JPS6464302A - Manufacture of electronic component - Google Patents

Manufacture of electronic component

Info

Publication number
JPS6464302A
JPS6464302A JP62222370A JP22237087A JPS6464302A JP S6464302 A JPS6464302 A JP S6464302A JP 62222370 A JP62222370 A JP 62222370A JP 22237087 A JP22237087 A JP 22237087A JP S6464302 A JPS6464302 A JP S6464302A
Authority
JP
Japan
Prior art keywords
electrodes
substrate
plating
plated
barrel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62222370A
Other languages
Japanese (ja)
Other versions
JP2531002B2 (en
Inventor
Kazunori Masuyama
Tomoyuki Ogawa
Koji Tani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP62222370A priority Critical patent/JP2531002B2/en
Publication of JPS6464302A publication Critical patent/JPS6464302A/en
Application granted granted Critical
Publication of JP2531002B2 publication Critical patent/JP2531002B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Adjustable Resistors (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE:To prevent the occurrence of the defect and the exfoliation of a resist, and to eliminate the deterioration of the characteristic of an electronic component by treating the surface of a substrate including a circuit function section with silane coupling agent or silicon primer and coating it with plating resist. CONSTITUTION:Base electrodes 5, 5, 6 for forming terminal electrodes are formed by printing, baking silver paste at the end of a substrate 1. The substrate 1 is dipped in a silane coupling agent. i,e., dipropyltrimethoxysilane diluted to 0.01-2% with ethanol as the diluent in the previous step of barrel-plating the electrodes 5, 5, 6, and dried. Then the substrate 1 is coated with plating resist except the electrodes 5, 5, 6, and a resistor 2 and a collector electrode 3 are masked. Thus, the substrate 1 masked by the plating resist is contained in a barrel plating vessel, nickel-plated 2mum thick, then tin-plated 3-4mum thick, totally barrel-plated for 90min, and the two plating layers are formed on the electrodes 5, 5, 6 as terminal electrodes.
JP62222370A 1987-09-04 1987-09-04 Electronic component manufacturing method Expired - Lifetime JP2531002B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62222370A JP2531002B2 (en) 1987-09-04 1987-09-04 Electronic component manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62222370A JP2531002B2 (en) 1987-09-04 1987-09-04 Electronic component manufacturing method

Publications (2)

Publication Number Publication Date
JPS6464302A true JPS6464302A (en) 1989-03-10
JP2531002B2 JP2531002B2 (en) 1996-09-04

Family

ID=16781287

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62222370A Expired - Lifetime JP2531002B2 (en) 1987-09-04 1987-09-04 Electronic component manufacturing method

Country Status (1)

Country Link
JP (1) JP2531002B2 (en)

Also Published As

Publication number Publication date
JP2531002B2 (en) 1996-09-04

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