JP2010267900A - Method of manufacturing led light source device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a high-performance LED light source device excelling in a color mixture property, small in color irregularity, excelling in luminous efficiency, and having a uniform characteristic. <P>SOLUTION: This method of manufacturing the high-performance LED light source device includes: a process (M2) of mounting an LED element on a substrate; a process (M3) of applying a first resin member containing a first fluorescent substance by coating the LED element therewith; a process (M4) of partially hardening the first resin member around the LED element by making the LED element perform self-emission; and a process (M5) of forming a first fluorescent substance layer by removing an un-hardened part in the first resin member. In the method, a plurality of different fluorescent substance layers for covering the LED element can be laminated at optional thicknesses by repeating the process of forming the fluorescent substance layer. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a method of manufacturing an LED light source device including a phosphor layer that emits wavelength-converted light when excited by receiving light emitted from a light emitting element.

  Conventionally, light-emitting diodes (hereinafter abbreviated as LEDs), which are compound semiconductors, are widely used as light source devices by taking advantage of their long life and miniaturization. In addition, LEDs that emit blue light using gallium nitride-based compound semiconductors (hereinafter abbreviated as GaN-based semiconductors) have been developed and commercialized, so that a resin that seals LED elements contains a phosphor that emits yellow light. A light source device that obtains pseudo white light by mixing blue light and yellow light has been put into practical use. In addition, LEDs having a peak wavelength from ultraviolet light to near ultraviolet light (for example, 350 to 410 nm) have been developed by GaN-based semiconductors, and are excited by receiving this ultraviolet light to near ultraviolet light, thereby causing red light, green light, A light source device that obtains white light using three types of phosphors that emit blue light is also disclosed.

  In such a white LED, a manufacturing method is disclosed in which after the photocurable phosphor-containing composition is applied to the LED element, the LED element emits light to cure the photocurable phosphor-containing composition (for example, Patent Document 1). This white light emitting diode manufacturing method includes a step of forming a photocurable phosphor-containing composition layer on the surface of the LED element, a step of causing the LED element to emit light and curing the photocurable phosphor-containing composition, and curing. And a step of removing the uncured product so as to leave a cured product of the photocurable phosphor-containing composition after the step. And when using ultraviolet LED as an LED element, it has shown that a blue fluorescent substance, a red fluorescent substance, and a green fluorescent substance are mix | blended with a photocurable fluorescent substance containing composition, respectively.

  And even if uneven mixing of the phosphor particles contained in the photocurable phosphor-containing composition occurs, in the optical path where there are a lot of phosphor particles, the curing of the composition does not proceed, the cured region becomes thin, It has been shown that in an optical path with few phosphor particles, the cured region becomes thicker as the composition is cured. Thereby, it is shown that the converted light from the phosphor is adjusted to suppress uneven color and uneven light emission.

JP 2008-159756 A (pages 4 and 10)

  However, in the method for producing a white light emitting diode of Patent Document 1, three kinds of phosphor particles of a blue phosphor, a red phosphor, and a green phosphor are mixed in a composition that covers an LED element. The phosphor particles have different specific gravities and different particle sizes, so it is difficult to uniformly disperse them when mixed in the composition. As an example, red phosphors concentrate in some parts and blue phosphors in some parts. The situation where people concentrate is easy to happen. This is a problem that the color mixing property deteriorates due to such a bias of the phosphor, and color unevenness occurs in individual LEDs.

  As another problem, there is a problem due to the interaction of wavelength-converted light by each phosphor. In order to explain this problem, characteristics of general blue phosphor, green phosphor, and red phosphor will be described with reference to the drawings. FIG. 18 shows the characteristics of light emission Em and excitation Ex of the phosphors of blue, green, and red, the X axis represents the wavelength of light, and the Y axis represents the intensity.

  Here, FIG. 18A shows the characteristics of a general blue phosphor. As shown in the figure, the blue phosphor has a peak of light emission Em in the vicinity of a wavelength of 450 nm, and the excitation Ex is about 430 nm. Since it is excited by a shorter wavelength, that is, a wavelength from ultraviolet light to near ultraviolet light, visible light is hardly absorbed and transmitted.

  FIG. 18B shows the characteristics of a general green phosphor. This green phosphor has an emission Em peak near a wavelength of 530 nm as shown in the figure, and the excitation Ex is about 500 nm. Excitation by short wavelength. Due to this characteristic, the green phosphor absorbs light having a wavelength shorter than about 500 nm.

  FIG. 18C shows the characteristics of a general red phosphor. This red phosphor has an emission Em peak near a wavelength of 650 nm as shown in the figure, and the excitation Ex is about 600 nm. Excitation by short wavelength. Due to this characteristic, the red phosphor absorbs light having a wavelength shorter than about 600 nm.

  Thus, each phosphor of each color has a characteristic that the wavelength to be excited is different. For this reason, when a blue phosphor, a green phosphor, and a red phosphor are mixed in one composition as shown in Patent Document 1, the wavelength-converted light emitted from each phosphor is mixed. The 450 nm fluorescence from the blue phosphor is absorbed by the green phosphor and the red phosphor, and the 530 nm fluorescence from the green phosphor is absorbed by the red phosphor. That is, when phosphors having different wavelength-converted lights are mixed in the composition, secondary excitation of the phosphors occurs, and as a result, the blue wavelength-converted light and the green wavelength-converted light are absorbed and weakened. Therefore, there is a problem that the luminous efficiency of the LED is deteriorated and the luminance is lowered, and the luminance variation and color unevenness are caused in each LED due to the mixed state of the phosphors.

  An object of the present invention is to solve the above-mentioned problems, and to provide a method for manufacturing a high-performance LED light source device having good color mixing, little color unevenness, excellent luminous efficiency, uniform characteristics, and high performance.

  In order to solve the above problems, the manufacturing method described below is adopted as the manufacturing method of the LED light source device of the present invention.

  The manufacturing method of the LED light source device of this invention is a manufacturing method of the LED light source device formed by hardening | curing sealing resin which coat | covers an LED element, The 1st resin member containing a 1st fluorescent substance is used as an LED element. The step of coating and applying, the step of partially curing the first resin member around the LED element by causing the LED element to emit light, and the removal of the uncured portion of the first resin member Then, a step of forming the first phosphor layer, a step of applying a second resin member containing a second phosphor different from the first phosphor so as to cover the first phosphor layer, and By causing the LED element to self-emit, the step of partially curing the second resin member around the first phosphor layer, and removing the uncured portion of the second resin member, Forming a second phosphor layer.

  In addition, after the second phosphor layer is formed, a third resin member containing a third phosphor different from the first and second phosphors is applied so as to cover the second phosphor layer. Removing the uncured portion of the third resin member and the step of partially curing the third resin member around the second phosphor layer by causing the LED element to self-emit; And a step of forming a third phosphor layer.

