CN1238873C - Ceramic electronic parts and its making method - Google Patents

Ceramic electronic parts and its making method Download PDF

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Publication number
CN1238873C
CN1238873C CNB021183112A CN02118311A CN1238873C CN 1238873 C CN1238873 C CN 1238873C CN B021183112 A CNB021183112 A CN B021183112A CN 02118311 A CN02118311 A CN 02118311A CN 1238873 C CN1238873 C CN 1238873C
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China
Prior art keywords
ceramic
electrode
finishing agent
waterproof finishing
forms
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CNB021183112A
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Chinese (zh)
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CN1379421A (en
Inventor
真田幸雄
齐藤芳则
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株式会社村田制作所
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Priority to JP2001086615A priority Critical patent/JP3444290B2/en
Priority to JP086615/01 priority
Priority to JP2001086616A priority patent/JP3444291B2/en
Priority to JP086616/01 priority
Application filed by 株式会社村田制作所 filed Critical 株式会社村田制作所
Publication of CN1379421A publication Critical patent/CN1379421A/en
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Publication of CN1238873C publication Critical patent/CN1238873C/en

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/228Terminals
    • H01G4/248Terminals the terminals embracing or surrounding the capacitive element, e.g. caps
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/1851Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1862Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by radiant energy
    • C23C18/1865Heat
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/1851Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1875Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment
    • C23C18/1882Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/43Electric condenser making
    • Y10T29/435Solid dielectric type
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155Manufacturing circuit on or in base
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31652Of asbestos
    • Y10T428/31663As siloxane, silicone or silane

Abstract

A ceramic electronic component having a ceramic member into which no plating intrudes, and a method of producing the ceramic electronic component by which the ceramic electronic component can be easily produced are provided. The ceramic electronic component contains a ceramic member, and terminal electrodes formed on both of end-faces of the ceramic member. Each terminal electrode comprises an external electrode, and a plating coat formed thereon. To produce the ceramic electronic component, the ceramic member having the external electrodes are dipped into a water-repelling agent, dried, and plated. The water-repelling agent contains a functional group which is readily adsorbed to the external electrodes and a hydrophobic functional group.

Description

Ceramic electron element and manufacture method thereof

Technical field

The present invention relates to ceramic electron element and manufacture method thereof, more particularly, relate to the ceramic electron element and the manufacture method thereof that on the end face of ceramic body, are formed with termination electrode.

Background technology

Ceramic electron element has the structure that is formed with the termination electrode of conductor conducting on the ceramic body of being made of conductor and ceramics insulator.Termination electrode is formed on the outer electrode on the end face of ceramic body and the plated film that externally forms on the electrode and constituting by sintering.Plated film can be for example anti-braze ability when obtaining soldering and the Ni plated film that forms.It also can be the plated film of the Sn that forms in order to have good braze ability or Sn/Pb etc.Such plated film is by being that the wet type galvanoplastic form with electroplate liquid at the enterprising electroplating of ceramic body.

In ceramic electron element, there is slight void at ceramic body itself, and, also there is slight void on the outer electrode by sintering formation.Under the situation that is formed with internal electrode on the ceramic body, also there is slight void on the interface of internal electrode and ceramics insulator.Therefore, when having sintering the ceramic body of outer electrode to be immersed in the electroplate liquid, electroplate liquid is invaded in the space of ceramic body and outer electrode and residual.

Electroplate liquid mainly is made up of the salt of various metals such as Ni, Sn or Sn/Pb.In case residual in ceramic body, then itself can play heterogeneous dielectric effect, its result, the characteristic of electronic component (for example static capacity and dielectric loss etc.) can produce difference.And, under the situation that moisture exists, shift as ion, become the reason that causes degradation under the insulating resistance value.

Invade in order to prevent such electroplate liquid, following method is for example arranged: have at sintering on the ceramic body of outer electrode behind the heat reactive resins such as infiltration siloxanes or phenolic resins, make resin solidification, remove the surface by grinding and go up unnecessary resin, or with the unnecessary resin of flush awaies such as solvent.By such method, the space of sealing ceramic body and outer electrode with resin is electroplated externally by wet type and to be formed plated film on the electrode surface.

