツト（36）を取り出す。このように、タブレ
ツト（36）の外周には融着層（35）が形成されているた
め、内部の粒子空間（34）は真空状態で維持される。こ
のタブレツト（36）をIC封止用として用いた場合には、
IC封入時に粒子間空気がICに混入することが防止され、
ICの内部や表面にボイドが発生することが防止されるこ
とになる。Next, the operation will be described. First, as shown in FIG. 1, the heater (31) is energized to heat the tablet molding machine (32) to a temperature of 60 ° C. lower than the fusion temperature of the powdered resin (33), and the tablet molding machine (32) is heated. ) The powder resin (33) is injected into the cylinder (20), and the cylinder (20) and the upper cover (21) are connected with the bolt (22) and sealed as shown in FIG. Next, after adjusting the position of the piston (25), the exhaust valve (27) is moved downward, the valve seat (21a) and the exhaust valve (27) are sufficiently opened, and the vacuum pump (23) is operated, Cylinder chamber (A)
Also, the air in the vacuum introducing chamber (B) is exhausted through the exhaust port (24) to make each chamber (A) (B) a vacuum. Next, since the degree of vacuum becomes 0.5 Torr or less in about 2 to 3 seconds, the exhaust valve (2
7) is displaced upwards and the exhaust valve (2
7) and the valve seat (21a) of the upper cover (21) are sealed, and the inside of the cylinder chamber (A) is maintained in vacuum. Here, as shown in FIG. 3, the piston (25) is moved upward so that the exhaust valve (27), the piston (25) and the cylinder (20) remove the powder resin (33).
Compress at a pressure of about 1000 kg / cm 2 . The particle space (34) formed in the powder resin (33) becomes small due to this pressure, but communicates with the external particle space, for example. However, when the compression is continued for 10 seconds or more, the powder resin (33) from the portion in contact with the cylinder (20), the piston (25), and the exhaust valve (27) is affected by this pressure and temperature, as shown in FIG. Thus, the fusing layer (35) is formed around the periphery. Next, the upper cover (21) is removed, the piston (25) is raised, and the completed tablet (36) is taken out. Thus, since the fusion bonding layer (35) is formed on the outer periphery of the tablet (36), the internal particle space (34) is maintained in a vacuum state. When this tablet (36) is used for IC encapsulation,
Air between particles is prevented from entering the IC when the IC is sealed,
This will prevent the generation of voids inside or on the surface of the IC.

なお、上記実施例では、室温の粉末樹脂（33）を加温さ
れたシリンダ（20）に注入するもので説明したが、特に
これに限定されるものではなく、例えば、投入する粉末
樹脂（33）の温度を自己融着温度まで加温し、その後シ
リンダ（20）内に投入して圧縮する工程でも同様の効果
が得られる。In addition, in the above-mentioned embodiment, the powder resin (33) at room temperature is injected into the heated cylinder (20), but the present invention is not particularly limited to this. The same effect can be obtained in the step of heating the temperature of (1) to the self-fusion temperature and then charging the same in the cylinder (20) and compressing.

また、上記実施例では、融着層（35）をタブレツト（3
6）の外周部のみに形成するもので説明したが、自己融
着温度で粉末樹脂（33）を加圧すれば良く、例えば融着
層（35）が全周であつても、内部まで形成されても良
く、更には、部分的に形成された場合でも効果を奏する
ものである。Further, in the above embodiment, the fusing layer (35) is formed into a tablet (3
Although it has been explained that it is formed only on the outer peripheral part of 6), the powder resin (33) may be pressurized at the self-bonding temperature. For example, even if the fusion layer (35) is the entire circumference, it is formed to the inside. It may be carried out, and further, even if it is partially formed, it is effective.

また、粒子の直径が0.1〜2mmの粉末樹脂で説明したが、
この粒子はこの寸法よりも大であつてもよく、また、そ
の形状は特に限定するものではない。In addition, although the diameter of the particles was explained with the powder resin of 0.1 to 2 mm,
The particles may be larger than this size, and their shape is not particularly limited.

