JPS6467986A - Piezoelectric type pressure sensitive element and manufacture thereof - Google Patents

Piezoelectric type pressure sensitive element and manufacture thereof

Info

Publication number
JPS6467986A
JPS6467986A JP22449287A JP22449287A JPS6467986A JP S6467986 A JPS6467986 A JP S6467986A JP 22449287 A JP22449287 A JP 22449287A JP 22449287 A JP22449287 A JP 22449287A JP S6467986 A JPS6467986 A JP S6467986A
Authority
JP
Japan
Prior art keywords
epoxy resin
employed
pressure sensitive
sensitive element
abcm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP22449287A
Other languages
English (en)
Other versions
JP2585018B2 (ja
Inventor
Katsumi Yano
Morihito Nakada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyo Kako Co Ltd
Original Assignee
Toyo Kako Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Kako Co Ltd filed Critical Toyo Kako Co Ltd
Priority to JP22449287A priority Critical patent/JP2585018B2/ja
Priority to DE3819947A priority patent/DE3819947A1/de
Priority to US07/208,062 priority patent/US4826616A/en
Publication of JPS6467986A publication Critical patent/JPS6467986A/ja
Application granted granted Critical
Publication of JP2585018B2 publication Critical patent/JP2585018B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/09—Forming piezoelectric or electrostrictive materials
    • H10N30/092—Forming composite materials
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/48—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zirconium or hafnium oxides, zirconates, zircon or hafnates
    • C04B35/49—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zirconium or hafnium oxides, zirconates, zircon or hafnates containing also titanium oxides or titanates
    • C04B35/491—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zirconium or hafnium oxides, zirconates, zircon or hafnates containing also titanium oxides or titanates based on lead zirconates and lead titanates, e.g. PZT
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/852—Composite materials, e.g. having 1-3 or 2-2 type connectivity

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Organic Insulating Materials (AREA)
JP22449287A 1987-09-08 1987-09-08 圧電型感圧素子及びその製造方法 Expired - Lifetime JP2585018B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP22449287A JP2585018B2 (ja) 1987-09-08 1987-09-08 圧電型感圧素子及びその製造方法
DE3819947A DE3819947A1 (de) 1987-09-08 1988-06-11 Piezoelektrisches druckempfindliches element und verfahren zu dessen herstellung
US07/208,062 US4826616A (en) 1987-09-08 1988-06-17 Piezoelectric pressure-sensitive element and method for making same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22449287A JP2585018B2 (ja) 1987-09-08 1987-09-08 圧電型感圧素子及びその製造方法

Publications (2)

Publication Number Publication Date
JPS6467986A true JPS6467986A (en) 1989-03-14
JP2585018B2 JP2585018B2 (ja) 1997-02-26

Family

ID=16814643

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22449287A Expired - Lifetime JP2585018B2 (ja) 1987-09-08 1987-09-08 圧電型感圧素子及びその製造方法

Country Status (3)

Country Link
US (1) US4826616A (ja)
JP (1) JP2585018B2 (ja)
DE (1) DE3819947A1 (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003064240A (ja) * 2001-08-24 2003-03-05 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物および半導体装置
JP2007089614A (ja) * 2005-09-26 2007-04-12 Inax Corp 型紙および型紙を用いた衛生陶器の施工方法
JP2009299062A (ja) * 2008-06-12 2009-12-24 General Electric Co <Ge> 反強誘電性粒子を含んでなる耐熱ポリマー複合材、並びにその製造方法
US8501027B2 (en) 2004-02-27 2013-08-06 Fujimi Incorporated Polishing composition and polishing method
JP2016060898A (ja) * 2014-09-22 2016-04-25 京セラケミカル株式会社 ２液性注型用エポキシ樹脂組成物、及びコイル部品
JP2016171302A (ja) * 2015-03-09 2016-09-23 株式会社リコー 素子、及び発電装置