Yet, in such method, need make the resin hot curing, need remove by methods such as grinding and washings by the unnecessary resin that hot curing sticks on the outer electrode.Like this, the method for infiltration resin exists problems such as manufacturing process's complexity, productivity ratio are low, cost height on ceramic body.

Have again, if on the ceramic electron element of finishing remaining synthetic resin, so, when on printed circuit board (PCB), electronic component being installed or after installing, when using under high temperature and high humidity environment, the resin that remains in the space can dissolve or qualitative change, can be detrimental to the reliability of electronic component.

Summary of the invention

Therefore, main purpose of the present invention is, provides a kind of plating bath can not invade the ceramic electron element in the ceramic body and can make the ceramic electron element manufacture method of such ceramic electron element easily.

The present invention is such ceramic electron element manufacture method, described ceramic component has ceramic body, at outer electrode that forms on the end face of described ceramic body and the plated film that on described outer electrode, forms, it is characterized in that this method comprises following operation: implement water-proofing treatment on the outer electrode on the described ceramic body to being formed on, form the film that prevents that plating bath from invading with waterproof finishing agent; On described outer electrode, implement electroplating processes; Described waterproof finishing agent is by Ra-(CH 2)-Si-(O-Rb) 3Expression, in the formula, Ra is the hydrophobic functional group that has that is selected from alkyl, vinyl, phenyl, perfluor base, Rb represents to be selected from the functional group that improves adsorptivity of hydroxyl, amino, sulfydryl, perhaps at least one be hydrolyzed into hydroxyl of the functional group that represents of Rb.

In the manufacture method of such ceramic electron element, when on ceramic body, carrying out water-proofing treatment, preferably use the group convert hydroxyl to be equivalent to 2~80% waterproof finishing agent of the group before the hydrolysis.

As ceramic body, can use ceramic body with porous surface.

After formation prevents film operation that electroplate liquid invades, can also have by heating to make the waterproof finishing agent polycondensation, and make outer electrode and the covalently bound operation of waterproof finishing agent thus.

Also have, as ceramic body, the available ceramic body of forming by pottery and internal electrode.

Outer electrode can form by for example coated electrode paste, sintering.

The present invention also comprises the ceramic electron element made from the manufacture method of the ceramic electron element of above-mentioned each record.

Manufacturing method according to the invention, by making the functional group that makes adsorptivity become good contained in the waterproof finishing agent, waterproof finishing agent is adsorbed on the outer electrode.By hydrophobic functional group contained in the waterproof finishing agent, prevented that electroplate liquid from infiltrating in the ceramic body.

Especially, by the adsorptivity functional group that hydroxyl, amino, sulfydryl play a part contained in the waterproof finishing agent, waterproofing agent is adsorbed on the outer electrode that forms on the ceramic body end face.Because the waterproof finishing agent that is adsorbed on the outer electrode comprises hydrophobic functional groups such as alkyl, vinyl, phenyl, perfluor base, invade ceramic body so can prevent electroplate liquid.

At Ra-(CH 2)-Si-(O-Rb) 3In the waterproof finishing agent of expression, convert the hydroxyl that has adsorptivity for electrode to, can improve the absorption affinity of waterproof finishing agent outer electrode by the functional group that Rb is represented.

At this moment, the group that converts hydroxyl to by use is equivalent to 2~80% waterproof finishing agent of the group before the hydrolysis, can obtain excellent waterproof effect.If 2% of the group of the group that converts hydroxyl to before less than hydrolysis, waterproof finishing agent does not just have enough adsorption effects, and if surpass 80%, then the adsorbance of waterproof finishing agent is too much, electroplates the adsorptivity variation.

Make after waterproof finishing agent is adsorbed on the outer electrode, heating makes the waterproof finishing agent polycondensation, and makes waterproof finishing agent and outer electrode covalent bond thus, can form the film that the anti-electroplate liquid of excellent in abrasion resistance is invaded.