〔発明の効果〕〔The invention's effect〕

以上のようにこの発明は、加工手段を成形用樹脂の軟化
温度よりも低いがこの軟化温度に近接する温度に昇温
し、加工手段に投入された成形用樹脂を真空中で成形体
に加圧成形し、この成形体の内部が密封されるように成
形時の加圧状態でかつ加工手段の上記温度で成形体の外
周表面層が自己融着するまで保持する、また、成形用樹
脂を、成形用趣旨の軟化温度よりも低いがこの軟化温度
に近接する温度に昇温し、この昇温された成形用樹脂
を、加工手段に投入し、真空中で成形用樹脂を脱気し成
形体に加圧成形するとともにこの成形体の内部が密封さ
れるようにその外周表面層が自己融着するまで加圧保持
するようにしたので、タブレツトの全周に融着層が形成
され、タブレツトの内部を外気から遮断でき、タブレツ
トの内部の粒子間が脱気されたままの真空状態で維持さ
れ、成形後のタブレツトを長期間空気中に放置しても、
空気の侵入を防止できることになり、ICの封止時に封止
樹脂内に空気が混入することが防止され、ICの内部や表
面にボイドが発生することを防止でき、ICの信頼性向上
や外観不良の発生を確実に防止できる効果がある。As described above, according to the present invention, the processing means is heated to a temperature lower than the softening temperature of the molding resin but close to this softening temperature, and the molding resin introduced into the processing means is applied to the molded body in a vacuum. It is pressure-molded, and is held in a pressurized state at the time of molding so that the inside of the molded body is hermetically sealed and at the above-mentioned temperature of the processing means until the outer peripheral surface layer of the molded body is self-fused. , Which is lower than the softening temperature for the purpose of molding but is heated to a temperature close to this softening temperature, and the heated molding resin is put into a processing means, and the molding resin is degassed in a vacuum and molded. Since the outer peripheral surface layer is pressed and held so that the inside of this molded body is sealed so that the inside of this molded body is hermetically sealed, a fusion layer is formed on the entire circumference of the tablet. The inside of the tablet can be shut off from the outside air, and the particles inside the tablet can be removed. Is maintained in a vacuum state of being, even on standing tablet after molding a long time in the air,
This will prevent air from entering, preventing air from entering the encapsulation resin during IC encapsulation, and preventing voids from forming inside or on the surface of the IC. This has the effect of reliably preventing the occurrence of defects.

【図面の簡単な説明】[Brief description of drawings]

第１図はこの発明の一実施例を示す断面図、第２図はそ
の動作工程を示す断面図、第３図は他の動作工程を示す
断面図、第４図はこの発明により成形されたタブレツト
を示す断面図、第５図は従来装置の断面図、第６図は第
５図の動作工程を示す断面図、第７図は従来のタブレツ
トを示す断面図である。図中、（20）はシリンダ、（2
1）は上部カバー、（23）は真空ポンプ、（25）はピス
トン、（31）はヒータ、（33）は粉末樹脂、（36）はタ
ブレツトである。 なお、各図中同一符号は同一又は相当部分を示す。FIG. 1 is a sectional view showing an embodiment of the present invention, FIG. 2 is a sectional view showing its operating process, FIG. 3 is a sectional view showing other operating process, and FIG. 4 is molded by the present invention. FIG. 5 is a sectional view showing a tablet, FIG. 5 is a sectional view of a conventional apparatus, FIG. 6 is a sectional view showing an operation step of FIG. 5, and FIG. 7 is a sectional view showing a conventional tablet. In the figure, (20) is the cylinder, (2
1) is an upper cover, (23) is a vacuum pump, (25) is a piston, (31) is a heater, (33) is powder resin, and (36) is a tablet. In the drawings, the same reference numerals indicate the same or corresponding parts.