Further, the LED element is an n-UV light emitting diode, the first phosphor is a phosphor that converts the emission color from the LED element to red, and the second phosphor is the emission color from the LED element. The third phosphor is a phosphor that converts the light emission color from the LED element into blue.

  In addition, the LED element is a blue light emitting diode, the first phosphor is a phosphor that converts the emission color from the LED element to red, and the second phosphor changes the emission color from the LED element to green. It is characterized by being a phosphor that converts to

  Further, the phosphor layer formed on the outermost surface is sealed with a transparent sealing member.

  Further, the LED element is an n-UV light emitting diode, the first phosphor is a phosphor that converts the emission color from the LED element to red, and the second phosphor is the emission color from the LED element. It is characterized by being a phosphor that converts green into green.

  In addition, the second phosphor layer is sealed with a transparent sealing member including a phosphor that converts the emission color from the LED element into blue.

  Further, the LED element is caused to emit light by supplying current to the LED element through wire bonding in which the electrode part provided on the substrate and the LED element are electrically connected.

  Further, the first and second resin members are ultraviolet curable resins, and the thickness of each phosphor layer is a film thickness determined by the emission intensity distribution of the LED element.

  The first and second resin members are thermosetting resins, and the thickness of each phosphor layer is a film thickness determined by the amount of heat when the LED element is self-luminous.

  In addition, a plurality of LED light source devices are arranged on a collective substrate, and a plurality of LED light source devices emit light simultaneously to form a phosphor layer having a determined film thickness around each LED element.

  According to the LED light source device manufacturing method of the present invention, the LED element that emits near-ultraviolet light is coated with the photocurable resin containing the first phosphor, and the LED element emits light by itself. The first phosphor layer can be formed by curing the resin according to the emission intensity. Moreover, the 2nd fluorescent substance layer can be formed by apply | coating the photocurable resin containing a 2nd fluorescent substance to the 1st fluorescent substance layer, and making an LED element light-emit. Furthermore, the third phosphor layer can be formed by applying a photocurable resin containing the third phosphor to the second phosphor layer and causing the LED element to emit light by itself.

  As a result, the first, second, and third phosphor layers in which the phosphors are uniformly dispersed are laminated, so that the near ultraviolet light from the LED element is uniformly irradiated to the phosphor particles of each layer, thereby converting the wavelength. As a result, an LED light source device with good color mixing and little color unevenness can be manufactured. In addition, by arranging the longest wavelength red phosphor in the immediate vicinity of the LED, then arranging the green phosphor, and arranging the short wavelength blue phosphor on the outermost side, mutual conversion of wavelength-converted light by each phosphor is achieved. Since the influence of the action can be suppressed, secondary excitation of the phosphor is suppressed, the light emission efficiency of the light source device is improved, and an LED light source device with high brightness and little luminance variation can be manufactured.

In addition, by covering the light-curing resin and curing the resin by the self-emission of the LED element, the phosphor layer that is stacked without being affected by the wire that electrically connects the LED element and the substrate is formed thin without deformation. Therefore, it is a manufacturing method suitable for mounting by wire bonding.

 Also, by changing the self-emission time of the LED element for curing the photocurable resin and the current value supplied to the LED element, the film thickness of each phosphor layer can be arbitrarily controlled, so the color of light emission can be adjusted. A white LED light source device that can be easily realized and has an optimal color balance can be manufactured.

  In addition, by mounting a plurality of LED elements on a collective substrate and simultaneously emitting a plurality of LED elements simultaneously, a phosphor layer having a predetermined thickness can be uniformly formed around each LED element. It is possible to manufacture a large number of LED light source devices that have less unevenness and luminance variation and have stable characteristics.

It is a flowchart which shows the process of the manufacturing method of the LED light source device concerning Example 1 of this invention. It is the top view and sectional drawing explaining the manufacturing process of the aggregate substrate concerning Example 1 of this invention. It is the top view and enlarged side view explaining the mounting process of the LED element concerning Example 1 of this invention. It is a circuit diagram explaining the connection of the LED element formed by the mounting process concerning Example 1 of this invention. It is an enlarged side view explaining the potting process which apply | coats the 1st resin member concerning Example 1 of this invention. It is the top view and enlarged side view explaining the hardening process of the 1st resin member concerning Example 1 of the present invention. It is a typical side view explaining the washing | cleaning process of the 1st resin member concerning Example 1 of this invention. It is an enlarged side view explaining the drying process concerning Example 1 of this invention. It is an enlarged side view explaining the potting process which apply | coats the 2nd resin member concerning Example 1 of this invention. It is an enlarged side view explaining the hardening process of the 2nd resin member concerning Example 1 of the present invention. It is an enlarged side view explaining the hardening process of the 3rd resin member concerning Example 1 of the present invention. It is the perspective view and enlarged side view explaining 3 layers of fluorescent substance layers formed on the collective substrate concerning Example 1 of the present invention. It is a perspective view explaining the sealing process which seals the LED element and fluorescent substance layer on the aggregate substrate concerning Example 1 of this invention. It is a perspective view which shows the cutting process which isolate | separates many LED light source devices completed on the aggregate substrate concerning Example 1 of this invention, and the single LED light source device completed by the cutting process. It is a side view explaining the structure and operation | movement of an LED light source device which has the three layers of fluorescent substance layers concerning Example 1 of this invention. It is a side view explaining the structure and operation | movement of the LED light source device which contains a fluorescent substance in the sealing member concerning Example 2 of this invention. It is a side view explaining the structure and operation | movement of an LED light source device which has two layers of fluorescent substance layers concerning Example 3 of this invention. It is a graph which shows an example of the characteristic of a general blue fluorescent substance, a green fluorescent substance, and a red fluorescent substance.

  Hereinafter, specific embodiments of the LED light source device manufacturing method of the present invention and modifications thereof will be described in detail with reference to the drawings.

[Schematic Explanation of Manufacturing Process of Manufacturing Method of LED Light Source Device of Example 1: FIG. 1]
First, the outline of the manufacturing process of Example 1 of the present invention will be described with reference to FIG. The feature of the first embodiment is that the LED element is an LED element that emits near ultraviolet light, and an LED light source that emits white light by laminating three phosphor layers containing the first, second, and third phosphors. Is to manufacture the device. FIG. 1 is a flowchart showing an overall outline of the manufacturing process of the first embodiment of the present invention. Details of each manufacturing process will be described later.

  As shown in FIG. 1, first, a collective substrate manufacturing process for manufacturing a collective substrate for mounting a plurality of LED elements is performed (process M1).

  Next, an LED element mounting step is performed in which a plurality of LED elements are fixed on the completed aggregate substrate, and each LED element is electrically connected to the electrode portion of the aggregate substrate by wire bonding (process M2).

  Next, a potting step of covering the plurality of LED elements mounted on the aggregate substrate with the first resin member containing the first phosphor is performed (step M3). The first resin member is an ultraviolet curable resin.

