JP2002289464A - Ceramic electronic component and method for manufacturing it - Google Patents
Ceramic electronic component and method for manufacturing itInfo
- Publication number
- JP2002289464A JP2002289464A JP2001086615A JP2001086615A JP2002289464A JP 2002289464 A JP2002289464 A JP 2002289464A JP 2001086615 A JP2001086615 A JP 2001086615A JP 2001086615 A JP2001086615 A JP 2001086615A JP 2002289464 A JP2002289464 A JP 2002289464A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- ceramic
- ceramic body
- external electrode
- ceramic electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、セラミック電子
部品およびその製造方法に関し、特に、たとえばセラミ
ック素体の端面に端子電極が形成されたセラミック電子
部品と、その製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ceramic electronic component and a method of manufacturing the same, and more particularly, to a ceramic electronic component having a terminal electrode formed on an end face of a ceramic body, and a method of manufacturing the same.
【０００２】[0002]
【従来の技術】セラミック電子部品は、導体とセラミッ
ク絶縁体からなるセラミック素体に、導体と導通する端
子電極が形成された構造を有している。端子電極は、セ
ラミック素体の端面に焼き付けられた外部電極と、外部
電極上に形成されるめっき皮膜とで形成される。めっき
皮膜としては、たとえば半田付けの際の耐半田性を得る
ためにＮｉめっき皮膜が形成され、さらに半田付き性を
良好とするために、ＳｎまたはＳｎ／Ｐｂなどのめっき
皮膜が形成される。このようなめっき皮膜は、めっき液
中でセラミック素体に電気めっきを行なう、いわゆる湿
式めっき法によって形成される。2. Description of the Related Art A ceramic electronic component has a structure in which a terminal electrode that conducts with a conductor is formed on a ceramic body composed of a conductor and a ceramic insulator. The terminal electrode is formed by an external electrode baked on the end face of the ceramic body and a plating film formed on the external electrode. As the plating film, for example, a Ni plating film is formed to obtain solder resistance during soldering, and a plating film such as Sn or Sn / Pb is formed to further improve solderability. Such a plating film is formed by a so-called wet plating method in which a ceramic body is electroplated in a plating solution.
【０００３】セラミック電子部品においては、セラミッ
ク素体自体に微細な空隙が存在するとともに、焼き付け
によって形成される外部電極にも微細な空隙が存在す
る。また、セラミック素体に内部電極が形成されている
場合には、内部電極とセラミック絶縁体との界面にも微
細な空隙が存在する。したがって、外部電極が焼き付け
られたセラミック素体をめっき液中に浸漬すると、めっ
き液がセラミック素体および外部電極の空隙内に侵入し
て残留することになる。In a ceramic electronic component, fine voids exist in the ceramic body itself, and fine voids also exist in an external electrode formed by baking. When the internal electrodes are formed on the ceramic body, fine voids also exist at the interface between the internal electrodes and the ceramic insulator. Therefore, when the ceramic body on which the external electrodes are baked is immersed in the plating solution, the plating solution penetrates into the gap between the ceramic body and the external electrodes and remains.
【０００４】めっき液は、主として、Ｎｉ、Ｓｎあるい
はＳｎ／Ｐｂなどの各種金属の塩からなり、セラミック
素体中に残留すると、それ自体が異質誘電体として挙動
する結果、電子部品の特性、たとえば静電容量や誘電体
損失などにばらつきが生じる。また、水分の存在下では
イオンとして移行し、絶縁抵抗値を低下させるなどの原
因となっている。[0004] The plating solution is mainly composed of salts of various metals such as Ni, Sn or Sn / Pb. When remaining in the ceramic body, the plating solution itself behaves as a foreign dielectric, resulting in characteristics of the electronic component, for example, Variations occur in capacitance and dielectric loss. Further, in the presence of moisture, they migrate as ions and cause a reduction in insulation resistance.
【０００５】このようなめっき液の侵入を防止するため
に、たとえば外部電極が焼き付けられたセラミック素体
にシリコンまたはフェノールなどの熱硬化性樹脂を含浸
させた後、樹脂を硬化させて表面の余分な樹脂を研磨に
より除去したり、溶剤などによって余分な樹脂を洗浄す
る方法がある。このような方法により、セラミック素体
や外部電極の空隙を樹脂で封止し、外部電極表面に湿式
めっきによってめっき皮膜が形成される。In order to prevent such intrusion of the plating solution, for example, a thermosetting resin such as silicon or phenol is impregnated into a ceramic body on which external electrodes are baked, and then the resin is cured to make the surface extra. There is a method of removing unnecessary resin by polishing or washing excess resin with a solvent or the like. By such a method, the gap between the ceramic body and the external electrode is sealed with a resin, and a plating film is formed on the external electrode surface by wet plating.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、このよ
うな方法では、樹脂を熱硬化させる必要があり、熱硬化
により外部電極表面に付着した余分な樹脂は、研磨や洗
浄などの方法で除去する必要がある。このように、セラ
ミック素体に樹脂を含浸させる方法では、製造工程が複
雑になり、量産性に欠け、またコストアップにつながる
という問題がある。However, in such a method, it is necessary to thermally cure the resin, and excess resin adhering to the external electrode surface due to the thermal curing must be removed by a method such as polishing or washing. There is. As described above, the method of impregnating the ceramic body with the resin has a problem that the manufacturing process is complicated, the mass productivity is lacking, and the cost is increased.