In the ceramic electron element that uses such electrode method of formationing, in operation, can prevent that electroplate liquid from invading ceramic body to outside electrode plating, prevent variation because of the ceramic electron element characteristic of electroplate liquid generation.

As ceramic body, available ceramic body and the porous ceramic base substrate of being made up of pottery and internal electrode even such ceramic body is adsorbed on its surface by making waterproof finishing agent, also can prevent the electroplate liquid intrusion.

Even by the outer electrode that coated electrode paste, sintering form, also can prevent the electroplate liquid intrusion.

According to the present invention, because waterproof finishing agent is adsorbed on the outer electrode fully, produce waterproof effect, invade in the ceramic body so can prevent electroplate liquid.And, the ceramic body that is formed with outer electrode is immersed in the waterproof finishing agent, only drying just can be made ceramic electron element easily.Have again, make after the waterproof finishing agent drying, if the heating, make its polycondensation, can improve its resistance to wear, in manufacturing process, the waterproof finishing agent film is difficult for peeling off.Thereby, even under the situation of producing ceramic electron element in enormous quantities, also can prevent to cause the characteristic variation because of the intrusion of electroplate liquid.And even under the situation of using the porous ceramic base substrate, the electrode formation method of the application of the invention also can prevent electroplate liquid intrusion ceramic body, obtains the little ceramic electron element of property difference.

Description of drawings

Fig. 1 is the stereogram of an example of using the ceramic electron element of manufacture method of the present invention;

Fig. 2 is the cutaway view of ceramic electron element shown in Figure 1;

Embodiment

Above-mentioned purpose of the present invention, other purposes, feature and advantage, by below in conjunction with accompanying drawing, the detailed description that embodiments of the present invention are done can become clearer.

Fig. 1 is a stereogram of using an example of ceramic electron element of manufacture method of the present invention, and Fig. 2 is its cutaway view.Ceramic electron element 10 comprises ceramic body 12.As ceramic body 12, use for example multi-layer ceramic capacitor.The ceramic body 12 that multi-layer ceramic capacitor is used is by the material that prints electrode on ceramic green sheet, and sintering after a plurality of ceramic green sheet superimposed layers, the crimping is formed.

The ceramic body 12 that obtains like this have the internal electrode that forms by the sintered electrode material both ends of the surface staggered expose structure.On such both ends of the surface that the ceramic body 12 that internal electrode exposes arranged, form termination electrode 14a, 14b.Termination electrode 14a, 14b are made of outer electrode 16a, 16b and the plated film 18a, the 18b that form thereon respectively.Plated film 18a, 18b are not limited to 1 layer, can be multilayers.For example, externally the last Ni coating with anti-braze ability that forms of electrode 16a, 16b forms good Sn coating of braze ability and Sn/Pb coating etc. again.As ceramic body 2, can use chip inductor with and chip resistor with other ceramic bodies such as ceramic bodies.

Outer electrode 16a, 16b form by both ends of the surface coated electrode paste, the sintering at ceramic body 12.Owing to contain glass dust in the electrode paste, so by sintering, outer electrode forms loose structure.Use wet type the galvanoplastic externally last formation of electrode 16a, 16b plated film 18a, 18b again, still, at this moment, invade ceramic body 12, before electroplating work procedure, implement water-proofing treatment in order not make electroplate liquid pass through outer electrode 16a, 16b.

As the 1st execution mode, use following waterproof finishing agent.At the waterproof finishing agent that is used for implementing water-proofing treatment,, comprise and be selected from least a in hydroxyl, amino, the sulfydryl as the functional group that is adsorbed on easily on outer electrode 16a, the 16b.And in waterproof finishing agent, the hydrophobic functional groups as preventing electroplate liquid intrusion ceramic body 12 comprises select at least a from alkyl, vinyl, phenyl, perfluor base.

