JP2505485B2 - Additive for semiconductor resin encapsulation - Google Patents
Additive for semiconductor resin encapsulationInfo
- Publication number
- JP2505485B2 JP2505485B2 JP21650987A JP21650987A JP2505485B2 JP 2505485 B2 JP2505485 B2 JP 2505485B2 JP 21650987 A JP21650987 A JP 21650987A JP 21650987 A JP21650987 A JP 21650987A JP 2505485 B2 JP2505485 B2 JP 2505485B2
- Authority
- JP
- Japan
- Prior art keywords
- weight
- particle size
- less
- resin
- filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、半導体樹脂封止用
添加剤、詳しくは半導体封止用樹脂組成物にバリ止め効
果を付与することのできる添加剤に関する。TECHNICAL FIELD The present invention relates to an additive for semiconductor resin encapsulation, and more particularly to an additive capable of imparting a burr prevention effect to a resin composition for semiconductor encapsulation.
【０００２】[0002]
【従来の技術】無機質充填剤とエポキシ樹脂とからなる
樹脂組成物は、電気特性、機械的強度、耐熱性、耐信頼
性及び成形性に優れるため、IC、LSI、VLSI等の高集積
回路等の電子部品の封止に利用されている。2. Description of the Related Art A resin composition composed of an inorganic filler and an epoxy resin is excellent in electrical characteristics, mechanical strength, heat resistance, reliability, and moldability, so that highly integrated circuits such as IC, LSI, VLSI, etc. It is used to seal electronic components.
【０００３】従来、半導体の樹脂封止にはトランスファ
ー成形が広く採用されており、一度に多数のチップを封
止させるため、流動性に優れたすなわちスパイラルフロ
ーの大きな樹脂組成物が望まれている。この要望を満た
し、しかも樹脂組成物の耐サーマルショック性を向上さ
せるため、球状フィラーを充填材とすることが知られて
いる。しかしながら、球状フィラーを用いた樹脂組成物
は、破砕フィラーを用いたそれと比較してバリの発生が
多いので、その除去作業を頻繁に行う必要があり作業性
を著しく低下させていた。Conventionally, transfer molding has been widely used for resin encapsulation of semiconductors. In order to seal many chips at once, a resin composition having excellent fluidity, that is, a large spiral flow is desired. . It is known that a spherical filler is used as a filler in order to satisfy this demand and to improve the thermal shock resistance of the resin composition. However, since the resin composition using the spherical filler generates more burrs than that using the crushed filler, it is necessary to frequently remove the burrs, thereby significantly reducing the workability.
【０００４】バリを減少させる充填材として、平均粒径
５〜30μｍの溶融シリカと平均粒径0.01〜0.5μｍの微
細な球状溶融シリカとを併用すること（特開昭62−3964
1号公報）が提案されているが、これではスパイラルフ
ローの低下が大きくなりバリ止め効果が十分でないとい
う欠点があった。As a filler for reducing burrs, fused silica having an average particle diameter of 5 to 30 μm and fine spherical fused silica having an average particle diameter of 0.01 to 0.5 μm are used in combination (JP-A-62-3964).
No. 1) has been proposed, but this has a drawback that the spiral flow is greatly reduced and the burr prevention effect is not sufficient.
【０００５】[0005]
【発明が解決しようとする課題】本発明者らは、上記欠
点を解決することを目的として種々検討した結果、平均
粒径0.6〜５μｍ、１μｍ以下の粒子の含有率10〜80重
量％、２μｍ以下の粒子の含有率20〜90重量％である無
機質粉末を従来の充填材と共に併用すれば良いことを見
いだし、本発明を完成させたものである。As a result of various studies aimed at solving the above-mentioned drawbacks, the present inventors have found that the content of particles having an average particle size of 0.6 to 5 μm and 1 μm or less is 10 to 80% by weight and 2 μm. The inventors have found that the following inorganic powder having a particle content of 20 to 90% by weight may be used in combination with a conventional filler, and have completed the present invention.