【０００７】さらに、完成したセラミック電子部品に合
成樹脂が残存すると、電子部品をプリント基板に実装す
る際、あるいは実装された後に高温・高湿環境下で使用
される場合、空隙に残存した樹脂が溶解あるいは変質し
て、電子部品の信頼性を損なう恐れがある。Furthermore, if the synthetic resin remains in the completed ceramic electronic component, the resin remaining in the gap may be lost when the electronic component is mounted on a printed circuit board or used in a high-temperature, high-humidity environment after mounting. It may dissolve or deteriorate, thereby impairing the reliability of the electronic component.
【０００８】それゆえに、この発明の主たる目的は、セ
ラミック素体にめっき液が侵入していないセラミック電
子部品と、簡単にそのようなセラミック電子部品を製造
することができるセラミック電子部品の製造方法を提供
することである。SUMMARY OF THE INVENTION Therefore, a main object of the present invention is to provide a ceramic electronic component in which a plating solution has not penetrated into a ceramic body, and a method of manufacturing such a ceramic electronic component that can be easily manufactured. To provide.
【０００９】[0009]
【課題を解決するための手段】この発明は、セラミック
素体と、セラミック素体の端面に形成される外部電極
と、外部電極上に形成されるめっき皮膜とを含むセラミ
ック電子部品の製造方法であって、撥水処理剤によって
セラミック素体に形成された外部電極に撥水処理を施す
ことによりめっき液侵入防止皮膜を形成する工程と、外
部電極上にめっき処理を施す工程とを含み、撥水処理剤
は、外部電極との吸着性を良好にする官能基として水酸
基、アミノ基、メルカプト基から選ばれる少なくとも１
種類からなる官能基と、疎水性を有する官能基としてア
ルキル基、ビニル基、フェニル基、パーフルオロ基から
選ばれる少なくとも１種類からなる官能基とを含むこと
を特徴とする、セラミック電子部品の製造方法である。
このようなセラミック電子部品の製造方法において、め
っき液侵入防止皮膜を形成する工程の後に、加熱による
撥水処理剤の縮重合により外部電極と撥水処理剤とを共
有結合させる工程を含めてもよい。さらに、このような
セラミック電子部品の製造方法において、セラミック素
体として、セラミックと内部電極とからなるセラミック
素体を用いることができる。また、セラミック素体とし
て、多孔質の表面を有するセラミック素体を用いること
ができる。さらに、外部電極は、たとえば電極ペースト
を塗布し、焼き付けることによって形成される。また、
この発明は、上述のいずれかに記載のセラミック電子部
品の製造方法で製造された、セラミック電子部品であ
る。SUMMARY OF THE INVENTION The present invention relates to a method of manufacturing a ceramic electronic component including a ceramic body, an external electrode formed on an end face of the ceramic body, and a plating film formed on the external electrode. A step of forming a plating solution intrusion prevention film by applying a water repellent treatment to an external electrode formed on the ceramic body with a water repellent agent; and a step of performing a plating treatment on the external electrode. The water treatment agent has at least one functional group selected from a hydroxyl group, an amino group, and a mercapto group as a functional group for improving the adsorptivity with an external electrode.
The production of a ceramic electronic component, comprising a functional group consisting of a kind and a functional group consisting of at least one kind selected from an alkyl group, a vinyl group, a phenyl group and a perfluoro group as a hydrophobic functional group. Is the way.
In the method of manufacturing such a ceramic electronic component, the method may further include, after the step of forming the plating solution intrusion prevention film, a step of covalently bonding the external electrode and the water repellent agent by condensation polymerization of the water repellent agent by heating. Good. Further, in such a method for manufacturing a ceramic electronic component, a ceramic body composed of ceramic and internal electrodes can be used as the ceramic body. In addition, a ceramic body having a porous surface can be used as the ceramic body. Further, the external electrodes are formed, for example, by applying and baking an electrode paste. Also,
The present invention is a ceramic electronic component manufactured by any one of the above-described methods for manufacturing a ceramic electronic component.
