JPS6460988A - Heat treatment furnace for semiconductor substrate - Google Patents
Heat treatment furnace for semiconductor substrateInfo
- Publication number
- JPS6460988A JPS6460988A JP21844087A JP21844087A JPS6460988A JP S6460988 A JPS6460988 A JP S6460988A JP 21844087 A JP21844087 A JP 21844087A JP 21844087 A JP21844087 A JP 21844087A JP S6460988 A JPS6460988 A JP S6460988A
- Authority
- JP
- Japan
- Prior art keywords
- furnace core
- core tube
- tube
- spacers
- furnished
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Resistance Heating (AREA)
- Furnace Details (AREA)
Abstract
PURPOSE:To reduce the bending force acting to a furnace core tube and to prevent the generation of a bending or a distortion of the furnace core tube by holding the furnace core tube as a whole in the direction of the tube axis with plural projections furnished at rod-form holding members. CONSTITUTION:At the outer periphery of spacers 7 of plural rod-form holding members 4, tube-from furnace core tube holders 9 are installed to compose projections to hold dispersively a furnace core tube as a whole in the tube axis direction. These furnace core tube holders 9 are not necessarily installed to all the spacers 7, but at least to the spacers 7 positioned at both ends and at the center of the furnace core tube 1, making it possible to reduce the bending force to act to the furnace core tube 1 and to position the tube axis of the furnace core tube 1 unifying to the center axis of a belt-form heater 6. In this case, for the cooling purpose, a suction port 10a and an exhaust port 10b furnished at both ends of an outer tube body 3 respectively are linked to air flowing holes furnished at fixing flanges 5a and 5b, the cooling air for a blower 11 is let flow through a clearance between the furnace core tube 1 and the outer tube body 3, and exhausted to the port 10b, making the temperature of the furnace core tube 1 dropped rapidly.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21844087A JPS6460988A (en) | 1987-08-31 | 1987-08-31 | Heat treatment furnace for semiconductor substrate |
US07/159,404 US4849608A (en) | 1987-02-14 | 1988-02-11 | Apparatus for heat-treating wafers |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21844087A JPS6460988A (en) | 1987-08-31 | 1987-08-31 | Heat treatment furnace for semiconductor substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6460988A true JPS6460988A (en) | 1989-03-08 |
JPH0520878B2 JPH0520878B2 (en) | 1993-03-22 |
Family
ID=16719946
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21844087A Granted JPS6460988A (en) | 1987-02-14 | 1987-08-31 | Heat treatment furnace for semiconductor substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6460988A (en) |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006284077A (en) * | 2005-03-31 | 2006-10-19 | Kumamoto Technology & Industry Foundation | Heat radiation reflecting furnace |
JP2007502549A (en) * | 2003-05-23 | 2007-02-08 | エムアールエル インダストリーズ | Holding mechanism of heating coil of high temperature diffusion furnace |
JP2010021148A (en) * | 2008-07-11 | 2010-01-28 | Qinghua Univ | Hollow heat source |
JP2010021147A (en) * | 2008-07-11 | 2010-01-28 | Qinghua Univ | Hollow heat source |
JP2010034061A (en) * | 2008-07-25 | 2010-02-12 | Qinghua Univ | Hollow heat source |
JP2010034062A (en) * | 2008-07-25 | 2010-02-12 | Qinghua Univ | Hollow heater |
JP2010034064A (en) * | 2008-07-25 | 2010-02-12 | Qinghua Univ | Method of manufacturing hollow heater |
JP2010034063A (en) * | 2008-07-25 | 2010-02-12 | Qinghua Univ | Hollow heat source |
JP2010034047A (en) * | 2008-07-25 | 2010-02-12 | Qinghua Univ | Hollow heat source |
US8410676B2 (en) | 2007-09-28 | 2013-04-02 | Beijing Funate Innovation Technology Co., Ltd. | Sheet-shaped heat and light source, method for making the same and method for heating object adopting the same |
US8450930B2 (en) | 2007-10-10 | 2013-05-28 | Tsinghua University | Sheet-shaped heat and light source |
JP2018139221A (en) * | 2012-11-06 | 2018-09-06 | 貞徳舎株式会社 | Electric heater, heating device comprising the same, and semiconductor production apparatus |
JP2023526363A (en) * | 2020-06-05 | 2023-06-21 | エルジー エナジー ソリューション リミテッド | Tube module and tube assembly including the same |
-
1987
- 1987-08-31 JP JP21844087A patent/JPS6460988A/en active Granted
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007502549A (en) * | 2003-05-23 | 2007-02-08 | エムアールエル インダストリーズ | Holding mechanism of heating coil of high temperature diffusion furnace |
JP2006284077A (en) * | 2005-03-31 | 2006-10-19 | Kumamoto Technology & Industry Foundation | Heat radiation reflecting furnace |
US8410676B2 (en) | 2007-09-28 | 2013-04-02 | Beijing Funate Innovation Technology Co., Ltd. | Sheet-shaped heat and light source, method for making the same and method for heating object adopting the same |
US8450930B2 (en) | 2007-10-10 | 2013-05-28 | Tsinghua University | Sheet-shaped heat and light source |
JP2010021147A (en) * | 2008-07-11 | 2010-01-28 | Qinghua Univ | Hollow heat source |
JP2010021148A (en) * | 2008-07-11 | 2010-01-28 | Qinghua Univ | Hollow heat source |
JP2010034062A (en) * | 2008-07-25 | 2010-02-12 | Qinghua Univ | Hollow heater |
JP2010034064A (en) * | 2008-07-25 | 2010-02-12 | Qinghua Univ | Method of manufacturing hollow heater |
JP2010034063A (en) * | 2008-07-25 | 2010-02-12 | Qinghua Univ | Hollow heat source |
JP2010034047A (en) * | 2008-07-25 | 2010-02-12 | Qinghua Univ | Hollow heat source |
JP2010034061A (en) * | 2008-07-25 | 2010-02-12 | Qinghua Univ | Hollow heat source |
JP2018139221A (en) * | 2012-11-06 | 2018-09-06 | 貞徳舎株式会社 | Electric heater, heating device comprising the same, and semiconductor production apparatus |
JP2023526363A (en) * | 2020-06-05 | 2023-06-21 | エルジー エナジー ソリューション リミテッド | Tube module and tube assembly including the same |
Also Published As
Publication number | Publication date |
---|---|
JPH0520878B2 (en) | 1993-03-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |