JPS6464292A - Manufacture of printed board - Google Patents
Manufacture of printed boardInfo
- Publication number
- JPS6464292A JPS6464292A JP22280287A JP22280287A JPS6464292A JP S6464292 A JPS6464292 A JP S6464292A JP 22280287 A JP22280287 A JP 22280287A JP 22280287 A JP22280287 A JP 22280287A JP S6464292 A JPS6464292 A JP S6464292A
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- resist ink
- same plane
- ink
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22280287A JPS6464292A (en) | 1987-09-03 | 1987-09-03 | Manufacture of printed board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22280287A JPS6464292A (en) | 1987-09-03 | 1987-09-03 | Manufacture of printed board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6464292A true JPS6464292A (en) | 1989-03-10 |
Family
ID=16788124
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22280287A Pending JPS6464292A (en) | 1987-09-03 | 1987-09-03 | Manufacture of printed board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6464292A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05267829A (ja) * | 1992-03-23 | 1993-10-15 | Nec Corp | 印刷配線板及びその製造方法 |
WO2003100850A1 (fr) * | 2002-05-28 | 2003-12-04 | Hitachi Chemical Co., Ltd. | Substrat, tableau de connexions, substrat pour boitier a semi-conducteur, boitier a semi-conducteur et leurs procedes de production |
-
1987
- 1987-09-03 JP JP22280287A patent/JPS6464292A/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05267829A (ja) * | 1992-03-23 | 1993-10-15 | Nec Corp | 印刷配線板及びその製造方法 |
WO2003100850A1 (fr) * | 2002-05-28 | 2003-12-04 | Hitachi Chemical Co., Ltd. | Substrat, tableau de connexions, substrat pour boitier a semi-conducteur, boitier a semi-conducteur et leurs procedes de production |
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