【００１０】撥水処理剤に含まれる水酸基、アミノ基、
メルカプト基が吸着のための官能基として働くことによ
り、撥水処理剤がセラミック素体の端面に形成された外
部電極に吸着される。外部電極に吸着された撥水処理剤
には、疎水性を有する官能基として、アルキル基、ビニ
ル基、フェニル基、パーフルオロ基などが含まれるた
め、めっき液がセラミック素体に侵入することが防止さ
れる。外部電極に撥水処理剤を吸着させた後、この撥水
処理剤を過熱して縮重合させ、撥水処理剤と外部電極と
を共有結合させることにより、耐磨耗性に優れためっき
液侵入防止皮膜を形成することができる。セラミック素
体としては、セラミックと内部電極とからなるセラミッ
ク素体や、多孔質のセラミック素体を用いることがで
き、このようなセラミック素体であっても、その表面に
撥水処理剤が吸着されることにより、めっき液の侵入を
防ぐことができる。また、電極ペーストを塗布し、焼き
付けた外部電極を有する場合においても、めっき液の侵
入を防ぐことができる。このような電極形成方法用いた
セラミック電子部品では、外部電極上へのめっき工程に
おいて、セラミック素体へのめっき液の侵入を防ぐこと
ができ、めっき液によるセラミック電子部品の特性の変
化を防止することができる。Hydroxyl group, amino group,
Since the mercapto group acts as a functional group for adsorption, the water-repellent agent is adsorbed on the external electrode formed on the end face of the ceramic body. Since the water-repellent treatment agent adsorbed on the external electrode contains an alkyl group, a vinyl group, a phenyl group, a perfluoro group, and the like as a functional group having hydrophobicity, the plating solution may invade the ceramic body. Is prevented. After adsorbing the water repellent on the external electrode, the water repellent is overheated to cause polycondensation, and the water repellent and the external electrode are covalently bonded to form a plating solution having excellent wear resistance. An intrusion prevention film can be formed. As the ceramic body, a ceramic body composed of a ceramic and an internal electrode or a porous ceramic body can be used. By doing so, intrusion of the plating solution can be prevented. In addition, even in the case where the external electrode is coated with the electrode paste and baked, the intrusion of the plating solution can be prevented. In a ceramic electronic component using such an electrode forming method, in a plating step on an external electrode, it is possible to prevent a plating solution from entering a ceramic body and prevent a change in characteristics of the ceramic electronic component due to the plating solution. be able to.
【００１１】この発明の上述の目的，その他の目的，特
徴および利点は、図面を参照して行う以下の発明の実施
の形態の詳細な説明から一層明らかとなろう。The above and other objects, features and advantages of the present invention will become more apparent from the following detailed description of embodiments of the present invention with reference to the accompanying drawings.
【００１２】[0012]
【発明の実施の形態】図１はこの発明の製造方法が適用
されるセラミック電子部品の一例を示す斜視図であり、
図２はその断面図である。セラミック電子部品１０は、
セラミック素体１２を含む。セラミック素体１２として
は、たとえば積層セラミックコンデンサ用のものが用い
られる。積層セラミックコンデンサ用のセラミック素体
１２は、セラミックグリーンシート上に電極材料が印刷
され、複数のセラミックグリーンシートが積層・圧着さ
れた後、焼成されることにより形成される。FIG. 1 is a perspective view showing an example of a ceramic electronic component to which a manufacturing method according to the present invention is applied.
FIG. 2 is a sectional view thereof. The ceramic electronic component 10
The ceramic body 12 is included. As the ceramic body 12, for example, a ceramic body for a multilayer ceramic capacitor is used. The ceramic body 12 for the multilayer ceramic capacitor is formed by printing an electrode material on a ceramic green sheet, laminating and pressing a plurality of ceramic green sheets, and then firing.
【００１３】このようにして得られたセラミック素体１
２は、電極材料を焼成することによって形成された内部
電極が交互に両端面に露出した構造を有している。この
ように内部電極が露出したセラミック素体１２の両端面
に、端子電極１４ａ，１４ｂが形成される。端子電極１
４ａ，１４ｂは、それぞれ外部電極１６ａ，１６ｂと、
その上に形成されるめっき皮膜１８ａ，１８ｂとで形成
される。なお、めっき皮膜１８ａ，１８ｂとしては、１
層のものに限らず、多層に形成されたものであってもよ
い。たとえば、外部電極１６ａ，１６ｂ上に、耐半田性
を有するＮｉめっき層を形成し、さらに半田付き性の良
好なＳｎめっき層やＳｎ／Ｐｂめっき層などを形成する
ことが考えられる。また、セラミック素体２としては、
チップインダクタ用やチップ抵抗用のものなどの他のセ
ラミック素体を用いることができる。The ceramic body 1 thus obtained
No. 2 has a structure in which internal electrodes formed by firing an electrode material are alternately exposed at both end surfaces. Terminal electrodes 14a and 14b are formed on both end surfaces of the ceramic body 12 with the internal electrodes exposed. Terminal electrode 1
4a and 14b are external electrodes 16a and 16b, respectively.
It is formed by plating films 18a and 18b formed thereon. In addition, as the plating films 18a and 18b, 1
It is not limited to a layer, but may be a multilayer. For example, it is conceivable to form a Ni plating layer having solder resistance on the external electrodes 16a and 16b, and further form an Sn plating layer or a Sn / Pb plating layer having good solderability. Moreover, as the ceramic body 2,
Other ceramic bodies such as those for chip inductors and chip resistors can be used.