  Next, a resin curing process is performed in which a predetermined current is supplied to each of the mounted LED elements to cause the LED elements to emit light spontaneously, and the first resin member around the LED elements is partially cured (process M4).

  Next, a cleaning step is performed in which the aggregate substrate covered with the first resin member is immersed in an organic solvent to remove the first resin member in the uncured portion (step M5).

  Next, a drying process for drying the cleaned aggregate substrate by heating or the like is performed (process M6). Thereby, the 1st fluorescent substance layer is formed in the circumference of a plurality of LED elements.

  Next, the loop L1 returns from the step M6 to the potting step (step M3), and the potting step of covering the first phosphor layer with the second resin member containing the second phosphor is performed again, and then The resin curing process (process M4) to the drying process (process M6) are performed. Thereby, the 2nd fluorescent substance layer which coats the 1st fluorescent substance layer is formed. The second resin member is also an ultraviolet curable resin.

  Next, returning to the potting step (step M3) again by the loop L1, the potting step of covering the second phosphor layer with the third resin member containing the third phosphor is performed again, and then the resin is cured. It implements from a process (process M4) to a drying process (process M6). Thereby, the 3rd fluorescent substance layer which coats the 2nd fluorescent substance layer is formed. That is, by repeating the potting process (process M3) to the drying process (process M6) three times, the phosphor layers of the first, second, and third layers are stacked around the LED element. The The third resin member is also an ultraviolet curable resin.

  Next, when the third drying step (step M6) is completed, a sealing step of filling and sealing the third phosphor layer formed on the outermost surface on the aggregate substrate with a transparent sealing member (Step M7).

  Next, the collective substrate sealed by the sealing member is cut at a predetermined cutting position to complete a plurality of LED light source devices (step M8).

[Description of Assembly Substrate Manufacturing Process (Process M1) of Example 1: FIG. 2]
Next, details of the manufacturing process of the collective substrate according to the first embodiment of the present invention will be described with reference to FIG. FIG. 2 shows a collective substrate of the LED light source device manufactured according to the present invention, FIG. 2 (a) is a plan view of the collective substrate, and FIG. 2 (b) is a section line AA ′ of FIG. 2 (a). It is sectional drawing of the collective substrate cut | disconnected by.

  As shown in FIGS. 2A and 2B, reference numeral 1 denotes a collective substrate in which a plurality of LED light source devices are arranged side by side, and is formed of an insulating substrate such as an epoxy material. 2a to 2e are substantially rectangular electrodes formed in the same shape on the front surface and the back surface of the collective substrate 1, and are made of conductive copper foil or the like. Here, as shown in the figure, the electrodes 2a are vertically formed on the collective substrate 1 at a predetermined interval in the drawing, and the electrodes 2b are adjacent to the electrode 2a, and on the collective substrate 1 in the same manner as the electrode 2a. Is formed vertically on the drawing. Similarly, the electrodes 2c to 2e are formed vertically on the collective substrate 1 at predetermined intervals on the drawing.

  Thus, the electrodes 2a to 2e are formed in a matrix on the front and back surfaces of the collective substrate 1. In FIG. 2, a total of 30 electrodes 2a, 5 columns in the horizontal direction on the drawing and 6 rows in the vertical direction on the drawing. However, the number of the electrodes 2a to 2e is not limited to this number, and any number may be formed depending on the size of the collective substrate 1, the electrode shape, and the like. Also on the back surface of the collective substrate 1, the electrodes 2a to 2e having the same shape are formed at the same positions as the electrodes 2a to 2e on the front surface.

  Further, 3a to 3e are through holes formed in the regions of the electrodes 2a to 2e on the front surface and the back surface of the collective substrate 1. Here, the through-hole 3a is formed at a position closer to the left side in the drawing in the region of the electrode 2a, and electrically connects the electrode 2a on the front surface of the collective substrate 1 and the electrode 2a on the back surface. The through hole 3b is formed at a position closer to the left side in the drawing within the region of the electrode 2b, and electrically connects the electrode 2b on the front surface of the collective substrate 1 and the electrode 2b on the back surface. Similarly, the through-holes 3c to 3e are formed in the respective regions of the electrodes 2c to 2e at positions closer to the left side in the drawing, and the electrodes 2c to 2e on the front surface of the collective substrate 1 and the electrodes 2c to 2e on the back surface are respectively electrically connected. Connect.

  Reference numerals 4 and 5 denote electrode terminals, which are formed in lines at the left and right ends of the collective substrate 1 in contact with the electrodes 2a and 2e, respectively. Here, since the electrode terminal 4 is formed in contact with the end of the electrode 2 a, all the electrodes 2 a are electrically connected by the electrode terminal 4. Further, since the electrode terminals 5 are formed in contact with the end portions of the electrodes 2 e, all the electrodes 2 e are electrically connected by the electrode terminals 5. The electrode terminals 4 and 5 are used as terminals for supplying current to the LED elements mounted on the collective substrate 1, and will be described in detail later. The electrode pattern of the collective substrate 1 shown in FIG. 2 is an example, and the configuration of the electrode pattern is not limited.

[Description of LED Element Mounting Step (Step M2) of Example 1: FIGS. 3 and 4]
Next, details of the mounting process of the LED element according to the first embodiment of the present invention will be described with reference to FIGS. FIG. 3 shows a mounting process of the LED element of Example 1 of the present invention, FIG. 3 (a) is a plan view of the collective substrate on which the LED element is mounted, and FIG. 3 (b) is a mounting of the LED element. It is an enlarged side view of an aggregate substrate.

As shown in FIGS. 3 (a) and 3 (b), as the LED element mounting step, first, a region on the right half of the electrode 2a-2d on the surface of the collective substrate 1 in the drawing (ie, a region other than the through holes 3a-3d) The LED element 10 is fixed and mounted with a conductive adhesive or the like (not shown). That is, as shown in the drawing, the electrodes 2a to 2d are each formed in six pieces vertically, so that a total of 24 LED elements 10 in six rows and four columns are mounted on the surface of one collective substrate 1. The It is not mounted on the electrode 2e at the right end in the drawing. Here, in Example 1, the LED element 10 is a near-ultraviolet light emitting diode (n-UV light emitting diode) having an emission wavelength of about 405 nm as an example.

  Next, the mounted LED element 10 is wire-bonded by a wire bonder (not shown), and is electrically connected to the electrodes 2a to 2e by wires 11 and 12 made of gold fine wires as connection members. That is, as shown in the figure, the anode (not shown) of the LED element 10 mounted on the electrode 2 a is electrically connected to the electrode 2 a by the wire 11, and the cathode (not shown) of the LED element 10 is connected by the wire 12. It is electrically connected to the adjacent electrode 2b.

