JPS6466937A - On-site measurement of quantity of etching in rie device - Google Patents
On-site measurement of quantity of etching in rie deviceInfo
- Publication number
- JPS6466937A JPS6466937A JP22381487A JP22381487A JPS6466937A JP S6466937 A JPS6466937 A JP S6466937A JP 22381487 A JP22381487 A JP 22381487A JP 22381487 A JP22381487 A JP 22381487A JP S6466937 A JPS6466937 A JP S6466937A
- Authority
- JP
- Japan
- Prior art keywords
- etching
- oscillation frequency
- radicals
- etched
- quartz
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Drying Of Semiconductors (AREA)
Abstract
PURPOSE:To measure the quantity of etching by the variation of the oscillation frequency F of quartz oscillators, and to conduct control with high accuracy by tentatively arranging and installing the quartz oscillators previously coated with a material to be etched. CONSTITUTION:A quartz oscillator 1 previously coated with the same material as a material to be etched exposed to the surface of a sample 2 is mounted to a cathode 4. A reaction chamber 5 is evacuated first. A reactive gas 9 is introduced. Since the reactive gas is used, dominant radicals (neutral species) are formed besides electrons and positive ions when the gas is changed into plasma. Radicals are beaten by positive ions and fly toward the cathode 4. When the radicals collide with a sample surface, they chemically react, and etch the material on the sample surface. The material on the surface of the quartz oscillator 1 is also etched at the same rate. The oscillation frequency of an oscillation circuit including the quartz oscillator 1 is measured. The oscillation frequency varies together with the quantity of etching. The relationship of the quantity of etching and the oscillation frequency is determined pre viously. Accordingly, the quantity of etching is detected at the arbitray time.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22381487A JPS6466937A (en) | 1987-09-07 | 1987-09-07 | On-site measurement of quantity of etching in rie device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22381487A JPS6466937A (en) | 1987-09-07 | 1987-09-07 | On-site measurement of quantity of etching in rie device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6466937A true JPS6466937A (en) | 1989-03-13 |
Family
ID=16804138
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22381487A Pending JPS6466937A (en) | 1987-09-07 | 1987-09-07 | On-site measurement of quantity of etching in rie device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6466937A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002012585A2 (en) * | 2000-08-08 | 2002-02-14 | Tokyo Electron Limited | Processing apparatus and cleaning method |
| JP2019510374A (en) * | 2016-03-11 | 2019-04-11 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | Wafer processing tool with microsensor |
-
1987
- 1987-09-07 JP JP22381487A patent/JPS6466937A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002012585A2 (en) * | 2000-08-08 | 2002-02-14 | Tokyo Electron Limited | Processing apparatus and cleaning method |
| WO2002012585A3 (en) * | 2000-08-08 | 2002-04-18 | Tokyo Electron Ltd | Processing apparatus and cleaning method |
| US7201174B2 (en) | 2000-08-08 | 2007-04-10 | Tokyo Electron Limited | Processing apparatus and cleaning method |
| JP2019510374A (en) * | 2016-03-11 | 2019-04-11 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | Wafer processing tool with microsensor |
| JP2022020718A (en) * | 2016-03-11 | 2022-02-01 | アプライド マテリアルズ インコーポレイテッド | Wafer processing tool with micro sensor |
| US11348846B2 (en) | 2016-03-11 | 2022-05-31 | Applied Materials, Inc. | Wafer processing tool having a micro sensor |
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