【００１４】外部電極１６ａ，１６ｂは、セラミック素
体１２の両端面に電極ペーストを塗布し、焼き付けるこ
とによって形成される。電極ペーストにはガラスフリッ
トが含まれるため、焼き付けることによって、外部電極
１６ａ，１６ｂは多孔質な構造となる。さらに、湿式め
っき法により外部電極１６ａ，１６ｂ上にめっき皮膜１
８ａ，１８ｂが形成されるが、このとき、めっき液が外
部電極１６ａ，１６ｂの空隙を通してセラミック素体１
２に侵入しないように、めっき工程の前に撥水処理が施
される。The external electrodes 16a and 16b are formed by applying and baking an electrode paste to both end surfaces of the ceramic body 12. Since the electrode paste contains glass frit, the external electrodes 16a and 16b have a porous structure by baking. Further, a plating film 1 is formed on the external electrodes 16a and 16b by wet plating.
8a and 18b are formed. At this time, the plating solution passes through the gaps between the external electrodes 16a and 16b.
2 is subjected to a water-repellent treatment before the plating step.
【００１５】撥水処理を行うための撥水処理剤には、外
部電極１６ａ，１６ｂに吸着しやすい官能基として、水
酸基、アミノ基、メルカプト基から選ばれる少なくとも
１種類が含まれる。また、撥水処理剤には、めっき液が
セラミック基体１２に侵入することを防ぐ疎水性の官能
基として、アルキル基、ビニル基、フェニル基、パーフ
ルオロ基から選ばれる少なくとも１種類が含まれる。The water-repellent agent for performing the water-repellent treatment contains at least one selected from a hydroxyl group, an amino group, and a mercapto group as a functional group which is easily adsorbed to the external electrodes 16a and 16b. The water-repellent agent includes at least one selected from an alkyl group, a vinyl group, a phenyl group, and a perfluoro group as a hydrophobic functional group that prevents the plating solution from entering the ceramic substrate 12.
【００１６】このような撥水処理剤に外部電極１６ａ，
１６ｂが形成されたセラミック素体１２を浸漬して、外
部電極１６ａ，１６ｂに撥水処理剤を付着させて、さら
に風乾することにより、めっき液侵入防止皮膜が形成さ
れる。このとき、撥水処理剤に電極に対する吸着性の良
好な官能基が含まれていることにより、外部電極１６
ａ，１６ｂへの撥水処理剤の吸着力を高めることができ
る。The external electrode 16a,
By immersing the ceramic body 12 on which the 16b is formed, attaching a water-repellent treatment agent to the external electrodes 16a and 16b, and further air-drying, a plating solution intrusion prevention film is formed. At this time, since the water-repellent agent contains a functional group having good adsorbability to the electrode, the external electrode 16
The absorptive power of the water-repellent agent to the a and 16b can be increased.
【００１７】次に、めっき処理により、外部電極１６
ａ，１６ｂの上にめっき皮膜１８ａ，１８ｂが形成され
る。このめっき工程において、外部電極１６ａ，１６ｂ
に撥水処理剤が付着しているため、疎水性を有する官能
基の働きによって、めっき液が外部電極１６ａ，１６ｂ
の空隙からセラミック素体１２に侵入することが防止さ
れる。したがって、セラミック素体１２の特性がめっき
液の侵入によって変化せず、特性ばらつきのないセラミ
ック電子部品１０を得ることができる。Next, the external electrodes 16 are plated by plating.
The plating films 18a, 18b are formed on the a, 16b. In this plating step, the external electrodes 16a, 16b
Since the water-repellent agent is attached to the external electrodes 16a and 16b due to the function of the hydrophobic functional group.
Is prevented from entering the ceramic body 12 through the void. Therefore, the characteristics of the ceramic body 12 do not change due to the intrusion of the plating solution, and the ceramic electronic component 10 having no characteristic variation can be obtained.
【００１８】また、撥水処理剤に外部電極１６ａ，１６
ｂを浸漬した後、加熱により撥水処理剤を縮重合させ、
撥水処理剤と外部電極１６ａ，１６ｂとを共有結合させ
てもよい。このような処理を施すことにより、撥水処理
剤と外部電極１６ａ，１６ｂとが強力に結合し、撥水処
理剤の耐磨耗性を高めることができ、外部電極１６ａ，
１６ｂのシール性を維持することが可能となる。Further, the external electrodes 16a, 16
After immersing b, the water-repellent agent is subjected to polycondensation by heating,
The water-repellent agent and the external electrodes 16a and 16b may be covalently bonded. By performing such a treatment, the water-repellent agent and the external electrodes 16a and 16b are strongly bonded to each other, and the wear resistance of the water-repellent agent can be increased.
16b can be maintained.
【００１９】セラミック素体１２としては、積層セラミ
ックコンデンサの誘電体のように緻密な構造を有するも
のはもちろん、インダクタのフェライトのように多孔質
の構造を有するものであっても使用することができる。
つまり、撥水処理剤によって外部電極からのめっき液の
侵入を防ぐことができるため、多孔質のセラミック素体
１２にもめっき液が侵入することを防ぐことができる。
したがって、セラミック素体１２の構造にかかわらず、
めっき液の侵入による特性の変化がないセラミック電子
部品１０を得ることができる。As the ceramic body 12, not only a ceramic body having a dense structure such as a dielectric of a multilayer ceramic capacitor but also a ceramic body having a porous structure such as a ferrite of an inductor can be used. .
