JPH02294007A - Formation of ceramic electronic component electrode - Google Patents

Abstract

PURPOSE:To prevent the development of cracks and the penetration of glass component and simplify manufacturing processes by depositing metallic resinates on the surface or both end parts of a ceramic element assembly and, in addition to performing baking treatment of its element assembly, forming it as an active film. CONSTITUTION:Metallic resinates such as Pd, Au, Pt, Rh and the like which have heat-resisting properties that are free from deterioration caused by high temperature are deposited at both end parts where external electrodes of each ceramic laminated substance are formed. After that, an organic solvent is made to scatter and at the same time, the metallic resinates are formed as active films by applying baking treatment to a green ceramic laminated substance at a temp. as 1300-1400 deg.C. When plating treatment is performed for the sintered ceramic laminated substance with electric plating or electroless plating, a plating film which forms the external electrodes at both end parts of the ceramic laminated substance is formed only at parts of the active films formed by the metallic resinates. A yieldin1g rate is thus improved without developing cracks and also lowering the junction strength of the electrodes as well.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for forming electrodes that is applied to manufacturing ceramic electronic components such as multilayer capacitors. Conventional Technology Conventionally, electroplating or electroless plating methods, which are cheaper than silver paste baking methods, have been widely used to form electrodes for ceramic electronic components. Also, when applying these plating methods,
Normally, a plating film is formed on the entire surface and unnecessary parts must be removed by etching or polishing after the fact.
It has been proposed to form an electrode layer only on the surface or both ends of a ceramic body by applying a metal activation paste to the surface or both ends on which the electrode layer is to be formed and then plating it (Japanese Patent Application Laid-Open No. No. 63-246809). The electrode formation method using the plating method involves first obtaining a green ceramic body by firing it at a predetermined temperature, and then attaching an Ag-Pd alloy containing glass frit or Ag to both ends of the ceramic body. Usually, an active film is formed by attaching a metal paste such as and applying a baking process, followed by a process of laminating an electrode layer using a plating process. Problems to be Solved by the Invention However, in the method described above, since the activation paste is attached to the ceramic body after firing, the glass frit in the electrode paste penetrates into the ceramic body, causing cracks during the firing process. Furthermore, the glass components that have penetrated into the ceramic body due to the acid or alkali in the plating solution are eluted, reducing the adhesive strength of the electrode layer. Furthermore, in the above-mentioned process, in addition to firing the ceramic body, the activation paste must also be fired, so that the heat treatment takes time and inevitably increases costs.

An object of the present invention is to provide a method for forming electrodes of ceramic electronic components, which improves reliability in terms of moisture resistance, etc., and can form electrode layers with high adhesive strength at low cost through relatively simple steps. Suppose that Means for Solving the Problems In the method for forming electrodes of ceramic electronic components according to the present invention, P is applied to the surface or both ends of the ceramic body before firing.
After attaching a heat-resistant metal resinate such as d, Au, Pt, Rh, etc., the ceramic body is subjected to firing treatment to obtain a ceramic body with an active film of metal resinate baked on the surface or both ends. Later, an electrode layer was formed on the surface or both ends of the ceramic body by electroplating or electroless plating.

Function: In this method of forming electrodes for ceramic electronic components, metal resinate is attached to the surface or both ends of the ceramic body and formed as an active film during the firing process of the ceramic body, so glass components that can cause cracks and a decrease in electrode strength are removed. does not penetrate into the ceramic body, and the process of baking the metal resinate can be omitted, which simplifies the process and reduces costs.

Example This electrode forming method can be applied to manufacturing ceramic electronic components such as multilayer capacitors, and it is
aTiO. It can be manufactured using dielectric ceramic materials such as SrTi03C a T t O 3 series. First, Pd, Pd-A was applied to the green sheet of the telephone porcelain material.
Internal electrodes are formed from g-alloy, Cu, Ni, etc., and a plurality of green sheets are laminated to obtain a green ceramic laminate having internal electrodes connected in parallel at both ends. next,
Both ends of the ceramic laminate forming external electrodes include Pd, Au. Attach a heat-resistant metal resinate such as Pt or Rh that does not deteriorate at high temperatures by jabbing or the like. After that, 1300 to 1400 was applied to the green ceramic laminate.
By applying a baking treatment at about ℃, the organic solvent is scattered and at the same time, the metal resinate is formed as an active film. If this sintered ceramic laminate is plated by electroplating or electroless plating, it is possible to form plating films that will serve as external electrodes at both ends only in the areas where the active film of metal resinate is to be formed.

If the end electrodes of ceramic electronic components are formed in this way, the glass component of the active film will not penetrate into the ceramic body, so cranks will not occur near the bottom of the molded end electrode layer, and moreover, the glass component will not penetrate into the ceramic body. There is no possibility that the electrode layer will be eluted due to acid or alkali in the plating solution, so the strength of the electrode will not be reduced. In addition to this,
Since the metal resinate can also be baked in the firing process of the ceramic laminate, the manufacturing process can also be shortened.

A multilayer capacitor was manufactured according to the process under the following conditions,
In order to compare with conventional multilayer capacitors, we determined the occurrence of cracks and the moisture resistance load, and obtained the results shown in the attached table.

As a first embodiment of the present invention: A green sheet is used to form an internal electrode of Pd on a B a T 10 s-based telephone porcelain material, and a plurality of sheets are laminated to form a green sheet with an internal electrode. A ceramic laminate was obtained, and after adhering Pd resinate to both ends by jabbing, it was fired at 1300 to 1400°C, and finally Ni. The end electrode layer was formed with a plating film consisting of two layers of Sn. As a second example of the present invention: The same materials as in the first example were used for the ceramic laminate and the metal resinate, and the same treatments were performed up to the firing process of the ceramic laminate.

In forming the end electrode layer, a plated film was formed by depositing Cu by electroless plating.

As a conventional method: Internal electrodes were formed using Pd using green sheets of BaTi03-based dielectric ceramic material, and a plurality of sheets were laminated to obtain a green ceramic laminate having internal electrodes. This is then fired at 1,300 to 1,400°C to adhere Ag-Pd paste to both ends, then baked at aOO°C, and finally two layers of Ni and Sn are electroplated to form the ends. An electrode layer was formed. For the multilayer capacitors obtained in Example 1.2 of the present invention and the conventional method, the humidity load was 40°C, 95% RH 50
Confirmed by applying VDC.

(Table) From the test results, it can be seen that the multilayer capacitor according to Example 1.2 of the present invention not only does not generate cracks but also has excellent moisture load resistance.

In addition, although the above-mentioned embodiment illustrated the case of manufacturing a multilayer capacitor, it can also be applied to the case of manufacturing ceramic electronic components such as resistors and thermistors. Effects of the Invention As described above, according to the method for forming electrodes of ceramic electronic components according to the present invention, the yield can be improved without causing cracks or deterioration of the bonding strength of the electrodes, and the process can be simplified. This makes it possible to reduce costs by making it possible to reduce costs.

Claims (1)

[Claims] Pd and A are applied to the surface or both ends of the ceramic body before firing.
After attaching a heat-resistant metal resinate such as U, Pt, Rh, etc., the ceramic body is subjected to a firing process to obtain a ceramic body with an active film of metal resinate baked on the surface or both ends. 1. A method for forming electrodes for ceramic electronic components, which comprises forming an electrode layer on the surface or both ends of a ceramic body by plating or electroless plating.