In such waterproof finishing agent, in waterproof finishing agent, flood, externally adhere to waterproof finishing agent, air-dry again on electrode 16a, the 16b by the ceramic body 12 that will be formed with outer electrode 16a, 16b, form anti-plating bath and invade film.At this moment, owing to comprise the functional group good in the waterproof finishing agent, can improve the absorption affinity of waterproof finishing agent to outer electrode 16a, 16b to the adsorptivity of electrode.

Then, by electroplating processes, the externally last formation of electrode 16a, 16b plated film 18a, 18b.In this electroplating work procedure, owing to externally adhered to waterproof finishing agent on electrode 16a, the 16b, so, by having the effect of hydrophobic functional group, can prevent that electroplate liquid is from the space intrusion ceramic body 12 of outer electrode 16a, 16b.Thereby the characteristic of ceramic body 12 can not change because of the intrusion of electroplate liquid.Can obtain not having the ceramic electron element 10 of property difference.

In waterproof finishing agent after dipping outer electrode 16a, the 16b, also can heat and make the waterproof finishing agent polycondensation, thereby make waterproof finishing agent and outer electrode 16a, 16b form covalent bond.By such processing, the powerful combination of waterproof finishing agent and outer electrode 16a, 16b can improve the abrasion performance of waterproof finishing agent, and the sealing of outer electrode 16a, 16b is maintained.

As ceramic body 12, it is self-evident to resemble the such material with compact texture of the dielectric of multi-layer ceramic capacitor, even the such material with loose structure of the ferrite of inductor also can use.That is, owing to can prevent electroplate liquid intrusion outer electrode by waterproof finishing agent, so, even porous ceramic base substrate 12 also can prevent in the electroplate liquid intrusion.Therefore, with the structure-irrelevant of ceramic body 12, can obtain can be owing to electroplate liquid is invaded and the ceramic electron element 10 of characteristic variations.

The waterproof finishing agent of the 2nd execution mode then, is described.Waterproof finishing agent Ra-(the CH that is used for water-proofing treatment 2)-Si-(O-Rb) 3Expression, in the formula, at least one of the functional group that Rb represents can be hydrolyzed and change into hydroxyl.This hydroxyl plays to be adsorbed on easily the functional group on outer electrode 16a, the 16b.Ra is the hydrophobic functional groups that prevents electroplate liquid intrusion ceramic body 12, for example, is select from alkyl, vinyl, phenyl, perfluor base at least a.At this moment, the group that converts hydroxyl to by use is equivalent to 2~80% waterproof finishing agent of the group before the hydrolysis, can obtain excellent waterproof effect.If 2% of the group of the base that converts hydroxyl to before less than hydrolysis then can not obtain the effect of sufficient waterproof finishing agent, if surpass 80%, so, the adsorbance of waterproof finishing agent is too much, causes electroplating degradation.Hydroxy radical content can be controlled by hydrolysis time.

The ceramic body 12 that is formed with outer electrode 16a, 16b is immersed in the above-mentioned waterproof finishing agent, externally adhere to waterproof finishing agent on electrode 16a, the 16b, carry out air-dryly again, just form the film that prevents that electroplate liquid from invading.At this moment, owing to contain the hydroxyl good in the waterproof finishing agent, can improve the absorption affinity of waterproof finishing agent to outer electrode 16a, 16b to the adsorptivity of electrode.

Then, by electroplating processes, the externally last formation of electrode 16a, 16b plated film 18a, 18b.In this electroplating work procedure, owing to externally adhere to waterproof finishing agent on electrode 16a, the 16b, so, by having the effect of hydrophobic functional group, can prevent the space intrusion ceramic body 12 of electroplate liquid from outer electrode 16a, 16b.Thereby the characteristic that can obtain ceramic body 12 can not change, not have the ceramic electron element 10 of property difference because of the intrusion of electroplate liquid.

And, in waterproof finishing agent, immerse after outer electrode 16a, the 16b, also can make the waterproof finishing agent polycondensation, and make waterproof finishing agent and outer electrode 16a, 16b covalent bond thus by heating.By such processing, can make the powerful combination of waterproof finishing agent and outer electrode 16a, 16b, improve the abrasion performance of waterproof finishing agent, and can keep the sealing of outer electrode 16a, 16b.