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0796607B2 (ja) * 1987-09-07 1995-10-18 富山県 高分子圧電材及びその製造方法
US5194181A (en) * 1988-07-15 1993-03-16 The United States Of America As Represented By The Secretary Of The Navy Process for shaping articles from electrosetting compositions
US5190624A (en) * 1988-07-15 1993-03-02 The United States Of America As Represented By The Secretary Of The Navy Electrorheological fluid chemical processing
US5938978A (en) * 1988-07-15 1999-08-17 The United States Of America As Represented By The Secretary Of The Navy Intermittent programming of electrosettable compositions
GB2237928A (en) * 1989-11-06 1991-05-15 Plessey Co Plc Piezoelectric composite material
US5112934A (en) * 1989-11-27 1992-05-12 The Dow Chemical Company Epoxy polymeric nonolinear optical materials based on glycidyl amines
WO1992005567A1 (en) * 1990-09-19 1992-04-02 Reitz Ronald P Electroset compositions, articles and processes
US5232639A (en) * 1990-09-19 1993-08-03 The United States Of America As Represented By The Secretary Of The Navy Process for forming articles with anisotropic properties
EP0576400B1 (en) * 1992-06-24 1996-09-04 Algra Holding Ag Method of making piezoelectric pressure-sensitive key or keyboard and product of the method
US5702629A (en) * 1996-03-21 1997-12-30 Alliedsignal Inc. Piezeoelectric ceramic-polymer composites
JP3376916B2 (ja) * 1998-05-26 2003-02-17 株式会社村田製作所 セラミックグリーンシートの製造方法
US6274939B1 (en) 1998-09-11 2001-08-14 American Electronic Components Resin ceramic compositions having magnetic properties
DE10104605A1 (de) * 2001-02-02 2002-08-14 Daimler Chrysler Ag Klebeverbindung von Bauteilen, Kleber sowie Verfahren zur Herstellung der Klebeverbindung
DE10104604A1 (de) 2001-02-02 2002-08-22 Daimler Chrysler Ag Bauteil mit schwingungsdämpfenden Eigenschaften, Gemenge zur Herstellung des Bauteils, sowie Verfahren zur Herstellung eines derartigen Bauteils
US6861782B2 (en) * 2001-04-05 2005-03-01 Head Sport Ag Flexible piezoelectric films
US20030183954A1 (en) * 2002-03-15 2003-10-02 Wolf Ronald J. Magnetic resin composition and method of processing
JP5211418B2 (ja) * 2005-07-08 2013-06-12 トヨタ自動車株式会社 電解質膜の製造方法
US10006281B2 (en) * 2012-02-10 2018-06-26 Austin Star Detonator Company Calibration of molded piezoelectric longitudinal charge coefficient of a pressure sensor for blasting operation
KR20140073201A (ko) * 2012-12-06 2014-06-16 한국전자통신연구원 압전 에너지 하베스팅 장치 및 그 제조 방법
CN103346253B (zh) * 2013-06-08 2015-01-21 西安交通大学 铁电单晶/环氧2-2结构及应力板加固的2-2结构复合材料
US10498001B2 (en) 2017-08-21 2019-12-03 Texas Instruments Incorporated Launch structures for a hermetically sealed cavity
US10775422B2 (en) 2017-09-05 2020-09-15 Texas Instruments Incorporated Molecular spectroscopy cell with resonant cavity
US10589986B2 (en) 2017-09-06 2020-03-17 Texas Instruments Incorporated Packaging a sealed cavity in an electronic device
US10549986B2 (en) 2017-09-07 2020-02-04 Texas Instruments Incorporated Hermetically sealed molecular spectroscopy cell
US10444102B2 (en) 2017-09-07 2019-10-15 Texas Instruments Incorporated Pressure measurement based on electromagnetic signal output of a cavity
US10424523B2 (en) 2017-09-07 2019-09-24 Texas Instruments Incorporated Hermetically sealed molecular spectroscopy cell with buried ground plane
US10131115B1 (en) 2017-09-07 2018-11-20 Texas Instruments Incorporated Hermetically sealed molecular spectroscopy cell with dual wafer bonding
US10551265B2 (en) * 2017-09-07 2020-02-04 Texas Instruments Incorporated Pressure sensing using quantum molecular rotational state transitions
US10544039B2 (en) 2017-09-08 2020-01-28 Texas Instruments Incorporated Methods for depositing a measured amount of a species in a sealed cavity