Claims (3)

【特許請求の範囲】[Claims] 【請求項１】加熱手段を備え粉末状または粒状の成形用
樹脂を真空中で加圧成形する加工手段を、上記加熱手段
を用い上記成形用樹脂の軟化温度よりも低いがこの軟化
温度に近接する温度に昇温する工程と、 上記成形用樹脂を上記加工手段に投入する工程と、 上記加工手段を真空吸引する工程と、 上記加工手段に投入された上記成形用樹脂を成形体に加
圧成形し、この成形体の内部が密封されるように成形時
の加圧状態でかつ加工手段の上記温度で上記成形体の外
周表面層が自己融着するまで保持する工程と、 を備えたタブレットの製造方法。1. A processing means comprising a heating means for press-molding a powdery or granular molding resin in a vacuum, wherein the heating means is used, but is lower than the softening temperature of the molding resin but close to the softening temperature. Temperature, the step of charging the molding resin into the processing means, the step of vacuum suction of the processing means, and the molding resin charged into the processing means being pressed against the molded body. A tablet comprising a step of molding and holding the molded body in a pressurized state at the time of molding so that the inside of the molded body is sealed and at the temperature of the processing means until the outer peripheral surface layer of the molded body self-bonds. Manufacturing method. 【請求項２】上記成形体が自己融着するのは外周表面層
のみであることを特徴とする特許請求の範囲第１項記載
のタブレットの製造方法。2. The method for producing a tablet according to claim 1, wherein the molded body is self-fused only on the outer peripheral surface layer. 【請求項３】粉末状または粒状の成形用樹脂を、この成
形用樹脂の軟化温度よりも低いがこの軟化温度に近接す
る温度に昇温する工程と、 上記温度に昇温された上記成形用樹脂を、真空中で加圧
成形する加工手段に投入する工程と、 上記加工手段を真空吸引する工程と、 上記温度に昇温された上記成形用樹脂を脱気し上記加工
手段で成形体に加圧成形するとともにこの成形体の内部
が密封されるようにその外周表面層が自己融着するまで
加圧保持する工程と、 を備えたタブレットの製造方法。3. A step of raising the powdery or granular molding resin to a temperature lower than the softening temperature of the molding resin but close to the softening temperature, and the molding temperature raised to the above temperature. A step of introducing the resin into a processing means for press-molding in vacuum, a step of sucking the processing means in vacuum, and a step of degassing the molding resin heated to the above temperature to form a molded body by the processing means. A method of manufacturing a tablet comprising: a step of pressure-molding, and a step of pressurizing and holding until the outer peripheral surface layer self-bonds so that the inside of the molded body is sealed.
JP61106069A 1986-05-07 1986-05-07 Tablet manufacturing method Expired - Lifetime JPH0716950B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61106069A JPH0716950B2 (en) 1986-05-07 1986-05-07 Tablet manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61106069A JPH0716950B2 (en) 1986-05-07 1986-05-07 Tablet manufacturing method

Publications (2)

Publication Number Publication Date
JPS62261405A JPS62261405A (en) 1987-11-13
JPH0716950B2 true JPH0716950B2 (en) 1995-03-01

Family

ID=14424309

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61106069A Expired - Lifetime JPH0716950B2 (en) 1986-05-07 1986-05-07 Tablet manufacturing method

Country Status (1)

Country Link
JP (1) JPH0716950B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4826931A (en) * 1986-10-09 1989-05-02 Mitsubishi Denki Kabushiki Kaisha Tablet for resin-molding semiconductor devices
JP2006167953A (en) * 2004-12-13 2006-06-29 Toyo Seiki Seisakusho:Kk Thermocompression bonding method of regenerating synthetic resin and apparatus therefor
JP4569296B2 (en) * 2004-12-28 2010-10-27 住友ベークライト株式会社 Manufacturing method of resin tablet for semiconductor sealing and manufacturing method of resin molding

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5239579A (en) * 1975-09-26 1977-03-26 Hitachi Ltd Production process of solidified pellets from powder and its equipment
JPS5375264A (en) * 1976-12-17 1978-07-04 Hitachi Ltd Tpblet compressing machine
JPS5445364A (en) * 1977-09-19 1979-04-10 Hitachi Ltd Tablet pressing
JPS58145409A (en) * 1982-02-24 1983-08-30 Hitachi Ltd Resin tablet molder
JPS597009A (en) * 1982-07-03 1984-01-14 Toshiba Corp High-density tablet and method of sealing semiconductor with resin using said tablet
JPS59139633A (en) * 1983-12-09 1984-08-10 Hitachi Ltd Resin seal method of electronic part

Also Published As

Publication number Publication date
JPS62261405A (en) 1987-11-13

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