JPS6465852A - Method of filling fine hole with metal - Google Patents
Method of filling fine hole with metalInfo
- Publication number
- JPS6465852A JPS6465852A JP22194687A JP22194687A JPS6465852A JP S6465852 A JPS6465852 A JP S6465852A JP 22194687 A JP22194687 A JP 22194687A JP 22194687 A JP22194687 A JP 22194687A JP S6465852 A JPS6465852 A JP S6465852A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- metal
- fine hole
- cvd
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
PURPOSE:To fill selectively a fine hole with a metal in a short time by a method wherein, after the sidewall of the fine hole is covered with a base material by sputtering the base material of the bottom part of the fine hole, a selective CVD of a metal is performed. CONSTITUTION:An SiO2 film 2 is formed on an Al base wiring 1 by a plasma CVD method and so on and thereafter, a hole 3 is opened by a photoetching process. Then, the obtained sample is bombarded with Ar<+> ions 4 using a plasma treating unit, whereby the base Al of the bottom part of the hole is sputtered and is adhered on the sidewall if the hole. Then, a selective CVD of W5 is performed on the obtained sample using a cold wall type CVD unit to finish a hole filling. In such a way, the fine hole can be filled selectively with a metal in a short time and moreover, the continuity between the hole filling metal and an Al wiring to be provided in an upper layer can be improved.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22194687A JPS6465852A (en) | 1987-09-07 | 1987-09-07 | Method of filling fine hole with metal |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22194687A JPS6465852A (en) | 1987-09-07 | 1987-09-07 | Method of filling fine hole with metal |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6465852A true JPS6465852A (en) | 1989-03-13 |
Family
ID=16774632
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22194687A Pending JPS6465852A (en) | 1987-09-07 | 1987-09-07 | Method of filling fine hole with metal |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6465852A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02267933A (en) * | 1989-04-07 | 1990-11-01 | Nec Corp | Wiring in a viahole and its formation |
US5366929A (en) * | 1993-05-28 | 1994-11-22 | Cypress Semiconductor Corp. | Method for making reliable selective via fills |
-
1987
- 1987-09-07 JP JP22194687A patent/JPS6465852A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02267933A (en) * | 1989-04-07 | 1990-11-01 | Nec Corp | Wiring in a viahole and its formation |
US5366929A (en) * | 1993-05-28 | 1994-11-22 | Cypress Semiconductor Corp. | Method for making reliable selective via fills |
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