Like this, by making a part of OHization of waterproof finishing agent, the absorption base effect by this hydroxyl can make waterproof finishing agent be adsorbed on the metal.At this moment, by not making all waterproof finishing agent OHization, just have the waterproof finishing agent a little less than the adsorptivity of metal residually, have the OH base, can brute force be adsorbed on the electrode, and do not have OHization, adsorptivity state a little less than then keeping.Therefore infer, the waterproof finishing agent film ramify shape that forms on the outer electrode of ceramic body, and infer, by such areolation, be able in the plating adhesion of guaranteeing outer electrode, keep waterproof action.

Embodiment 1

Be ready to be formed with the ceramic body of using as the multi-layer ceramic capacitor of the Cu base stage of outer electrode.After the sintering base stage,, be ready to waterproof finishing agent in order to carry out water-proofing treatment.Waterproof finishing agent is by as the methyl ethyl ketone of organic solvent and the Ra-(CH of 30g/L 2)-Si-(O-Rb) 3Make.Here, Ra is the perfluor base, and Rb is amino.The ceramic body that will be formed with base stage impregnation process base 2 minutes in this waterproof finishing agent removes liquid, air-dry after, plating Ni, plating Sn carry out successively, make multi-layer ceramic capacitor.

For the gained multi-layer ceramic capacitor, estimate its in cross section structure plated film externally electrode interior formation state, solder attachment, and in the thermostat of 85 ℃ of temperature, humidity 85%, apply 4WV, the insulation resistance substandard products number (moisture-proof load test) after through 1000 hours.Here, 1WV represents the rated voltage of multi-layer ceramic capacitor, and 4WV represents to apply 4 times voltage of rated voltage.As a comparative example, the multi-layer ceramic capacitor that has formed plated film after not making water-proofing treatment, be formed with the multi-layer ceramic capacitor of plated film and externally soak into resin on the electrode is carried out same evaluation.Table 1 illustrates its result.In the table 1, denominator is represented the number of samples estimated, divides the substandard products number of the multi-layer ceramic capacitor of subrepresentation projects.

Table 1 The present invention No water-proofing treatment Soak into resin Electroplate and invade in the electrode ??0/100 ??12/100 ??0/100 Braze ability ??0/100 ??0/100 ??1/100 Moisture-proof load test (insulation resistance variation number) ? ??0/200 ? ??5/200 ? ??1/200

As known from Table 1, adopt the sample of electrode formation method of the present invention, plating bath can not invaded in the electrode, and braze ability is also good, in the moisture-proof load test, does not see the insulation resistance variation yet.In contrast, do not make the sample of water-proofing treatment, the situation that plating bath is invaded in the electrode is found 12 in 100 samples.And, in the moisture-proof load test, 5 insulation resistance variation are arranged in 200 samples.In the sample that has soaked into resin, there is 1 brazing property not good in 100 samples, this may be that the resin of external electrode surface is not fully removed, so can not form plated film well.

Like this, by water-proofing treatment of the present invention, the amino by playing the effect of absorption base is adsorbed on the outer electrode waterproof finishing agent, thereby can obtains the sealing effectiveness of outer electrode.

Embodiment 2

The same with embodiment 1, the multi-layer ceramic capacitor that will be formed with base stage removes liquid with ceramic body impregnation process in waterproof finishing agent after 2 minutes, and is air-dry.Then, ceramic body is put into stove, heat treatment is 30 minutes in 100~120 ℃.As a comparative example, identical with embodiment 1, be ready to not heat-treat, adsorbed the ceramic body of waterproof finishing agent.Then, consider waterproof finishing agent can since the operation in the batch process peel off, with these ceramic idiosomes in the 2L plastic tank with 60rpm scroll process 30 minutes.On base stage, plate Ni, plating Sn more successively, make multi-layer ceramic capacitor.For these multi-layer ceramic capacitors, the same with embodiment 1, with regard to plating bath invade in the electrode, braze ability, moisture-proof load test estimate, and the results are shown in table 2.