【０００６】[0006]
【課題を解決するための手段】すなわち、本発明は、平
均粒径0.6〜５μｍ、１μｍ以下の粒子の含有率10〜80
重量％、２μｍ以下の粒子の含有率20〜90重量％である
無機質粉末からなることを特徴とする半導体樹脂封止用
添加剤（以下、「バリ止め剤」という。）である。That is, according to the present invention, the content of particles having an average particle size of 0.6 to 5 μm and 1 μm or less is 10 to 80.
%, And an additive for semiconductor resin encapsulation (hereinafter referred to as "deburring agent"), which is composed of an inorganic powder having a content of particles of 2 [mu] m or less of 20 to 90% by weight.
【０００７】[0007]
【発明の実施の形態】以下、更に詳しく本発明について
説明する。The present invention will be described in more detail below.
【０００８】本発明のバリ止め剤は、結晶性シリカ、溶
融シリカ、ケイ酸カルシウム、アルミナ、炭酸カルシウ
ム、窒化ケイ素、炭化ケイ素、窒化アルミニウム、タル
ク等の無機質粉末である。The deburring agent of the present invention is an inorganic powder such as crystalline silica, fused silica, calcium silicate, alumina, calcium carbonate, silicon nitride, silicon carbide, aluminum nitride and talc.
【０００９】バリ止め剤の粒度分布は平均粒径が0.6〜
５μｍである。平均粒径が0.6μｍ未満では樹脂組成物
のスパイラルフローが低下し、また５μｍをこえるとバ
リ止め効果が乏しくなる。また、バリ止め剤の１μｍ以
下の粒子の含有率は10〜80重量％であり、２μｍ以下の
粒子の含有率は20〜90重量％である。１μｍ以下の粒子
の含有率が10重量％未満であるか、又は２μｍ以下の粒
子の含有率が20重量％未満であるとバリを小さくする効
果が乏しくなる。一方、１μｍ以下の粒子の含有率が80
重量％をこえるか、又は２μｍ以下の粒子の含有率が90
重量％をこえるとスパイラルフローが低下する。The particle size distribution of the deburring agent has an average particle size of 0.6 to
5 μm. If the average particle size is less than 0.6 μm, the spiral flow of the resin composition will decrease, and if it exceeds 5 μm, the burr prevention effect will be poor. Further, the content of particles of 1 μm or less of the deburring agent is 10 to 80% by weight, and the content of particles of 2 μm or less is 20 to 90% by weight. If the content of particles of 1 μm or less is less than 10% by weight or the content of particles of 2 μm or less is less than 20% by weight, the effect of reducing burrs becomes poor. On the other hand, the content of particles of 1 μm or less is 80
The content of particles exceeding 2% by weight or 2 μm or less is 90
Spiral flow decreases when it exceeds the weight percentage.
【００１０】バリ止め剤は、上記無機質粉末を粉砕によ
る方法、分級等による方法、合成による方法等で製造す
ることができ、またその粒子形状については特に制限は
ない。The deburring agent can be produced by a method of pulverizing the above-mentioned inorganic powder, a method of classifying or the like, a method of synthesizing, etc., and its particle shape is not particularly limited.
【００１１】本発明のバリ止め剤は、通常、無機質充填
材と共に使用され（以下、バリ止め材と共に使用される
無機質充填材を「基本充填材」という。）、その基本充
填材としては、結晶性シリカ、溶融シリカ、ケイ酸カル
シウム、アルミナ、炭酸カルシウム、窒化ケイ素、炭化
ケイ素、窒化アルミニウム、タルク等の無機質粉末であ
る。基本充填材の粒度分布は平均粒径が10〜30μｍが好
ましく、10μｍ未満では樹脂組成物のスパイラルフロー
が流れず、また、30μｍをこえるとスパイラルフロー小
さくなる。基本充填材の形状とその製造方法については
公知技術を採用することができる。The deburring agent of the present invention is usually used together with an inorganic filler (hereinafter, the inorganic filler used together with the deburring material is referred to as "basic filler"), and the basic filler is a crystal. It is an inorganic powder such as crystalline silica, fused silica, calcium silicate, alumina, calcium carbonate, silicon nitride, silicon carbide, aluminum nitride and talc. The particle size distribution of the basic filler preferably has an average particle size of 10 to 30 μm. If it is less than 10 μm, the spiral flow of the resin composition does not flow, and if it exceeds 30 μm, the spiral flow becomes small. Known techniques can be employed for the shape of the basic filler and the method for producing the same.