In other words, the intrusion of the plating solution from the external electrode can be prevented by the water repellent agent, so that the plating solution can also be prevented from entering the porous ceramic body 12.
Therefore, regardless of the structure of the ceramic body 12,
A ceramic electronic component 10 having no change in characteristics due to the intrusion of the plating solution can be obtained.
【００２０】[0020]
【実施例】（実施例１）外部電極としてＣｕ下地電極が
形成された積層セラミックコンデンサ用のセラミック素
体を準備した。下地電極焼付後に、撥水処理を行なうた
めに、撥水処理剤を準備した。撥水処理剤として、有機
溶媒としてのメチルエチルケトンに対してＲａ−（ＣＨ
2 ）−Ｓｉ−（Ｏ−Ｒｂ）3 を３０ｇ／Ｌ投入したもの
を用いた。ここで、Ｒａはパーフルオロ基であり、Ｒｂ
はアミノ基である。この撥水処理剤に下地電極を形成し
たセラミック素体を２分間浸漬処理し、液切り、風乾し
た後、Ｎｉめっき、Ｓｎめっきを順次行なって積層セラ
ミックコンデンサを作製した。(Example 1) A ceramic body for a multilayer ceramic capacitor having a Cu base electrode formed as an external electrode was prepared. After the base electrode was baked, a water-repellent treatment agent was prepared to perform a water-repellent treatment. As a water repellent, Ra- (CH) is used for methyl ethyl ketone as an organic solvent.
2 ) The one charged with 30 g / L of -Si- (O-Rb) 3 was used. Here, Ra is a perfluoro group, and Rb
Is an amino group. The ceramic body on which the base electrode was formed was immersed in this water-repellent agent for 2 minutes, drained, air-dried, and then Ni-plated and Sn-plated sequentially to produce a multilayer ceramic capacitor.
【００２１】得られた積層セラミックコンデンサについ
て、断面構造における外部電極内部へのめっき皮膜形成
状態、半田付き性、および温度８５℃で湿度８５％の恒
温槽において４ＷＶ印加し、１０００時間経過後の絶縁
抵抗不良品数（耐湿負荷試験）を評価実施した。ここ
で、１ＷＶは積層セラミックコンデンサの定格電圧を示
し、４ＷＶは定格電圧の４倍の電圧を印加したことを示
す。比較例として、撥水処理を行わずにめっき皮膜を形
成した積層セラミックコンデンサ、および外部電極に樹
脂を含浸させた後にめっき皮膜を形成した積層セラミッ
クコンデンサについて、同様の評価を行なった。そし
て、その結果を表１に示した。表１の中の分数につい
て、分母は評価したサンプル数を示し、分子は各項目に
該当する積層セラミックコンデンサの不良個数を示す。With respect to the obtained multilayer ceramic capacitor, the state of formation of a plating film inside the external electrode in the cross-sectional structure, solderability, and application of 4 WV in a thermostat at a temperature of 85 ° C. and a humidity of 85%, and an insulation after a lapse of 1000 hours The number of defective resistors (moisture resistance load test) was evaluated and implemented. Here, 1 WV indicates the rated voltage of the multilayer ceramic capacitor, and 4 WV indicates that a voltage four times the rated voltage was applied. As comparative examples, the same evaluation was performed on a multilayer ceramic capacitor having a plating film formed thereon without performing a water-repellent treatment and a multilayer ceramic capacitor having a plating film formed after impregnating a resin into an external electrode. Table 1 shows the results. With respect to the fractions in Table 1, the denominator indicates the number of samples evaluated, and the numerator indicates the number of defective multilayer ceramic capacitors corresponding to each item.
【００２２】[0022]
【表１】 [Table 1]
【００２３】表１からわかるように、この発明の電極形
成方法を採用したものでは、電極内へのめっきの侵入は
なく、半田付き性も良好で、耐湿負荷試験においても絶
縁抵抗の劣化は見られなかった。それに対して、撥水処
理を行わなかったものでは、電極内へのめっきの侵入が
１００個のサンプルのうち１２個で発見された。また、
耐湿負荷試験においては、２００個のサンプルのうちの
５個で絶縁抵抗の劣化が見られた。また、樹脂を含浸さ
せたものでは、サンプル数１００個のうちの１個で半田
付き性が不良のものがあったが、これは外部電極表面の
樹脂が十分に除去されず、めっき皮膜の形成がよくなか
ったものであると考えられる。As can be seen from Table 1, when the electrode forming method of the present invention was adopted, there was no penetration of the plating into the electrodes, the solderability was good, and the deterioration of the insulation resistance was observed even in the moisture resistance load test. I couldn't. On the other hand, in the case where the water-repellent treatment was not performed, penetration of plating into the electrode was found in 12 out of 100 samples. Also,
In the moisture resistance load test, deterioration of the insulation resistance was observed in 5 out of 200 samples. In the case of resin impregnation, one of the 100 samples had poor solderability, but this was because the resin on the surface of the external electrode was not sufficiently removed and a plating film was formed. Is considered to be bad.