  Similarly, the anode (not shown) of the LED element 10 mounted on the electrode 2 b is electrically connected to the electrode 2 b by the wire 11, and the cathode (not shown) of the LED element 10 is adjacent to the side by the wire 12. It is electrically connected to the electrode 2c. Similarly, the LED element 10 mounted on the electrode 2c and the LED element 10 mounted on the electrode 2d are also electrically connected to the respective electrodes by wires 11 and 12.

  As a result, the four rows of LED elements 10 in the drawing are connected in series between the electrode terminals 4 and 5 via the electrodes 2a to 2e. Similarly, since the LED elements 10 are mounted in six rows in the vertical direction in the drawing, the LED elements 10 in all six rows are also connected to the electrodes 2 a to 2 e by the wires 11 and 12. As a result, a circuit composed of a total of 24 LED elements 10 formed by groups of 6 parallel connections in which the 4 LED elements 10 between the electrode terminals 4 and 5 are connected in series is formed.

  FIG. 4 shows a connection circuit of the LED elements 10 mounted on the collective substrate 1. Here, as described above, the four LED elements 10 are connected in series as one group, and further, since these six groups are connected in parallel, a predetermined positive voltage is applied to the electrode terminal 4, When a zero voltage is applied to the electrode terminal 5, a drive current flows from the anode to the cathode of all the LED elements 10, and all the LED elements 10 can be turned on.

  In addition, the connection of the LED element 10 is not limited to this Example 1, All the LED elements 10 can also be connected in series by devising the connection pattern of the electrode terminals 4 and 5. Here, if all the LED elements 10 are connected in series, the current value flowing through all the LED elements 10 can be made the same. Therefore, in the resin curing step described later, the resin curing conditions for the individual LED elements 10 are matched. However, even in the case of series-parallel connection as in the first embodiment, the characteristics of the LED elements 10 are averaged within the group, so that it is possible to match almost the same curing conditions.

[Description of Potting Step (Step M3) of First Resin Member of Example 1: FIG. 5]
Next, details of the potting process of the first embodiment of the present invention will be described with reference to FIG. FIG. 5 is an enlarged side view for explaining the potting process of the first embodiment of the present invention, and shows a part of the collective substrate 1. As shown in FIG. 5, a first resin member 21 containing a first phosphor 20 is applied by a dispenser 50 as a sealing resin that covers all the LED elements 10 mounted on the surface of the collective substrate 1. . The first phosphor 20 is schematically illustrated and is actually a minute particle.

Here, the first phosphor 20 is a red phosphor that converts the emission color from the LED element 10 into a long-wavelength red, and the first resin member 21 causes the LED element 10 to emit light by itself and emit ultraviolet light. Alternatively, it is made of an ultraviolet curable silicone resin that is cured by near ultraviolet rays. Although not shown, the first resin member 21 is applied to the entire surface of the collective substrate 1 so as to cover all the LED elements 10. It is good to discharge. Thereby, all the LED elements 10 and the wires 11 and 12 on the collective substrate 1 can be covered.

[Description of Resin Curing Process (Process M4) of First Resin Member of Example 1: FIG. 6]
Next, details of the resin curing step of Example 1 of the present invention will be described with reference to FIG. FIG. 6 shows the resin curing process of Example 1 of the present invention, and FIG. 6A is a plan view showing that a DC power source is connected to the aggregate substrate coated with the first resin member. b) is an enlarged side view schematically showing that the LED elements on the collective substrate self-emit to cure the first resin member.

  As shown in FIG. 6A, a DC power source 6 that outputs a predetermined voltage is connected to the electrode terminals 4 and 5 of the collective substrate 1 on which the first resin member 21 is applied over the entire surface. That is, the plus line 6a of the DC power source 6 is connected to the electrode terminal 4 connected to the anode of the LED element 10 via the electrode 2a via the switch SW, and the electrode connected to the cathode of the LED element 10 via the electrode 2e. The negative line 6 b of the DC power source 6 is connected to the terminal 5. The switch SW has a function of turning on / off the current from the DC power source 6 and controls the LED element 10 so as to supply a driving current for a predetermined time.

  Next, in FIG. 6B, when the above-described switch SW is turned on for a predetermined time, a driving current is supplied to all the LED elements 10 on the collective substrate 1 via the wires 11 and 12, and the LED elements 10. Performs self-emission and emits near-ultraviolet emitted light 15. Thereby, the first resin member 21 covering the LED element 10 is irradiated with the emitted light 15, and the first resin member 21 is an ultraviolet curable resin as described above. The region of one resin member 21 partially begins to cure, and a first cured region 22 is formed around the LED element 10.

  The thickness of the first cured region 22 depends on the emission intensity of the emitted light 15 from the LED element 10 and depends on the magnitude of the drive current supplied to the LED element 10 and the supply time. Thickness can be controlled. That is, in order to increase the thickness of the first cured region 22, the value of the drive current supplied to the LED element 10 is increased, the drive current supply time is increased, or both are performed. On the contrary, in order to reduce the thickness of the first cured region 22, the value of the drive current supplied to the LED element 10 is reduced, or the supply time of the drive current is shortened, Or both may be implemented.

  Here, as described above, the first resin member 21 (not shown here) contains the first phosphor 20 (see FIG. 5), which is a red phosphor, and therefore, the amount of red wavelength-converted light. Is increased by increasing the film thickness of the first cured region 22 and increasing the amount of grains of the first phosphor 20, and conversely, if it is desired to reduce the amount of red wavelength converted light, What is necessary is just to make the film thickness of the 1st hardening area | region 22 thin, and to reduce the grain amount of the 1st fluorescent substance 20. Thus, by controlling the value of the drive current for forming the first cured region 22 or the supply time, the amount of red wavelength converted light can be arbitrarily adjusted. In FIG. 6, the first phosphor 20 contained in the first resin member 21 is not shown for easy viewing of the drawing.

[Description of Cleaning Step (Step M5) of First Resin Member of Example 1: FIG. 7]
Next, details of the cleaning process of the first embodiment of the present invention will be described with reference to FIG. FIG. 7 is a schematic side view showing the cleaning process of the first embodiment of the present invention. As shown in FIG. 7, the collective substrate 1 in which the first cured region 22 is formed in the first resin member 21 (only a part of the collective substrate 1 is shown in the drawing) is immersed in an organic solvent 51, The uncured portion in the first resin member 21 is removed. The uncured portion is a region other than the first cured region 22 in the first resin member 21. Moreover, as the organic solvent 51, acetone, toluene, xylene, etc. are preferable, and an uncured part can be reliably removed in a short time by washing by ultrasonic washing or the like.

[Description of Drying Step of First Resin Member of Example 1 (Step M6): FIG. 8]
Next, the details of the drying process of Example 1 of the present invention will be described with reference to FIG. FIG. 8 is an enlarged side view showing the drying process of Example 1 of the present invention. As shown in FIG. 8, the collective substrate 1 (only a part of the collective substrate 1 is shown in the drawing) from which the uncured portion in the first resin member 21 (see FIG. 7) has been removed by the organic solvent is heated. It puts into a furnace etc. (not shown), and is dried with the heat | fever 52 or air etc. as shown in the figure.