【００１２】基本充填材とバリ止め剤の割合は、基本充
填材85〜99.5重量％、バリ止め剤0.5〜15重量％である
ことが好ましい。バリ止め剤が0.5重量％未満ではバリ
止め効果が得られず、また15重量％をこえるとスパイラ
ルフローが低下する。The ratio of the basic filler to the deburring agent is preferably 85 to 99.5% by weight of the basic filler and 0.5 to 15% by weight of the deburring agent. If the deburring agent is less than 0.5% by weight, the deburring effect cannot be obtained, and if it exceeds 15% by weight, the spiral flow is lowered.
【００１３】本発明のバリ止め剤の配合される樹脂とし
ては、一般市販のエポキシ樹脂の他、シリコーン樹脂、
アルキド樹脂、不飽和ポリエステル樹脂、ポリアミノビ
スマレイミド、ジアリルフタレート樹脂、フッ素樹脂、
ポリアミドイミド、ポリアミド、ポリエステル、液晶ポ
リマー、ポリフェニレンスルフィド、ポリフェニレンエ
ーテル、アクリル樹脂、フェノール樹脂等を使用するこ
とができる。As the resin to which the deburring agent of the present invention is blended, in addition to general commercially available epoxy resins, silicone resins,
Alkyd resin, unsaturated polyester resin, polyamino bismaleimide, diallyl phthalate resin, fluororesin,
Polyamideimide, polyamide, polyester, liquid crystal polymer, polyphenylene sulfide, polyphenylene ether, acrylic resin, phenol resin and the like can be used.
【００１４】[0014]
【実施例】次に、実施例、比較例、参考例をあげて更に
具体的に本発明を説明する。Next, the present invention will be described more specifically with reference to examples, comparative examples and reference examples.
【００１５】実施例１〜5 比較例１〜3 参考例１〜３ （充填材の製造） 平均粒径6.0μｍの球状溶融シリカ粉末を分級し表１に
示す種々の粒度分布を有するバリ止め剤Ａ、Ｂ、Ｃ、Ｄ
を製造した。バリ止め剤Ｅは日本アエロジル社製商品名
「アエロジル」である。これらのバリ止め剤と基本充填
材（平均粒径17μｍの溶融シリカ粉末）とを表２に示す
割合で種々混合し充填材とした。Examples 1 to 5 Comparative Examples 1 to 3 Reference Examples 1 to 3 (Production of Filler) Spherical fused silica powder having an average particle diameter of 6.0 μm was classified to have a deburring agent having various particle size distributions shown in Table 1. A, B, C, D
Was manufactured. The deburring agent E is trade name “Aerosil” manufactured by Nippon Aerosil Co., Ltd. These deburring agents and basic fillers (fused silica powder having an average particle size of 17 μm) were mixed in various proportions shown in Table 2 to obtain fillers.
【００１６】 （樹脂組成物の製造） 上記で得られた充填材350重量部、エポキシ当量230のク
レゾールノボラック樹脂85重量部、臭素化エポキシ樹脂
15重量部、フェノールノボラック型樹脂50重量部、２−
ウンデシルイミダゾール５重量部、カルナバワックス2.
5重量部、カーボンブラック１重量部、三酸化アンチモ
ン10重量部をミキシングロールで混練後冷却・粉砕して
樹脂組成物を製造した。(Production of Resin Composition) 350 parts by weight of the filler obtained above, 85 parts by weight of cresol novolac resin having an epoxy equivalent of 230, brominated epoxy resin
15 parts by weight, 50 parts by weight of phenol novolac type resin, 2-
5 parts by weight undecyl imidazole, carnauba wax 2.
5 parts by weight, 1 part by weight of carbon black and 10 parts by weight of antimony trioxide were kneaded with a mixing roll, cooled and pulverized to produce a resin composition.