Table 2 Only air-dry Through Overheating Treatment Plating bath is invaded in the electrode ??2/100 ??0/100 Braze ability ??0/100 ??0/100 Moisture-proof load test (insulation resistance variation number) ? ??2/200 ? ??0/200

As shown in Table 2, being under the air-dry situation, in the moisture-proof load test, there are 2 plating baths to invade in the electrodes 2 insulation resistance variation in 200 samples.This may be owing to scroll process, the cause that the waterproof finishing agent film is peeled off.In contrast, under the situation of heat-treating, the waterproof finishing agent polycondensation, with the base stage covalent bond, even scroll process, waterproof finishing agent is not peeled off yet, and in the moisture-proof load test, does not see the insulation resistance variation yet.

Embodiment 3

Be ready to the ceramic body used by the chip inductor that the porous iron ferrite is formed.Use this ceramic body, the same with embodiment 1, outer electrode is carried out water-proofing treatment, plate Ni and Sn successively, on the ceramic body both ends of the surface, form termination electrode.As a comparative example, make the sample do not carry out water-proofing treatment, used with carboxyl as the sample of the waterproofing agent of absorption base and soaked into the sample of resin.Then, identical with embodiment 1, with regard to plating bath invade in the electrode, braze ability, moisture-proof load test estimate, and the results are shown in table 3.

Table 3 The present invention No water-proofing treatment Carboxyl Soak into resin Plating bath is invaded in the electrode ??0/100 ??1/100 ??1/100 ??0/100 Braze ability ??0/100 ??0/100 ??0/100 ??3/100 Moisture-proof load test (insulation resistance variation number) ? ??0/200 ? ??8/200 ? ??2/200 ? ??6/200

As shown in Table 3, carried out the sample of water-proofing treatment of the present invention, plating bath can not invaded in the electrode, and braze ability is also good, does not see the insulation resistance variation in the moisture-proof load test yet.In contrast, in comparative example, in the moisture-proof load test, see the sample of insulation resistance variation.This may be can not obtain water proofing property under the situation of not carrying out water-proofing treatment, and comprises the cause a little less than to the adsorptivity of outer electrode of waterproof finishing agent under the situation of waterproof finishing agent of carboxyl in use.Under the situation of having soaked into resin, ferritic void ratio outer electrode little, this may be the cause that can not fully soak into existing resin.Yet under the situation of used waterproof finishing agent, waterproof finishing agent is adsorbed on the outer electrode easily, can obtain sufficient waterproof effect in using electrode formation method of the present invention.

Embodiment 4

Be ready to be formed with the ceramic body of using as the multi-layer ceramic capacitor of the Cu base stage of outer electrode.After the sintering base stage,, prepared waterproof finishing agent in order to carry out water-proofing treatment.Waterproof finishing agent is by Ra-(CH 2)-Si-(O-Rb) 3Expression.This waterproof finishing agent is joined in the isopropyl alcohol that contains moisture, and concentration is 30g/L, carries out CH 3Hydrolysis.Isopropyl alcohol is a water-soluble solvent, is that hydrolysis is necessary.Ra has been the perfluor base of hydrophobic functional groups effect.

Carry out CH 3After the hydrolysis, obtain-the OH growing amount from the chemical shift that obtains with X linear light electricity spectroscopy apparatus.In the inorganic agent of making, the OCH of 2%, 10%, 50%, 80%, 90% in the inorganic agent originally 3Converted hydroxyl to.The ceramic body that will be formed with base stage immerses in this waterproof finishing agent to be handled 2 minutes, removed liquid, air-dry after, electroplated Ni, Sn make multi-layer ceramic capacitor successively.