  As a result, only the first cured region 22 remains around the LED element 10. Here, the 1st hardening area | region 22 is an area | region which the 1st resin member 21 hardened | cured as mentioned above, This 1st resin member 21 contains the 1st fluorescent substance 20 which is a red fluorescent substance. ing. Accordingly, the first cured region 22 is formed as the first phosphor layer 23 containing the first phosphor 20.

  The first phosphor layer 23 is formed in the immediate vicinity of the LED element 10 and directly covers the LED element 10, and corresponds to the emission intensity distribution of the emitted light 15 (see FIG. 6B) from the LED element 10. Since it is formed in a substantially semicircular shape so as to cover the periphery of the LED element 10 as shown in the figure, the emitted light 15 from the LED element 10 can be wavelength-converted almost uniformly.

[Description of Potting Step (Step M3) of Second Resin Member of Example 1: FIG. 9]
Next, the detail of the process of forming the 2nd fluorescent substance layer by the 2nd resin member of Example 1 of this invention is demonstrated. First, the potting process for applying the second resin member will be described with reference to FIG. FIG. 9 is an enlarged side view for explaining a potting process for applying the second resin member according to the first embodiment of the present invention, and shows a part of the collective substrate 1. As shown in FIG. 9, all LED elements 10 mounted on the surface of the collective substrate 1 are covered with a first phosphor layer 23 in which a first resin member containing the first phosphor 20 is cured. However, the second resin member 31 containing the second phosphor 30 different from the first phosphor 20 is applied by the dispenser 50 from above. The second phosphor 30 is schematically illustrated and is actually a fine particle.

  Here, the second phosphor 30 is a green phosphor that converts the wavelength of light emitted from the LED element 10 to green, and the second resin member 31 is an ultraviolet curable silicone resin that is cured by ultraviolet rays or near ultraviolet rays. It consists of. Although not shown, the second resin member 31 is applied to the entire surface of the collective substrate 1 so as to cover all the LED elements 10 and the first phosphor layer 23. The resin may be discharged while being moved. Thereby, it is possible to cover all the LED elements 10 and the wires 11 and 12 and the first phosphor layer 23 on the collective substrate 1.

[Description of Resin Curing Process (Process M4) of Second Resin Member of Example 1: FIG. 10]
Next, the details of the resin curing step of the second resin member of Example 1 of the present invention will be described with reference to FIG. FIG. 10 is an enlarged side view showing that the LED elements on the collective substrate self-emit to cure the second resin member. The configuration in which the DC power source 6 and the switch SW are connected to the electrode terminals 4 and 5 of the collective substrate 1 to cause the LED element 10 to emit light is the same as that shown in FIG. To do.

As shown in FIG. 10, when a driving current (not shown) is supplied again to each LED element 10 with the second resin member 31 applied to the entire surface of the collective substrate 1, the LED element 10 will automatically It emits light and emits near-ultraviolet outgoing light 15. Here, the emitted light 15 passes through the first phosphor layer 23, and a part of the light is absorbed by the first phosphor 20 and wavelength-converted, but the remaining near-ultraviolet emitted light 15 is The second resin member 31 is irradiated. Thereby, the area close to the LED element 10 and adjacent to the first phosphor layer 23 starts to be cured, and the second cured area 32 is formed.

  Since the film thickness of the second curing region 32 depends on the emission intensity of the emitted light 15 from the LED element 10, the second curing depends on the magnitude of the drive current supplied to the LED element 10 and the drive current supply time. The film thickness of the region 32 can be controlled. That is, in order to increase the thickness of the second cured region 32, the value of the drive current supplied to the LED element 10 may be increased, the supply time may be increased, or both may be performed. On the contrary, in order to reduce the thickness of the second cured region 32, the value of the drive current supplied to the LED element 10 is reduced, the supply time is shortened, or both are performed. Just do it.

  Here, as described above, since the second resin member 31 includes the second phosphor 30 that is a green phosphor, the second curing is performed when it is desired to increase the amount of green wavelength-converted light. It is only necessary to increase the film thickness of the region 32 and increase the amount of grains of the second phosphor 30. Conversely, when it is desired to reduce the amount of green wavelength converted light, the film thickness of the second cured region 32 is increased. What is necessary is just to make it thin and to reduce the particle quantity of the 2nd fluorescent substance 30. Thus, by controlling the value of the drive current for forming the second curing region 32 or the supply time, the amount of green wavelength-converted light can be arbitrarily adjusted. In FIG. 10, the first phosphor 20 and the second phosphor 30 are not shown in order to make the drawing easier to see.

  Next, the cleaning step (step M5) and the drying step (step M6) are performed after the resin curing step of the second resin member 31, but the description is omitted because it is the same as the step of the first resin member. To do. In addition, the 2nd hardening area | region 32 formed of the said process is an area | region which the 2nd resin member 31 hardened as mentioned above, This 2nd resin member 31 is the 2nd fluorescence which is a green fluorescent substance. Contains body 30. Accordingly, the second cured region 32 is formed as a second phosphor layer 33 containing the second phosphor 30.

  The second phosphor layer 33 covers the first phosphor layer 23, and the periphery of the first phosphor layer 23 as shown in the drawing according to the emission intensity distribution of the emitted light 15 from the LED element 10. Therefore, the wavelength of the emitted light 15 from the LED element 10 can be converted almost uniformly.

[Description of Resin Curing Process (Process M4) of Third Resin Member of Example 1: FIG. 11]
Next, the detail of the process of forming the 3rd fluorescent substance layer by the 3rd resin member of Example 1 of this invention is demonstrated. Here, the potting process of the third resin member is the same as the potting process of the second resin member, and the cleaning process and the drying process are the same as the cleaning process and the drying process of the first resin member. Since it is the same, the description is omitted, and only the resin curing step of the third resin member will be described with reference to FIG.

  FIG. 11 is an enlarged side view showing that the LED elements on the collective substrate emit light to cure the third resin member. The configuration in which the DC power source 6 and the switch SW are connected to the electrode terminals 4 and 5 of the collective substrate 1 to cause the LED element 10 to emit light is the same as that shown in FIG. To do.

As shown in FIG. 11, all the LED elements 10 mounted on the surface of the collective substrate 1 are covered with the first phosphor layer 23 including the first phosphor, and the second phosphor is applied thereon. The third phosphor member 33 containing the third phosphor 40 different from the first phosphor and the second phosphor is further coated thereon. It is applied by a potting process that omits explanation. Here, the third phosphor 40 is a blue phosphor that converts the light emitted from the LED element 10 into a blue wavelength, and the third resin member 41 is an ultraviolet curable silicone resin that is cured by ultraviolet rays or near ultraviolet rays. It consists of.