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS517498A (en) * 1974-07-09 1976-01-21 Mitsubishi Petrochemical Co Atsudenzairyo oyobi sonoseizoho
JPS6053475B2 (ja) * 1976-07-01 1985-11-26 松下電器産業株式会社 高分子圧電材料
JPS53126200A (en) * 1977-04-11 1978-11-04 Ngk Spark Plug Co Piezooelectric composite material for pickup element
JPS5421597A (en) * 1977-07-19 1979-02-17 Post Office Piezoelectric material and method of making same
DE3166101D1 (en) * 1980-02-07 1984-10-25 Toray Industries Piezoelectric polymer material, process for producing the same and an ultrasonic transducer utilizing the same
FR2535113B1 (fr) * 1982-10-22 1986-05-16 Thomson Csf Procede de fabrication d'un materiau polymere piezo- ou pyroelectrique comportant une etape de reticulation
FR2548457A1 (fr) * 1983-07-01 1985-01-04 Thermocoax Cie Capteur piezoelectrique
US4726099A (en) * 1986-09-17 1988-02-23 American Cyanamid Company Method of making piezoelectric composites
JPH0796607B2 (ja) * 1987-09-07 1995-10-18 富山県 高分子圧電材及びその製造方法
EP0478177A1 (en) * 1990-09-28 1992-04-01 The Mead Corporation Reinforced paperboard

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003064240A (ja) * 2001-08-24 2003-03-05 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物および半導体装置
US8501027B2 (en) 2004-02-27 2013-08-06 Fujimi Incorporated Polishing composition and polishing method
JP2007089614A (ja) * 2005-09-26 2007-04-12 Inax Corp 型紙および型紙を用いた衛生陶器の施工方法
JP2009299062A (ja) * 2008-06-12 2009-12-24 General Electric Co <Ge> 反強誘電性粒子を含んでなる耐熱ポリマー複合材、並びにその製造方法
JP2016060898A (ja) * 2014-09-22 2016-04-25 京セラケミカル株式会社 ２液性注型用エポキシ樹脂組成物、及びコイル部品
JP2016171302A (ja) * 2015-03-09 2016-09-23 株式会社リコー 素子、及び発電装置
JP2020074666A (ja) * 2015-03-09 2020-05-14 株式会社リコー 素子、及び発電装置

Also Published As

Publication number Publication date
JP2585018B2 (ja) 1997-02-26
DE3819947A1 (de) 1989-03-23
US4826616A (en) 1989-05-02
DE3819947C2 (ja) 1993-06-17

Similar Documents

Publication Publication Date Title
JPS6467986A (en) Piezoelectric type pressure sensitive element and manufacture thereof
US4921928A (en) Piezoelectric polymer materials from epoxy resins and polytetramethyleneoxide-di-p-aminobenzoate
EP0218248A3 (de) Polymerisierbare Säure und Säurederivate enthaltende Verbindungen, dieselben enthaltende Mischungen und ihre Verwendung
EP0669842A4 (en) MULTI-AXIS ACTIVITY SENSOR AND METHOD.
DE2437922A1 (de) Verfahren und vorrichtung zur schwingungsmessung
DE112017004872B4 (de) Wandler mit dielektrischem Elastomermaterial
ATE137264T1 (de) Nukleinsäurefragmente von einem genom eines geeigneten mykobakteriums, ihre verwendung zur diagnose von mykobakterieninfektionen sowie diese fragmente enthaltende plasmide
JPS5698883A (en) Transducer
JPS5236141A (en) Process for manufacturing mica-thermoplastic resin composite materials
Gallantree Piezoelectric ceramic/polymer composites
JPS51135936A (en) Adhesive composition
FR2592055A1 (fr) Vernis de protection
JPS5738750A (en) 2,3-bis 3,4-dicarboxybenzoyloxy propyl methacrylate and its preparation
JPS5630425A (en) Preparation of polyurethane resin
EP0295895A1 (en) Piezoceramic composite
ES2000465A6 (es) Un procedimiento para revistir un sustrato electricamente conductor
JPS6477298A (en) Ultrasonic probe
Ransone et al. Interlaminar Tensile Testing of Thin Carbon--Carbon Composites
JPS564291A (en) Composite piezoelectric film and manufacture thereof
SMITH Adhesives: Properties, preparation and applications, volume 2. A bibliography with abstracts[Progress Report, 1976- Nov. 1978]
JPS5655475A (en) Adhesive for vulcanized rubber
JPS56115783A (en) Preparation of diisobutenylsuccinic anhydride
JPS6418053A (en) Gas sensor
Kyogoku et al. Strength evaluation of scarf joint bonded with adhesive resin(2 nd report, adherends of dissimilar metals).
JPS54148892A (en) Nitrosoated derivative of hydroxystyrene polymer and its preparation

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term