【００２４】このように、この発明の撥水処理を行うこ
とにより、吸着基として働くアミノ基により撥水処理剤
が外部電極に吸着され、外部電極のシール効果を得るこ
とができる。As described above, by performing the water-repellent treatment of the present invention, the water-repellent agent is adsorbed to the external electrode by the amino group acting as an adsorbing group, and a sealing effect of the external electrode can be obtained.
【００２５】（実施例２）実施例１と同様に、撥水処理
剤に下地電極を形成した積層セラミックコンデンサ用の
セラミック素体を２分間撥水処理剤に浸漬処理し、液切
り、風乾した。その後、セラミック素体をオーブンに入
れ、１００〜１２０℃で３０分間熱処理した。比較例と
して、実施例１と同様に、熱処理を行なわないで撥水処
理剤を吸着させたセラミック素体を準備した。そして、
量産工程でのハンドリングによる撥水処理剤の剥落を想
定して、これらのセラミック素体について、２Ｌポリポ
ットで６０ｒｐｍ、３０分間のバレル処理を行った。さ
らに、下地電極上にＮｉめっき、Ｓｎめっきを順次行な
って積層セラミックコンデンサを作製した。これらの積
層セラミックコンデンサについて、実施例１と同様にし
て、電極内へのめっきの侵入、半田付き性、耐湿負荷試
験を行ない、その結果を表２に示した。Example 2 In the same manner as in Example 1, a ceramic body for a laminated ceramic capacitor having a water-repellent agent and a base electrode formed thereon was immersed in the water-repellent agent for 2 minutes, drained, and air-dried. . Thereafter, the ceramic body was placed in an oven and heat-treated at 100 to 120 ° C. for 30 minutes. As a comparative example, as in Example 1, a ceramic body to which a water-repellent agent was adsorbed without performing heat treatment was prepared. And
Assuming that the water-repellent agent was peeled off during handling in the mass production process, these ceramic bodies were subjected to barrel processing at 60 rpm for 30 minutes using a 2 L polypot. Further, Ni plating and Sn plating were sequentially performed on the base electrode to produce a multilayer ceramic capacitor. For these multilayer ceramic capacitors, the penetration of plating into the electrodes, the solderability, and the moisture resistance load test were performed in the same manner as in Example 1, and the results are shown in Table 2.
【００２６】[0026]
【表２】 [Table 2]
【００２７】表２からわかるように、風乾のみの場合、
耐湿負荷試験において、サンプル数２００個のうちの２
個に電極内へのめっきの侵入が見られ、２００個のうち
の２個に絶縁抵抗の劣化が見られた。これは、バレル処
理によって、撥水処理剤皮膜が剥離したためであると考
えられる。それに対して、熱処理を行った場合、撥水処
理剤が縮重合して下地電極と共有結合し、バレル処理に
よっても撥水処理剤が剥離せず、耐湿負荷試験において
も絶縁抵抗の劣化は見られなかった。As can be seen from Table 2, in the case of air drying only,
In the moisture resistance load test, 2 out of 200 samples
In each case, penetration of plating into the electrode was observed, and in two of the 200 cases, deterioration of insulation resistance was observed. This is considered to be because the water-repellent treatment agent film was peeled off by the barrel treatment. On the other hand, when heat treatment is performed, the water-repellent agent is polycondensed and covalently bonds to the underlying electrode, the water-repellent agent does not peel off by the barrel treatment, and the insulation resistance is not deteriorated even in the moisture resistance load test. I couldn't.
【００２８】（実施例３）セラミック素体として、多孔
質のフェライト材からなるチップインダクタ用のセラミ
ック素体を準備した。このセラミック素体を用いて、実
施例１と同様に、外部電極に撥水処理を行ない、Ｎｉめ
っきおよびＳｎめっきを順次行なって、セラミック素体
の両端面に端子電極を形成した。比較例として、撥水処
理を行わないもの、吸着基としてカルボキシル基を用い
た撥水処理剤を使用したもの、および樹脂含浸を行なっ
たものを作製した。そして、実施例１と同様にして、電
極内へのめっきの侵入、半田付き性、耐湿負荷試験を行
ない、その結果を表３に示した。Example 3 A ceramic body for a chip inductor made of a porous ferrite material was prepared as a ceramic body. Using this ceramic body, a water-repellent treatment was performed on the external electrode and Ni plating and Sn plating were sequentially performed in the same manner as in Example 1 to form terminal electrodes on both end faces of the ceramic body. As comparative examples, those without water-repellent treatment, those with a water-repellent agent using a carboxyl group as an adsorbing group, and those with resin impregnation were produced. Then, in the same manner as in Example 1, plating intrusion into the electrode, solderability, and moisture resistance load test were performed, and the results are shown in Table 3.