  As described above, when a driving current is supplied to each LED element 10 with the third resin member 41 applied, the LED element 10 emits light and emits near-ultraviolet emitted light 15. Here, the emitted light 15 passes through the first phosphor layer 23 and the second phosphor layer 33, and a part of the light is wavelength-converted, but the remaining emitted light 15 is the third resin member. 41 is irradiated. Thereby, the region close to the LED element 10 and adjacent to the second phosphor layer 33 starts to be cured, and the third cured region 42 is formed.

  Since the film thickness of the third curing region 42 depends on the emission intensity of the emitted light 15 from the LED element 10, the third curing depends on the magnitude of the drive current supplied to the LED element 10 and the drive current supply time. The film thickness of the region 42 can be controlled. That is, as described above, since the third resin member 41 contains the third phosphor 40 that is a blue phosphor, the third cured region is used when it is desired to increase the amount of blue wavelength converted light. The film thickness of 42 may be increased to increase the amount of grains of the third phosphor 40. Conversely, when the amount of blue wavelength converted light is to be reduced, the film thickness of the third cured region 42 is decreased. Thus, the amount of grains of the third phosphor 40 may be reduced. Thereby, the light quantity of blue wavelength conversion light can be arbitrarily adjusted by controlling the value of the drive current for forming the 3rd hardening field 42, or supply time.

  In addition, the 3rd hardening area | region 42 formed by the said process is an area | region which the 3rd resin member 41 hardened as mentioned above, This 3rd resin member 41 is the 3rd fluorescence which is a blue fluorescent substance. Contains the body 40. Accordingly, the third cured region 42 is formed as a third phosphor layer 43 containing the third phosphor 40.

  Thus, the three fluorescent substance layers which coat | cover LED element 10 are hardened | cured and formed by LED element 10 repeating self-light-emission 3 times. Here, as an example, when the driving current is constant at a predetermined value, the self-light-emitting time of the LED element 10 is about 1 second for forming the first phosphor layer 23. The self light emission time for forming the phosphor layer 33 is about 5 seconds, and the self light emission time for forming the third phosphor layer 43 is about 20 seconds. As described above, the self-luminous time varies greatly depending on each layer. The light intensity decreases as the distance between each phosphor layer and the LED element 10 differs and the outer layer is affected by light absorption by the phosphor. Because. In FIG. 11, the phosphors of the first, second, and third phosphor layers 23, 33, and 43 are not shown in order to make the drawing easier to see.

[Description of Layered Structure of Phosphor Layer of Example 1: FIG. 12]
Next, the laminated structure of the phosphor layer formed by the manufacturing method of the LED light source device of Example 1 of the present invention will be described with reference to FIG. FIG. 12 shows three phosphor layers of the LED light source device formed according to Example 1 of the present invention, and FIG. 12A is a perspective view showing the phosphor layers covering the LED elements on the collective substrate. FIG. 12B is an enlarged side view of the aggregate substrate showing the laminated structure of the phosphor layers, and shows a part of the side surface of the aggregate substrate 1, that is, the peripheral portion of the LED element 10.

As shown in FIGS. 12A and 12B, in the manufacturing method of the LED light source device of Example 1 of the present invention, the collective substrate 1 is manufactured from the collective substrate manufacturing process (process M1) to the drying process (process M6). A plurality of LED elements 10 are mounted on the surface of the collective substrate 1, and further, a first phosphor layer 23 covering each LED element 10, and a second phosphor layer 33 thereon, A third phosphor layer 43 is laminated thereon. That is, the layer directly covering the LED element 10 is formed of the first phosphor layer 23 containing the first phosphor 20 which is a red phosphor, and the outer layer is a second phosphor which is a green phosphor. The second phosphor layer 33 containing the phosphor 30 is formed, and the outermost surface of the phosphor layer is formed by the third phosphor layer 43 containing the third phosphor 40 which is a blue phosphor.

  Thus, the manufacturing method of the LED light source device of the present invention covers a large number of LED elements 10 by mounting a large number of LED elements 10 on the collective substrate 1 and causing these LED elements 10 to simultaneously emit light. Since the phosphor layers can be formed in a lump, this is a manufacturing method suitable for mass production. Moreover, if the manufacturing method of a present Example is applied, even if it is a case where the light emission intensity | strength of each LED element 10 arranged on the same aggregate substrate 1 differs, according to the light emission intensity of each LED element 10 The first to third phosphor layers having different thicknesses can be easily formed.

[Description of Sealing Process (Process M7) of Example 1: FIG. 13]
Next, details of the sealing process of the first embodiment of the present invention will be described with reference to FIG. FIG. 13 is a perspective view for explaining a sealing process according to the first embodiment of the present invention. As shown in FIG. 13, after the third phosphor layer 43 is formed on the outermost surface of the collective substrate 1, a sealing step of filling and curing the transparent sealing member 61 is performed. The sealing member 61 is preferably either a thermosetting resin or a photocurable resin.

  Through this process, the LED element 10, the wires 11, 12, the first, second, and third phosphor layers 23, 33, and 43, and the entire surface of the collective substrate 1 are sealed and electrically and mechanically protected. Thus, an LED light source device having excellent environmental resistance can be manufactured.

[Description of Cutting Process (Process M8) of Example 1: FIG. 14]
Next, the cutting process of Example 1 of this invention is demonstrated with reference to FIG. FIG. 14 shows a cutting process according to the first embodiment of the present invention, and FIG. 14A is a perspective view showing a part of the collective substrate for explaining a cutting process for separating a large number of LED light source devices completed on the collective board. FIG. 14B is a perspective view showing an example of a single LED light source device completed by the cutting process.

  As shown in FIG. 14A, the collective substrate 1 sealed by the sealing member 61 is cut and separated by a dicing device (not shown) or the like along predetermined cutting lines X and Y, and a plurality of LEDs are separated. The light source device is completed. The cutting line X is set between the electrodes 2 a to 2 e on the collective substrate 1, and the cutting line Y is set so as to pass through the centers of the through holes 3 a to 3 e on the collective substrate 1.

  Further, as shown in FIG. 14B, the completed LED light source device 60 has electrodes 2 a and 2 b formed on a substrate 1 ′ cut and separated from the collective substrate 1. The electrodes 2a and 2b have through holes 3a and 3b cut at the center, and the electrodes 2a and 2b (not shown) on the back surface of the substrate 1 'are electrically connected by the through holes 3a and 3b. The LED element 10 is mounted on the surface of the electrode 2a, and the LED element 10 is electrically connected to the electrodes 2a and 2b by the two wires 11 and 12 as described above.

  With this connection, when a driving voltage is supplied from the outside to the electrodes 2a and 2b on the back surface, a driving current flows to the LED element 10 through the wires 11 and 12, and the LED element 10 emits light. The LED element 10 is covered with the three phosphor layers as described above, and the third phosphor layer 43 on the outermost surface is sealed with a transparent sealing member 61.

