JPS6462337A - Burr-proof agent for semiconductor resin sealing and filler for semiconductor resin sealing containing same - Google Patents
Burr-proof agent for semiconductor resin sealing and filler for semiconductor resin sealing containing sameInfo
- Publication number
- JPS6462337A JPS6462337A JP21650987A JP21650987A JPS6462337A JP S6462337 A JPS6462337 A JP S6462337A JP 21650987 A JP21650987 A JP 21650987A JP 21650987 A JP21650987 A JP 21650987A JP S6462337 A JPS6462337 A JP S6462337A
- Authority
- JP
- Japan
- Prior art keywords
- burr
- resin sealing
- proof agent
- semiconductor resin
- filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Inorganic Insulating Materials (AREA)
Abstract
PURPOSE:To provide a burr-proof agent effective without reducing spiral flow, to be used in sealers or electrical insulating materials for electronic parts such as semiconductors, consisting of inorganic powder with specific size distribution. CONSTITUTION:The objective burr-proof agent consisting of inorganic powder (e.g. crystalline silica, calcium silicate) with an average size of 0.6-5mum, content of the particles with a size <=1mum being 10-80wt.% and content of the particles with a size <=2mum being 20-90wt.%. The other objective filler consisting of (A) 85-99.5wt.% of base filler with an average particle size of 10-30mum and (B) 0.5-15wt.% of the above burr-proof agent.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21650987A JP2505485B2 (en) | 1987-09-01 | 1987-09-01 | Additive for semiconductor resin encapsulation |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21650987A JP2505485B2 (en) | 1987-09-01 | 1987-09-01 | Additive for semiconductor resin encapsulation |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7314998A Division JP2601255B2 (en) | 1995-12-04 | 1995-12-04 | Filler for semiconductor resin sealing |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6462337A true JPS6462337A (en) | 1989-03-08 |
JP2505485B2 JP2505485B2 (en) | 1996-06-12 |
Family
ID=16689543
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21650987A Expired - Lifetime JP2505485B2 (en) | 1987-09-01 | 1987-09-01 | Additive for semiconductor resin encapsulation |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2505485B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0347827A (en) * | 1989-04-22 | 1991-02-28 | Matsushita Electric Works Ltd | Epoxy resin composition |
EP0531656A2 (en) * | 1991-09-11 | 1993-03-17 | Mitsubishi Denki Kabushiki Kaisha | Low-shrinkage unsaturated wet type polyester resin (B.M.C.) formulation composition having high thermal conductivity and molded circuit breaker and parts formed therefrom |
JP2003048957A (en) * | 2001-08-07 | 2003-02-21 | Sumitomo Bakelite Co Ltd | Epoxy resin composition |
-
1987
- 1987-09-01 JP JP21650987A patent/JP2505485B2/en not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0347827A (en) * | 1989-04-22 | 1991-02-28 | Matsushita Electric Works Ltd | Epoxy resin composition |
EP0531656A2 (en) * | 1991-09-11 | 1993-03-17 | Mitsubishi Denki Kabushiki Kaisha | Low-shrinkage unsaturated wet type polyester resin (B.M.C.) formulation composition having high thermal conductivity and molded circuit breaker and parts formed therefrom |
JP2003048957A (en) * | 2001-08-07 | 2003-02-21 | Sumitomo Bakelite Co Ltd | Epoxy resin composition |
Also Published As
Publication number | Publication date |
---|---|
JP2505485B2 (en) | 1996-06-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
EXPY | Cancellation because of completion of term | ||
FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 12 Free format text: PAYMENT UNTIL: 20080402 |