【００２９】[0029]
【表３】 [Table 3]
【００３０】表３からわかるように、この発明の撥水処
理を施したものについては、電極内へのめっきの侵入は
なく、半田付き性も良好で、耐湿負荷試験においても絶
縁抵抗の劣化は見られなかった。それに対して、比較例
では、耐湿負荷試験において、絶縁抵抗が劣化したもの
が見られた。この点について、撥水処理を行なわなかっ
た場合には撥水性が得られず、カルボキシル基を含む撥
水処理剤を用いた場合には、外部電極に対する撥水処理
剤の吸着性が弱いためであると考えられる。また、樹脂
含浸の場合、フェライトの空隙は外部電極より小さく、
従来の樹脂では含浸が十分でないためであると考えられ
る。しかしながら、この発明の電極形成方法に用いられ
る撥水処理剤を用いた場合、撥水処理剤が外部電極に吸
着しやすく、十分に撥水効果を得ることができる。As can be seen from Table 3, with the water-repellent treatment of the present invention, there was no plating intrusion into the electrode, the solderability was good, and the insulation resistance deteriorated even in the moisture resistance load test. I couldn't see it. On the other hand, in the comparative example, in the moisture resistance load test, the insulation resistance was deteriorated. In this regard, water repellency is not obtained without performing the water repellent treatment, and when a water repellent containing a carboxyl group is used, the water repellent is weakly adsorbed to the external electrode. It is believed that there is. In the case of resin impregnation, the void of ferrite is smaller than the external electrode,
This is considered to be because impregnation is not sufficient with the conventional resin. However, when the water-repellent agent used in the electrode forming method of the present invention is used, the water-repellent agent is easily adsorbed to the external electrode, and a sufficient water-repellent effect can be obtained.
【００３１】[0031]
【発明の効果】この発明によれば、撥水処理剤が外部電
極に十分に吸着され、撥水効果が得られるため、めっき
液がセラミック素体に侵入することを防止することがで
きる。しかも、外部電極が形成されたセラミック素体を
撥水処理剤に浸漬して、乾燥するだけで、簡単にセラミ
ック電子部品を作製することができる。さらに、撥水処
理剤を乾燥した後、加熱して縮重合させれば、耐磨耗性
が大きく、製造工程において撥水処理剤皮膜を剥離しに
くくすることができる。したがって、セラミック電子部
品を量産する場合においても、めっき液の侵入による特
性劣化を防止することができる。また、多孔質のセラミ
ック素体を用いる場合においても、この発明の電極形成
方法を用いることにより、セラミック素体へのめっき液
の侵入を防ぐことができ、特性ばらつきの少ないセラミ
ック電子部品を得ることができる。According to the present invention, since the water-repellent agent is sufficiently adsorbed to the external electrode and a water-repellent effect is obtained, it is possible to prevent the plating solution from entering the ceramic body. Moreover, a ceramic electronic component can be easily manufactured only by immersing the ceramic body on which the external electrodes are formed in a water-repellent agent and drying. Further, if the water-repellent agent is dried and then subjected to polycondensation by heating, the abrasion resistance is high and the water-repellent agent film can be hardly peeled off in the manufacturing process. Therefore, even when mass-producing ceramic electronic components, it is possible to prevent deterioration of characteristics due to intrusion of the plating solution. Further, even when a porous ceramic body is used, by using the electrode forming method of the present invention, it is possible to prevent a plating solution from entering the ceramic body, and to obtain a ceramic electronic component with less characteristic variation. Can be.
【図１】この発明の製造方法が適用されるセラミック電
子部品の一例を示す斜視図である。FIG. 1 is a perspective view showing an example of a ceramic electronic component to which a manufacturing method of the present invention is applied.
【図２】図１に示すセラミック電子部品の断面図であ
る。FIG. 2 is a cross-sectional view of the ceramic electronic component shown in FIG.
１０ セラミック電子部品 １２ セラミック素体 １４ａ，１４ｂ 端子電極 １６ａ，１６ｂ 外部電極 １８ａ，１８ｂ めっき皮膜 DESCRIPTION OF SYMBOLS 10 Ceramic electronic component 12 Ceramic body 14a, 14b Terminal electrode 16a, 16b External electrode 18a, 18b Plating film
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 5E001 AB03 AF06 AH01 AH07 AJ03 5E062 FG01 FG07 5E070 AA01 AB02 EA01 5E082 AA01 AB03 BC19 GG10 GG26 GG28 JJ03 JJ15 JJ23 MM24 ──────────────────────────────────────────────────続 き Continued on front page F term (reference) 5E001 AB03 AF06 AH01 AH07 AJ03 5E062 FG01 FG07 5E070 AA01 AB02 EA01 5E082 AA01 AB03 BC19 GG10 GG26 GG28 JJ03 JJ24 JJ24
Claims (6)
の端面に形成される外部電極と、前記外部電極上に形成
されるめっき皮膜とを含むセラミック電子部品の製造方
法であって、 撥水処理剤によって前記セラミック素体に形成された前
記外部電極に撥水処理を施すことによりめっき液侵入防
止皮膜を形成する工程、および前記外部電極上にめっき
処理を施す工程を含み、 前記撥水処理剤は、前記外部電極との吸着性を良好にす
る官能基として水酸基、アミノ基、メルカプト基から選
ばれる少なくとも１種類からなる官能基と、疎水性を有
する官能基としてアルキル基、ビニル基、フェニル基、
パーフルオロ基から選ばれる少なくとも１種類からなる
官能基とを含むことを特徴とする、セラミック電子部品
の製造方法。1. A method for manufacturing a ceramic electronic component, comprising: a ceramic body; an external electrode formed on an end face of the ceramic body; and a plating film formed on the external electrode, the method comprising: A step of forming a plating solution intrusion prevention film by performing a water repellent treatment on the external electrode formed on the ceramic body with an agent, and a step of performing a plating process on the external electrode, Is a functional group consisting of at least one selected from a hydroxyl group, an amino group, and a mercapto group as a functional group for improving the adsorptivity with the external electrode, and an alkyl group, a vinyl group, and a phenyl group as a hydrophobic functional group. ,
And at least one functional group selected from perfluoro groups.