  In the completed LED light source device 60, the electrodes 2a and 2b become the electrodes 2b and 2c, the electrodes 2c and 2d, or the electrodes 2d and 2e depending on the position separated from the collective substrate 1. In addition, the through holes 3a and 3b become the through holes 3b and 3c, the through holes 3c and 3d, or the through holes 3d and 3e depending on the positions separated from the collective substrate 1 in the same manner. Of course, they are the same LED light source device 60. Thus, this invention can manufacture many LED light source devices collectively.

[Description of Configuration and Operation of LED Light Source Device Manufactured by Example 1: FIG. 15]
Next, the outline of the configuration and operation of the LED light source device manufactured by the method of manufacturing the LED light source device of Example 1 of the present invention will be described with reference to FIG. FIG. 15 is a side view illustrating the configuration and operation of an LED light source device sealed with a transparent sealing member on three phosphor layers manufactured by the method of manufacturing an LED light source device of Example 1 of the present invention. It is.

  As shown in FIG. 15, in the LED light source device 60, an LED element 10 is mounted on a substrate 1 ′, and a phosphor layer composed of three layers is formed by covering the LED element 10, and the phosphor layer is made transparent. The sealing member 61 is used for the sealing. The phosphor layers are arranged in the vicinity of the LED element 10 from the first phosphor layer 23 (red phosphor), the second phosphor layer 33 (green phosphor), and the third phosphor layer 43 (blue phosphor). ) In this order.

  When driving the LED light source device 60, as an example, the electrodes 2a and 2b on the back surface of the LED light source device 60 are mounted on a printed board (not shown) by solder (not shown) or the like, and the electrodes on the back surface from the printed board. A drive voltage is applied to 2a and 2b. As a result, the driving voltage is transmitted to the electrodes 2a and 2b on the surface via the through holes 3a and 3b, and the driving current is supplied to the LED element 10 via the wires 11 and 12, so that the LED element 10 is near ultraviolet light. The emitted light 15 is emitted.

  The emitted light 15 is diffused radially around the front surface of the LED element 10, and first enters the first phosphor 20 that is a red phosphor contained in the first phosphor layer 23. The phosphor 20 absorbs the emitted light 15 and excites it, emits red light 16R as wavelength-converted light, and causes the second phosphor layer 33, the third phosphor layer 43, and the transparent sealing member 61 to be emitted. Passes and exits outside.

  Further, the outgoing light 15 that has not entered the first phosphor 20 and has passed through the first phosphor layer 23 enters the second phosphor 30 that is a green phosphor contained in the second phosphor layer 33. When incident, the second phosphor 30 absorbs the outgoing light 15 and excites it, emits green light 16G as wavelength-converted light, and passes through the third phosphor layer 43 and the transparent sealing member 61. Emits outside.

  Further, the outgoing light 15 that has not entered the second phosphor 30 and has passed through the second phosphor layer 33 enters the third phosphor 40 that is a blue phosphor contained in the third phosphor layer 43. When incident, the third phosphor 40 absorbs and emits the emitted light 15, emits blue light 16 </ b> B that is wavelength-converted light, passes through the transparent sealing member 61, and is emitted to the outside. Thereby, blue light 16B, green light 16G, and red light 16R are emitted from the LED light source device 60, and the respective lights are mixed and emitted as white light 16W.

  Here, as shown in the above-described FIG. 18 for the excitation characteristics of each phosphor, the third phosphor 40 (blue phosphor) contained in the third phosphor layer 43 laminated on the outermost surface is approximately Excited by a short wavelength of 430 nm or less. As a result, even if green light 16G having a wavelength of about 530 nm or red light 16R having a wavelength of about 650 nm is incident on the third phosphor layer 43 on the outermost surface, the wavelength-converted light is almost absorbed by the third phosphor 40. Therefore, the green light 16G and the red light 16R can pass through the third phosphor layer 43 with very little loss.

  The second phosphor 30 (green phosphor) contained in the second phosphor layer 33 is excited by a short wavelength of about 500 nm or less. Thereby, even if red light 16R having a wavelength of about 650 nm from the inner first phosphor layer 23 is incident on the second phosphor layer 33, the red light 16R is almost absorbed by the second phosphor 30. Therefore, the red light 16R can pass through the second phosphor layer 33 with very little loss.

As described above, the first phosphor layer 23 closest to the LED element 10 contains the red phosphor that emits a long wavelength, and the second phosphor layer 33 outside the green phosphor that emits the intermediate wavelength. Including the blue phosphor that emits a short wavelength in the third phosphor layer 43 on the outermost surface can suppress the influence of the interaction of wavelength-converted light by each phosphor. Excitation can be suppressed and the luminous efficiency of the LED can be improved. Thereby, it is possible to manufacture an LED light source device with high luminance and high output with little luminance variation.

  In addition, since the phosphors that emit RGB light are contained separately for each phosphor layer, the same phosphor particles contained in each phosphor layer are uniformly dispersed in each layer. That is, since each phosphor layer contains the same phosphor particles having the same specific gravity and particle size, the phosphor particles are uniformly dispersed in the layer without being biased. Thereby, since the phosphor layer in which the phosphor particles are uniformly dispersed is laminated, the wavelength conversion is performed by uniformly irradiating the phosphor particles of each layer with the emitted light from the LED element 10, and as a result, the color mixing property LED light source device that emits white light with good color uniformity and little color unevenness can be manufactured.

  Moreover, since the film thickness of each of the first, second, and third phosphor layers 23, 33, and 43 covering the LED element 10 is determined according to the emission intensity distribution of the LED element 10, each phosphor The film thickness of the layer can be easily controlled. As a result, a white LED light source device that can easily adjust the color of light emission and has an optimum color balance can be manufactured. Further, since the phosphor layer is formed in a relatively narrow region close to the LED element 10, it is a manufacturing method that can easily realize a reduction in size and thickness of the LED light source device.

  Further, by applying a photo-curing resin and curing the resin by the self-emission of the LED element 10, without being affected by the wires 11 and 12 that electrically connect the LED element 10 and the electrodes 2 a and 2 b of the substrate, Even in the gap between the wires 11 and 12 and the substrate 1 ', a plurality of thin phosphor layers can be formed with high accuracy without causing shape distortion, etc., so that the directivity and color mixing of the emitted white light 16W can be achieved. There is no adverse effect. Thereby, this invention is suitable for the LED light source device of wire bonding mounting.

  Further, according to the present invention, a large number of LED elements 10 are mounted on the collective substrate 1 and a large number of phosphor elements are self-luminous at the same time, thereby forming a phosphor layer having a predetermined film thickness around each LED element. Therefore, a plurality of LED light source devices with little variation in characteristics such as color unevenness can be manufactured in large quantities.

