JP2531002B2 - Electronic component manufacturing method - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing electronic components such as a chip volume, a chip inductor, a chip coil and a cylindrical capacitor.

Conventional technology and its problems Conventionally, in electronic parts such as a chip volume, in order to improve the soldering heat resistance of the terminal electrode or to prevent silver cracking due to solder, the base electrode made of silver or the like has nickel or tin. Alternatively, an alloy containing these was plated. This plating treatment is performed by barrel plating in a state in which a plating resist is applied to the surface of the substrate including a circuit function portion such as a resistor, and the plating resist is removed after the plating treatment.

However, in the conventional manufacturing method, since the plating resist and the substrate surface are in close contact with each other merely by a physical action,
Poor adhesion, chipping of resist due to barrel collision,
There is a problem that peeling occurs, plating deposition occurs from this defective portion, and the characteristics are impaired.

Therefore, in the method for manufacturing an electronic component according to the present invention, the substrate surface including the circuit functional portion is treated with a silane coupling agent or a silicon primer as a pre-process of the barrel plating treatment, and a plating resist is applied thereon. Is applied.

A silane coupling agent is an organic silicon monomer having two or more different reactive groups in its molecule, and one reactive group is a reactive group that chemically bonds with an inorganic substance such as glass, metal, and silica, for example, , Methoxy group, ethoxy group, silanol group and the like. Another reactive group is a reactive group that chemically bonds with various organic materials, such as vinyl group, epoxy group,
An amino group and the like. Such a silane coupling agent is
It is used in a state diluted with a solution of methanol, ethanol, toluene, ascent or the like.

Silicone primer is a compound whose components include silane coupling agent, coating film forming agent, solvent, catalyst, etc. When applied to the surface of the adherend, it reacts with moisture in the air and adheres to it. It is said that there is an effect of binding to the body surface by hydrogen bonding and dehydration condensation, and effective adhesion can be obtained by selecting a primer having a functional group suitable for the curing mechanism of the resist film. .

As the substrate to be processed, an inorganic insulating material such as alumina, glass, zirconia or forsterite is used.

By treating the substrate surface including the circuit functional portion with the silane coupling agent or the silicon primer as described above, the substrate surface and the plating resist are firmly bonded,
The adhesion of the plating resist to the substrate is improved.

In particular, in the case of the silane coupling agent, the inorganic substance of the substrate or the circuit functional portion and the organic substance of the plating resist are chemically bonded to the reactive group, and are strongly bonded together with the physical bond. .

Example FIG. 1 shows a resistor substrate of a chip volume, and the substrate 1 is made by firing alumina. A resistor 2 and a collector electrode 3 are provided on the surface of the substrate 1 by a method such as screen printing and baked on the substrate 1.

Further, base electrodes 5, 5, 6 for forming a terminal electrode are formed on the end portion of the substrate 1 by printing and baking a silver paste.

As a pre-process of barrel plating for the base electrodes 5, 5, 6, the substrate 1 is immersed in a silane coupling agent diluted to 0.01 to 2% (for example, γ-glycidoxypropyltrimethoxysilane, the diluting solution is ethanol). And dried.
Thereafter, a plating resist was applied to the shaded portion of FIG. 2 on the surface of the substrate 1 while leaving the underlying electrodes 5, 5, and 6 to mask the resistor 2 and the collector electrode 3.

The substrate 1 thus masked with the plating resist is placed in a barrel plating container, and nickel is deposited to a thickness of 2 μm.
Then, tin was plated to a thickness of 3 to 4 μm for a total of 90 minutes, and two plating layers were provided on the base electrodes 5, 5, 6 to form terminal electrodes.

On the other hand, as another embodiment, the substrate 1 shown in FIG.
It was dipped in a silicone primer diluted to 01 to 2% and dried. Thereafter, the circuit functional portion was masked with a plating resist in the same manner, and barrel plating was performed in the same manner as described above.

With respect to the resistor substrate 1 of the chip volume manufactured through the above steps, the defective product occurrence rate such as plating deposition was examined. As a result, the defective product occurrence rate was 0.2% when pretreatment with a silane coupling agent was performed, It was 0.4% when pretreatment with a silicon primer was performed. If these treatments were not performed, 100% of the products had defects.

This is because the adhesion of the plating resist by the silane coupling agent and the silicon primer to the substrate surface is improved, and there is no defect or peeling of the resist during barrel plating.

Further, the pretreatment did not show any functional impairment of the resistor 2 and the collector electrode 3, deterioration of characteristics, and further no functional deterioration of the base electrodes 5, 5, 6.

EFFECTS OF THE INVENTION According to the present invention, since the substrate surface is treated with a silane coupling agent or a silicon primer as a pre-process of barrel plating treatment, the adhesion of the plating resist to the circuit surface portion such as the substrate surface or the resistor is improved. This is remarkably improved, resist defects and peeling are prevented from occurring during barrel plating, and deterioration of characteristics as an electronic component is eliminated.

[Brief description of drawings]

FIG. 1 is a plan view of a substrate before performing a silane coupling treatment or a silicon primer treatment in the manufacturing method according to the present invention, and FIG. 2 is a plan view of a substrate when performing a barrel plating treatment after the above treatment. 1 ... Substrate, 2 ... Resistor, 3 ... Collector electrode, 5,5,
6 ... Base electrode.

Claims (1)

(57) [Claims] 1. A method of manufacturing an electronic component comprising barrel plating a part of a substrate having a circuit functional portion such as a resistor and an electrode, wherein the substrate including the circuit functional portion is included as a pre-process of barrel plating. A method of manufacturing an electronic component, comprising treating the surface with a silane coupling agent or a silicon primer, and applying a plating resist on the surface.