程の後に、加熱による前記撥水処理剤の縮重合により前
記外部電極と前記撥水処理剤とを共有結合させる工程を
含む、請求項１に記載のセラミック電子部品の製造方
法。2. The method according to claim 1, further comprising, after the step of forming the plating solution intrusion prevention film, a step of covalently bonding the external electrode and the water repellent agent by condensation polymerization of the water repellent agent by heating. 3. The method for manufacturing a ceramic electronic component according to claim 1.
と内部電極とからなる積層セラミック素体が用いられ
る、請求項１または請求項２に記載のセラミック電子部
品の製造方法。3. The method for manufacturing a ceramic electronic component according to claim 1, wherein a multilayer ceramic body including a ceramic and an internal electrode is used as the ceramic body.
面を有するセラミック素体が用いられる、請求項１また
は請求項２に記載のセラミック電子部品の製造方法。4. The method for manufacturing a ceramic electronic component according to claim 1, wherein a ceramic body having a porous surface is used as said ceramic body.
し、焼き付けたものであることを特徴とする、請求項１
ないし請求項４のいずれかに記載のセラミック電子部品
の製造方法。5. The external electrode according to claim 1, wherein an electrode paste is applied and baked.
A method for manufacturing a ceramic electronic component according to claim 4.
載のセラミック電子部品の製造方法で製造された、セラ
ミック電子部品。6. A ceramic electronic component manufactured by the method for manufacturing a ceramic electronic component according to claim 1.
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| GB0207150A GB2375546B (en) | 2001-03-26 | 2002-03-26 | Ceramic electronic part and method of producing the same |
| KR10-2002-0016395A KR100432182B1 (en) | 2001-03-26 | 2002-03-26 | Ceramic electronic part and method of producing the same |
| US10/107,099 US7005192B2 (en) | 2001-03-26 | 2002-03-26 | Ceramic electronic component and method of producing the same |
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|---|---|---|---|---|
| US8288924B2 (en) | 2008-12-26 | 2012-10-16 | Murata Manufacturing Co., Ltd. | Ceramic electronic component |
| US8587923B2 (en) | 2009-06-01 | 2013-11-19 | Murata Manufacturing Co., Ltd. | Laminated electronic component including water repellant and manufacturing method therefor |
| JP5892293B2 (en) * | 2014-01-20 | 2016-03-23 | 株式会社村田製作所 | Antenna parts |
| JP2021064702A (en) * | 2019-10-15 | 2021-04-22 | 株式会社村田製作所 | Coil component and manufacturing method thereof, and electronic component mounted with coil component |
| WO2022130739A1 (en) * | 2020-12-18 | 2022-06-23 | 株式会社村田製作所 | Electronic component and method for forming resin layer on electronic component |
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|---|---|---|---|---|
| KR100807217B1 (en) | 2006-07-28 | 2008-02-28 | 조인셋 주식회사 | Ceramic component and Method for the same |
-
2001
- 2001-03-26 JP JP2001086615A patent/JP3444290B2/en not_active Expired - Lifetime
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8288924B2 (en) | 2008-12-26 | 2012-10-16 | Murata Manufacturing Co., Ltd. | Ceramic electronic component |
| US8475866B2 (en) | 2008-12-26 | 2013-07-02 | Murata Manufacturing Co., Ltd. | Method for manufacturing ceramic electronic component |
| US8587923B2 (en) | 2009-06-01 | 2013-11-19 | Murata Manufacturing Co., Ltd. | Laminated electronic component including water repellant and manufacturing method therefor |
| JP5892293B2 (en) * | 2014-01-20 | 2016-03-23 | 株式会社村田製作所 | Antenna parts |
| JP2021064702A (en) * | 2019-10-15 | 2021-04-22 | 株式会社村田製作所 | Coil component and manufacturing method thereof, and electronic component mounted with coil component |
| JP7367447B2 (en) | 2019-10-15 | 2023-10-24 | 株式会社村田製作所 | Coil components and their manufacturing methods, and electronic components mounted with coil components |
| WO2022130739A1 (en) * | 2020-12-18 | 2022-06-23 | 株式会社村田製作所 | Electronic component and method for forming resin layer on electronic component |
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