JPS646532B2 - - Google Patents

Info

Publication number
JPS646532B2
JPS646532B2 JP55160514A JP16051480A JPS646532B2 JP S646532 B2 JPS646532 B2 JP S646532B2 JP 55160514 A JP55160514 A JP 55160514A JP 16051480 A JP16051480 A JP 16051480A JP S646532 B2 JPS646532 B2 JP S646532B2
Authority
JP
Japan
Prior art keywords
chip
board
leads
claws
clamping tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55160514A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5784128A (en
Inventor
Isao Kagatani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP55160514A priority Critical patent/JPS5784128A/ja
Publication of JPS5784128A publication Critical patent/JPS5784128A/ja
Publication of JPS646532B2 publication Critical patent/JPS646532B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Electrical Connectors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP55160514A 1980-11-14 1980-11-14 Method of soldering chip Granted JPS5784128A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55160514A JPS5784128A (en) 1980-11-14 1980-11-14 Method of soldering chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55160514A JPS5784128A (en) 1980-11-14 1980-11-14 Method of soldering chip

Publications (2)

Publication Number Publication Date
JPS5784128A JPS5784128A (en) 1982-05-26
JPS646532B2 true JPS646532B2 (enrdf_load_stackoverflow) 1989-02-03

Family

ID=15716591

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55160514A Granted JPS5784128A (en) 1980-11-14 1980-11-14 Method of soldering chip

Country Status (1)

Country Link
JP (1) JPS5784128A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS5784128A (en) 1982-05-26

Similar Documents

Publication Publication Date Title
US3750252A (en) Solder terminal strip
US5176255A (en) Lead frame for integrated circuits or the like and method of manufacture
US5875546A (en) Method of forming solder-holding clips for applying solder to connectors
US3529760A (en) Flatpack installation and removal tool
US3698618A (en) Face bonding machine
JPS646532B2 (enrdf_load_stackoverflow)
US4789096A (en) Method of soldering joints by moving them through a target area on which a stream of hot gas is focused
US4473181A (en) Soldering and desoldering iron tip for removing soldered elements
JPH0233981Y2 (enrdf_load_stackoverflow)
US6736307B2 (en) Method for mounting leadframes
US5127572A (en) Soldering method and tool
CN222243255U (zh) 导线预固定件和用于电子装置端子焊接的工作台
JP2532427B2 (ja) 電子部品のリ−ド曲げ形成方法及び装置
JPS6120790Y2 (enrdf_load_stackoverflow)
JPH054315Y2 (enrdf_load_stackoverflow)
JP3164062B2 (ja) ヒートシンク半田付け用の治工具
JPS6272473A (ja) はんだ付装置
JPS6233432A (ja) リ−ドフレ−ム押圧器
JP2681702B2 (ja) 面実装部品の実装方法
JPS5919359Y2 (ja) 端子半田付装置
DE2910066C2 (de) Einrichtung zum Reflow-Löten von vielpoligen Steckverbindungen
JPH0533521U (ja) リード端子折り曲げ治具
JPS6336642Y2 (enrdf_load_stackoverflow)
JPS5914644A (ja) 半導体装置組立用リ−ドフレ−ム位置決め装置
JPH05109831A (ja) ボンデイング装置およびその方法