For the multi-layer ceramic capacitor of gained, with regard to plated film in its cross section structure externally formation state, the Ni plated film of electrode interior continuity, braze ability and temperature be 85 ℃, humidity be apply 4WV in 85% the thermostat, insulation resistance substandard products number (moisture-proof load test) after through 1000 hours estimates.Here, 1WV represents the rated voltage of stacked capacitor, and 4WV represents to apply 4 times voltage of rated voltage.As a comparative example, to do not carry out water-proofing treatment, be formed with film multi-layer ceramic capacitor, used not with Ra-(CH 2)-Si-(O-Rb) 3CH 3The multi-layer ceramic capacitor of the inorganic agent of hydrolysis and soaked into externally that film forming multi-layer ceramic capacitor carries out same evaluation behind the resin on the electrode.Table 4 shows its result.In the table 4, denominator is represented the sample number estimated, divides the substandard products number of the stacked capacitor of subrepresentation projects.

Table 4 Plating bath is invaded in the electrode N plated film i continuity Braze ability The moisture-proof load test Sample is counted n=100 Sample is counted n=100 Sample is counted n=200 Sample is counted n=200 The OH base unit weight ??2% ??0/100 ??0/100 ??0/200 ??0/200 ??10% ??0/100 ??0/100 ??0/200 ??0/200 ??50% ??0/100 ??0/100 ??0/200 ??0/200 ??80% ??0/100 ??0/100 ??0/200 ??0/200 ??90% ??0/100 ??7/100 ??10/200 ??2/200 No water-proofing treatment ??12/100 ??0/100 ??0/200 ??7/200 No hydrolysis ??13/100 ??0/100 ??0/200 ??5/200 Soak resinous ??0/100 ??2/100 ??4/200 ??1/200

As shown in Table 4, adopt the sample of electrode formation method of the present invention, plating bath can not invaded in the electrode, and the continuity of Ni plated film and brazing property also be can't see the insulation resistance variation in the moisture-proof load test.In contrast, at the sample that does not carry out water-proofing treatment with use in the sample of unhydrolyzed inorganic agent, find to have plating bath to invade in the electrode, also have the insulation resistance variation.At the sample that has soaked into resin with to use the OH base unit weight be in the sample of 90% waterproof finishing agent, find to have Ni plated film continuity and braze ability bad.This may be the resin of external electrode surface fully do not removed or the adhesion amount of waterproofing agent too much, cause the Ni plated film to fail the good cause that forms.

Like this, by water-proofing treatment of the present invention, the hydroxyl by playing the effect of absorption base is adsorbed on the outer electrode waterproof finishing agent, thereby can obtains the sealing effectiveness of outer electrode.But if the further hydrolysis of waterproofing agent makes OH base content surpass 80%, then the absorption quantitative change of waterproofing agent is many, and waterproof effect is too high, electroplates the adhesion property variation.And when OH base content less than 2% the time, the adsorbance of waterproof finishing agent diminishes, and can not obtain sufficient waterproof effect.Therefore, the OH of waterproof finishing agent base content is preferably in 2~80% scopes.

Embodiment 5

The same with embodiment 4, the ceramic body that the multi-layer ceramic capacitor that is formed with base stage is used flooded 2 minutes in the waterproof finishing agent of hydrolysis, removed liquid, carried out air-dry.Then, ceramic body is put into stove, 100~120 ℃ of heating 30 minutes.As a comparative example, the same with embodiment 4, be ready to the ceramic body of not doing heat treatment, having adsorbed the waterproof finishing agent of hydrolysis.Then, consider waterproof finishing agent can since the operation in the batch process peel off, with these ceramic bodies in the 2L plastic tank with 60rpm scroll process 30 minutes.Electroplated Ni, Sn successively on base stage make multi-layer ceramic capacitor again.For these multi-layer ceramic capacitors, the same with embodiment 4, with regard to its plating bath invade in electrode, Ni plated film continuity, braze ability, moisture-proof load test estimate, the result is shown in the table 5.

