JPS6459826A - Mounting of led chip - Google Patents

Mounting of led chip

Info

Publication number
JPS6459826A
JPS6459826A JP21685687A JP21685687A JPS6459826A JP S6459826 A JPS6459826 A JP S6459826A JP 21685687 A JP21685687 A JP 21685687A JP 21685687 A JP21685687 A JP 21685687A JP S6459826 A JPS6459826 A JP S6459826A
Authority
JP
Japan
Prior art keywords
led chip
insulating resin
electric current
light
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21685687A
Other languages
Japanese (ja)
Inventor
Hiroaki Fujimoto
Kenzo Hatada
Takao Ochi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP21685687A priority Critical patent/JPS6459826A/en
Publication of JPS6459826A publication Critical patent/JPS6459826A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

Landscapes

  • Led Devices (AREA)
  • Wire Bonding (AREA)
  • Led Device Packages (AREA)

Abstract

PURPOSE:To harden an insulating resin in a short time without using a heating mechanism and a UV irradiation mechanism by a method wherein an electric current is applied to an LED chip in a state that the LED chip is pressed to a wiring board, a light-emitting inspection of the LED chip is executed and the insulating resin is hardened by heat generated by the LED chip. CONSTITUTION:An insulating resin 3 is coated on a wiring board 1 having a wiring part 2. An LED chip 4 is mounted on the wiring board 1 in such a way that a protruding electrode 5 of the LED chip 4 coincides with the wiring part 2. The LED chip 4 has an anode electrode and a cathode electrode on a face where a light-emitting part is formed. The LED chip is pressurized by using a pressurization tool 6; the insulating resin 3 is squeezed to a circumference; the protruding electrode 5 comes into contact with the wiring part 2. An electric current is applied to the LED chip 4; a light-emitting inspection of the LED chip 4 is executed; then, an electric current value is increased, the LED chip 4 generates heat. The insulating resin 3 is hardened by the heat generated by the LED chip.
JP21685687A 1987-08-31 1987-08-31 Mounting of led chip Pending JPS6459826A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21685687A JPS6459826A (en) 1987-08-31 1987-08-31 Mounting of led chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21685687A JPS6459826A (en) 1987-08-31 1987-08-31 Mounting of led chip

Publications (1)

Publication Number Publication Date
JPS6459826A true JPS6459826A (en) 1989-03-07

Family

ID=16694978

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21685687A Pending JPS6459826A (en) 1987-08-31 1987-08-31 Mounting of led chip

Country Status (1)

Country Link
JP (1) JPS6459826A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003078170A (en) * 2001-09-05 2003-03-14 Sony Corp Method and structure for inspecting circuit element, substrate with built-in circuit element and its manufacturing method, and electric circuit device and its manufacturing method
JP2010267900A (en) * 2009-05-18 2010-11-25 Citizen Holdings Co Ltd Method of manufacturing led light source device
JP2011091204A (en) * 2009-10-22 2011-05-06 Citizen Holdings Co Ltd Method for manufacturing led light source device
JP2013138216A (en) * 2013-01-30 2013-07-11 Nitto Denko Corp Light-emitting device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003078170A (en) * 2001-09-05 2003-03-14 Sony Corp Method and structure for inspecting circuit element, substrate with built-in circuit element and its manufacturing method, and electric circuit device and its manufacturing method
JP2010267900A (en) * 2009-05-18 2010-11-25 Citizen Holdings Co Ltd Method of manufacturing led light source device
JP2011091204A (en) * 2009-10-22 2011-05-06 Citizen Holdings Co Ltd Method for manufacturing led light source device
JP2013138216A (en) * 2013-01-30 2013-07-11 Nitto Denko Corp Light-emitting device

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