JPS6462495A - Pretreatment for plating of molybdenum - Google Patents
Pretreatment for plating of molybdenumInfo
- Publication number
- JPS6462495A JPS6462495A JP21948787A JP21948787A JPS6462495A JP S6462495 A JPS6462495 A JP S6462495A JP 21948787 A JP21948787 A JP 21948787A JP 21948787 A JP21948787 A JP 21948787A JP S6462495 A JPS6462495 A JP S6462495A
- Authority
- JP
- Japan
- Prior art keywords
- stock
- plating
- subjected
- pretreatment
- stage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
PURPOSE:To obtain an Mo material with which stable plating, brazing and soldering of high adhesive strength to an Mo material having poor platability can be easily executed by first subjecting the Mo stock to a heat treatment for reduction then subjecting the same to plating of Ni or Cu followed by a diffusion heat treatment. CONSTITUTION:The Mo stock 1 coated with firm scale 2 is held for 10min in a reducing atmosphere furnace kept at 800-1,000 deg.C by which the stock is subjected to the heat treatment for reduction (1st stage) and the scale 2 is removed therefrom. This stock 1 is then rapidly subjected to Ni or Cu plating to <=1mum in order to prevent the oxidation thereof (2nd stage). The stock 1 coated with this plating layer 3 is subjected to the diffusion treatment by holding the same for >=10min in a non-oxidation atmosphere kept at 800-1,000 deg.C (3rd stage) to form a diffused layer 4 so that the plating layer 3 and the stock 1 are securely adhered to each other. The above-mentioned 1st-3rd stages are the pretreatment for plating. The stable plating layer 5 or the like having the high adhesive power is easily obtd. on the Mo material subjected to such pretreatment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21948787A JPS6462495A (en) | 1987-09-01 | 1987-09-01 | Pretreatment for plating of molybdenum |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21948787A JPS6462495A (en) | 1987-09-01 | 1987-09-01 | Pretreatment for plating of molybdenum |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6462495A true JPS6462495A (en) | 1989-03-08 |
Family
ID=16736214
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21948787A Pending JPS6462495A (en) | 1987-09-01 | 1987-09-01 | Pretreatment for plating of molybdenum |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6462495A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009235455A (en) * | 2008-03-26 | 2009-10-15 | Nippon Telegr & Teleph Corp <Ntt> | Method of forming metallic structure |
| CN102367583A (en) * | 2011-08-01 | 2012-03-07 | 安徽华东光电技术研究所 | Nickel plating process for molybdenum parts |
| CN103132112A (en) * | 2013-03-11 | 2013-06-05 | 浙江正邦电力电子有限公司 | Molybdenum plate nickel plating method for silicon power electronic device |
| CN104593842A (en) * | 2015-01-07 | 2015-05-06 | 上海应用技术学院 | Method for preparing metal coating on molybdenum substrate |
-
1987
- 1987-09-01 JP JP21948787A patent/JPS6462495A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009235455A (en) * | 2008-03-26 | 2009-10-15 | Nippon Telegr & Teleph Corp <Ntt> | Method of forming metallic structure |
| CN102367583A (en) * | 2011-08-01 | 2012-03-07 | 安徽华东光电技术研究所 | Nickel plating process for molybdenum parts |
| CN103132112A (en) * | 2013-03-11 | 2013-06-05 | 浙江正邦电力电子有限公司 | Molybdenum plate nickel plating method for silicon power electronic device |
| CN104593842A (en) * | 2015-01-07 | 2015-05-06 | 上海应用技术学院 | Method for preparing metal coating on molybdenum substrate |
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