JPS6462337A - Burr-proof agent for semiconductor resin sealing and filler for semiconductor resin sealing containing same - Google Patents

Burr-proof agent for semiconductor resin sealing and filler for semiconductor resin sealing containing same

Info

Publication number
JPS6462337A
JPS6462337A JP21650987A JP21650987A JPS6462337A JP S6462337 A JPS6462337 A JP S6462337A JP 21650987 A JP21650987 A JP 21650987A JP 21650987 A JP21650987 A JP 21650987A JP S6462337 A JPS6462337 A JP S6462337A
Authority
JP
Japan
Prior art keywords
burr
resin sealing
proof agent
semiconductor resin
filler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21650987A
Other languages
Japanese (ja)
Other versions
JP2505485B2 (en
Inventor
Toshiyuki Abe
Toshiaki Ishimaru
Takanaga Nishibayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denki Kagaku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denki Kagaku Kogyo KK filed Critical Denki Kagaku Kogyo KK
Priority to JP21650987A priority Critical patent/JP2505485B2/en
Publication of JPS6462337A publication Critical patent/JPS6462337A/en
Application granted granted Critical
Publication of JP2505485B2 publication Critical patent/JP2505485B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Inorganic Insulating Materials (AREA)

Abstract

PURPOSE:To provide a burr-proof agent effective without reducing spiral flow, to be used in sealers or electrical insulating materials for electronic parts such as semiconductors, consisting of inorganic powder with specific size distribution. CONSTITUTION:The objective burr-proof agent consisting of inorganic powder (e.g. crystalline silica, calcium silicate) with an average size of 0.6-5mum, content of the particles with a size <=1mum being 10-80wt.% and content of the particles with a size <=2mum being 20-90wt.%. The other objective filler consisting of (A) 85-99.5wt.% of base filler with an average particle size of 10-30mum and (B) 0.5-15wt.% of the above burr-proof agent.
JP21650987A 1987-09-01 1987-09-01 Additive for semiconductor resin encapsulation Expired - Lifetime JP2505485B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21650987A JP2505485B2 (en) 1987-09-01 1987-09-01 Additive for semiconductor resin encapsulation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21650987A JP2505485B2 (en) 1987-09-01 1987-09-01 Additive for semiconductor resin encapsulation

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP7314998A Division JP2601255B2 (en) 1995-12-04 1995-12-04 Filler for semiconductor resin sealing

Publications (2)

Publication Number Publication Date
JPS6462337A true JPS6462337A (en) 1989-03-08
JP2505485B2 JP2505485B2 (en) 1996-06-12

Family

ID=16689543

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21650987A Expired - Lifetime JP2505485B2 (en) 1987-09-01 1987-09-01 Additive for semiconductor resin encapsulation

Country Status (1)

Country Link
JP (1) JP2505485B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0347827A (en) * 1989-04-22 1991-02-28 Matsushita Electric Works Ltd Epoxy resin composition
EP0531656A2 (en) * 1991-09-11 1993-03-17 Mitsubishi Denki Kabushiki Kaisha Low-shrinkage unsaturated wet type polyester resin (B.M.C.) formulation composition having high thermal conductivity and molded circuit breaker and parts formed therefrom
JP2003048957A (en) * 2001-08-07 2003-02-21 Sumitomo Bakelite Co Ltd Epoxy resin composition

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0347827A (en) * 1989-04-22 1991-02-28 Matsushita Electric Works Ltd Epoxy resin composition
EP0531656A2 (en) * 1991-09-11 1993-03-17 Mitsubishi Denki Kabushiki Kaisha Low-shrinkage unsaturated wet type polyester resin (B.M.C.) formulation composition having high thermal conductivity and molded circuit breaker and parts formed therefrom
JP2003048957A (en) * 2001-08-07 2003-02-21 Sumitomo Bakelite Co Ltd Epoxy resin composition

Also Published As

Publication number Publication date
JP2505485B2 (en) 1996-06-12

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