【００１７】得られた樹脂組成物について、スパイラル
フローとバリを測定した。それらの結果を表２に示す。
なお、表１及び表２に示す物性は以下に従って測定し
た。The spiral flow and burr of the obtained resin composition were measured. Table 2 shows the results.
The physical properties shown in Tables 1 and 2 were measured according to the following.
【００１８】 （１）粒度分布及び平均粒径 粒度分布測定装置（シーラス社製「モデル715」）を用
いて１μｍと２μｍの粒度分布を測定した。また、粒度
分布の累積重量％が50％のときの粒径を平均粒径とし
た。 （２）スパイラルフロー トランスファー成形機を使用し、EMMI規格に準じた金型
を用いて成形温度175℃、成形圧力70kg/cm2で成形し測
定した。 （３）バリ ２μｍ、５μｍ、10μｍ、30μｍのスリットをもつバリ
測定金型を用い、成形温度175℃、成形圧力100kg/cm2で
成形した際にスリットに流れ出た樹脂をノギズで測定
し、それぞれのスリットで測定された値を平均しバリ長
さとした。(1) Particle Size Distribution and Average Particle Size Particle size distributions of 1 μm and 2 μm were measured using a particle size distribution measuring device (“Model 715” manufactured by Cirrus). The particle size when the cumulative weight% of the particle size distribution was 50% was defined as the average particle size. (2) Spiral flow A transfer molding machine was used, and molding was performed at a molding temperature of 175 ° C. and a molding pressure of 70 kg / cm 2 using a mold conforming to the EMMI standard, and the measurement was performed. (3) Burrs Using a burr measuring die with slits of 2 μm, 5 μm, 10 μm, and 30 μm, the resin that flowed out into the slits when molded at a molding temperature of 175 ° C. and a molding pressure of 100 kg / cm 2 was measured with vernier calipers. The values measured by the slits of No. 1 were averaged to obtain the burr length.
【００１９】 [0019]
【００２０】 [0020]
【００２１】[0021]
【発明の効果】本発明によれば、スパイラルフローを低
下させることくバリ止め効果の著大な半導体封止用樹脂
組成物を提供することができる。EFFECTS OF THE INVENTION According to the present invention, it is possible to provide a resin composition for semiconductor encapsulation which has a great effect of preventing burrs by reducing the spiral flow.
Claims (1)
の含有率10〜80重量％、２μｍ以下の粒子の含有率20〜
90重量％である無機質粉末からなることを特徴とする半
導体樹脂封止用添加剤。1. Content of particles having an average particle size of 0.6 to 5 μm, 1 μm or less 10 to 80% by weight, content of particles of 2 μm or less 20 to
An additive for encapsulating a semiconductor resin, which comprises 90% by weight of an inorganic powder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21650987A JP2505485B2 (en) | 1987-09-01 | 1987-09-01 | Additive for semiconductor resin encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21650987A JP2505485B2 (en) | 1987-09-01 | 1987-09-01 | Additive for semiconductor resin encapsulation |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7314998A Division JP2601255B2 (en) | 1995-12-04 | 1995-12-04 | Filler for semiconductor resin sealing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6462337A JPS6462337A (en) | 1989-03-08 |
| JP2505485B2 true JP2505485B2 (en) | 1996-06-12 |
Family
ID=16689543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21650987A Expired - Lifetime JP2505485B2 (en) | 1987-09-01 | 1987-09-01 | Additive for semiconductor resin encapsulation |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2505485B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0637542B2 (en) * | 1989-04-22 | 1994-05-18 | 松下電工株式会社 | Epoxy resin composition for encapsulation |
| JP2925402B2 (en) * | 1991-09-11 | 1999-07-28 | 三菱電機株式会社 | Circuit breaker having a housing formed by molding a high thermal conductivity, low shrinkage wet-type unsaturated polyester resin composition |
| JP4710195B2 (en) * | 2001-08-07 | 2011-06-29 | 住友ベークライト株式会社 | Epoxy resin composition |
-
1987
- 1987-09-01 JP JP21650987A patent/JP2505485B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6462337A (en) | 1989-03-08 |
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