Table 5 Plating bath is invaded in the electrode Ni plated film continuity Braze ability The moisture-proof load test Sample is counted n=100 Sample is counted n=100 Sample is counted n=200 Sample is counted n=200 Heat treatment The OH base unit weight ??2% ??0/100 ??0/100 ??0/200 ??0/200 ??10% ??0/100 ??0/100 ??0/200 ??0/200 ??50% ??0/100 ??0/100 ??0/200 ??0/200 ??80% ??0/100 ??0/100 ??0/200 ??0/200 ??90% ??0/100 ??4/100 ??12/200 ??2/200 Only air-dry The OH base unit weight ??2% ??0/100 ??0/100 ??0/200 ??3/200 ??10% ??0/100 ??0/100 ??0/200 ??2/200 ??50% ??0/100 ??0/100 ??0/200 ??1/200 ??80% ??0/100 ??0/100 ??0/200 ??1/200 ??90% ??0/100 ??0/100 ??0/200 ??2/200

As shown in Table 5, under only air-dry situation, in the moisture-proof load test, find to have the insulation resistance variation.This may be the cause of peeling off through scroll process owing to the waterproof finishing agent film.In contrast, carrying out under the heat treated situation, the waterproof finishing agent polycondensation, with the base stage covalent bond, even scroll process, waterproof finishing agent is not peeled off yet, and does not find that in the moisture-proof load test insulation resistance descends yet.

Claims (8)

1. the manufacture method of a ceramic electron element, described ceramic electron element have ceramic body, at outer electrode that forms on the end face of this ceramic body and the plated film that on this outer electrode, forms,
Described method comprises following operation:
With waterproof finishing agent the above-mentioned outer electrode that is formed on the ceramic body is carried out water-proofing treatment, forms the film that prevents that plating bath from invading,
This outer electrode is carried out electroplating processes;
It is characterized in that described waterproof finishing agent is by formula Ra-(CH 2)-Si-(O-Rb) 3Expression, in the formula, Ra represents to be selected from the hydrophobic group of alkyl, vinyl, phenyl, perfluor base, and Rb represents to be selected from the functional group that improves adsorptivity of hydroxyl, amino, sulfydryl.
2. the manufacture method of a ceramic electron element, described ceramic electron element have ceramic body, at outer electrode that forms on the end face of this ceramic body and the plated film that on this outer electrode, forms,
Described method comprises following operation:
With waterproof finishing agent the above-mentioned outer electrode that is formed on the ceramic body is carried out water-proofing treatment, forms the film that prevents that plating bath from invading,
This outer electrode is carried out electroplating processes;
It is characterized in that described waterproof finishing agent is by Ra-(CH 2)-Si-(O-Rb) 3Expression, in the formula, Ra represents to be selected from the hydrophobic group of alkyl, vinyl, phenyl, perfluor base, and at least one among the Rb is the group that can be hydrolyzed into hydroxyl.
3. method according to claim 2 is characterized in that, when ceramic body is carried out water-proofing treatment, uses the above-mentioned group that converts hydroxyl to be equivalent to the waterproof finishing agent of the 2-80% of the preceding group of hydrolysis.
4. method according to claim 1 and 2 is characterized in that described ceramic body has porous surface.
5. method according to claim 1 and 2 is characterized in that, after the operation that is formed for preventing the film that plating bath is invaded, also have by heating make above-mentioned waterproof finishing agent polycondensation, with outer electrode and the covalently bound operation of waterproof finishing agent.
6. method according to claim 1 and 2 is characterized in that, described ceramic body is made up of pottery and internal electrode.
7. method according to claim 1 and 2 is characterized in that, described outer electrode forms by coated electrode paste, sintering.
8. ceramic electron element, it has ceramic body, at outer electrode that forms on the end face of this ceramic body and the plated film that forms on this outer electrode, it is characterized in that it carried out processing with claim 1 or 2 described element approach.
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US7152291B2 (en) 2002-04-15 2006-12-26 Avx Corporation Method for forming plated terminations
US7345868B2 (en) * 2002-10-07 2008-03-18 Presidio Components, Inc. Multilayer ceramic capacitor with terminal formed by electroless plating
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US9042079B2 (en) * 2012-08-24 2015-05-26 Tdk Corporation Ceramic electronic component
KR20140039016A (en) * 2014-02-27 2014-03-31 삼성전기주식회사 Multi-layered ceramic capacitor and board for mounting the same
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