  In the manufacturing method of the present embodiment, the first phosphor layer including the first phosphor that is the red phosphor, the second phosphor layer including the second phosphor that is the green phosphor, and the blue phosphor. Although an example in which a third phosphor layer including a certain third phosphor is sequentially laminated is shown, the lamination order of the first to third phosphor layers may be changed. In that case, it should be noted that the problem due to the interaction of the wavelength-converted light described in the problem column is worse than that in the case of arranging in the above order.

[Schematic Description of Manufacturing Process of Manufacturing Method of LED Light Source Device of Example 2: FIG. 1]
Next, the outline of the manufacturing process of Example 2 of the present invention will be described. The feature of Example 2 is that the LED element is an LED element that emits near ultraviolet light, and has two phosphor layers containing the first and second phosphors. It is to manufacture an LED light source device that emits white light by sealing with a sealing member containing a body. And since the manufacturing method of Example 2 is the same as that of Example 1, only the manufacturing process different from Example 1 is demonstrated using FIG. 1 explaining the manufacturing process of above-mentioned Example 1. FIG. .

  In FIG. 1, the collective substrate manufacturing process (process M1) and the LED element mounting process (process M2) are the same as those in the first embodiment, and thus the description thereof is omitted.

  Next, the potting process (process M3) to the drying process (process M6) are the same as in Example 1, but in Example 1, the potting process to the drying process were repeated three times, and the periphery of the LED element was In addition, although the phosphor layers of the first, second, and third layers are laminated, in Example 2, the repetition from the potting process to the drying process is only two times. A first phosphor layer and a second phosphor layer are laminated around the LED element.

  Next, when the second drying step (step M6) is completed, a transparent sealing member containing a third phosphor is added to the second phosphor layer formed on the outermost surface on the aggregate substrate. A sealing step of filling and sealing is performed (step M7). Thereby, the sealing member is formed as the third phosphor layer. Thereafter, the collective substrate sealed by the sealing member is cut at a predetermined cutting position to complete a plurality of LED light source devices (step M8).

[Description of Configuration and Operation of LED Light Source Device Manufactured by Example 2: FIG. 16]
Next, the details of each manufacturing process of the second embodiment are basically the same as those of the first embodiment, so that the description thereof will be omitted. The configuration and operation of the LED light source device manufactured by the method of manufacturing the LED light source device of the second embodiment. The outline of will be described with reference to FIG. FIG. 16 is a side view illustrating the configuration and operation of an LED light source device sealed with a sealing member containing a third phosphor in the two phosphor layers manufactured in Example 2 of the present invention. The LED light source device manufactured according to the second embodiment is similar in basic structure to the LED light source device manufactured according to the first embodiment. Therefore, the same elements are denoted by the same reference numerals, and a duplicate description is partially omitted. To do.

  As shown in FIG. 16, reference numeral 70 denotes an LED light source device manufactured according to the second embodiment. The LED light source device 70 includes an LED element 10 mounted on a substrate 1 ′ and covers the LED element 10 in two layers. A first phosphor layer 23 and a second phosphor layer 33 are formed, and these phosphor layers are sealed with a sealing member 71 containing a third phosphor 40. As in Example 1, the first phosphor layer 23 contains the first phosphor 20 that is a red phosphor, and the second phosphor layer 33 is the second phosphor that is a green phosphor. Contains body 30. Further, the third phosphor 40 contained in the sealing member 71 is a blue phosphor as in the first embodiment.

  Thus, since the LED light source device 70 manufactured by Example 2 contains the 3rd fluorescent substance in the sealing member 71, the sealing member 71 is formed as the 3rd fluorescent substance layer 72. FIG. Therefore, the phosphor layer of the LED light source device 70 is the first phosphor layer 23 (red phosphor), the second phosphor layer from the immediate vicinity of the LED element 10 as in the LED light source device 60 of the first embodiment. 33 (green phosphor) and a third phosphor layer 72 (blue phosphor) by the sealing member 71 are laminated in this order.

  When driving the LED light source device 70, as shown in FIG. 16, it is mounted on an external printed board (not shown) or the like as in the first embodiment, and the driving voltage is applied from the printed board to the electrodes 2a and 2b on the back surface. Apply. As a result, the driving voltage is transmitted to the electrodes 2a and 2b on the surface via the through holes 3a and 3b, and the driving current is supplied to the LED element 10 via the wires 11 and 12, so that the LED element 10 is near ultraviolet light. The emitted light 15 is emitted.

  The emitted light 15 is diffused radially around the front surface of the LED element 10, and first enters the first phosphor 20 that is a red phosphor contained in the first phosphor layer 23. The phosphor 20 absorbs and excites the emitted light 15, emits red light 16 </ b> R that is wavelength-converted light, and passes through the second phosphor layer 33 and the third phosphor layer 72 that is the sealing member 71. Emits outside.

Further, the outgoing light 15 that has not entered the first phosphor 20 and has passed through the first phosphor layer 23 enters the second phosphor 30 that is a green phosphor contained in the second phosphor layer 33. When incident, the second phosphor 30 absorbs the excitation light 15 and excites it, emits green light 16G as wavelength-converted light, passes through the third phosphor layer 72 by the sealing member 71, and exits to the outside. To do.

  Further, the outgoing light 15 that has passed through the second phosphor layer 33 without entering the second phosphor 30 is incident on the third phosphor 40 that is a blue phosphor contained in the third phosphor layer 72. Then, the 3rd fluorescent substance 40 absorbs the emitted light 15, excites it, emits the blue light 16B which is wavelength conversion light, and radiate | emits it outside. Thereby, blue light 16B, green light 16G, and red light 16R are emitted from the LED light source device 70, and the respective lights are mixed and emitted as white light 16W.

  Thus, the LED light source device 70 manufactured by Example 2 contains the red fluorescent substance which emits a long wavelength in the 1st fluorescent substance layer 23 nearest to the LED element 10 similarly to Example 1, The second phosphor layer 33 on the outer side contains a green phosphor that emits an intermediate wavelength, and the sealing member 71 that is the outermost surface contains a blue phosphor that emits a short wavelength. Thereby, since the influence of the interaction of wavelength-converted light by each phosphor can be suppressed, secondary excitation of the phosphor can be suppressed and the light emission efficiency of the LED can be improved. As a result, it is possible to manufacture an LED light source device with little luminance variation and high luminance and high output.

  Further, since the sealing member 71 of Example 2 contains the blue phosphor as described above, the third phosphor layer 43 containing the blue phosphor as in Example 1 is not required, Compared with the manufacturing method of Example 1, the resin coating for one layer, the curing process, and the like can be reduced, and the manufacturing process can be simplified.

  In addition, the third phosphor layer 72 formed by the sealing member 71 is generally formed by heating or the like without depending on the self-light emission from the LED element 10, but the first and second phosphor layers. 23 and 33 are formed by being cured by the self-emission of the LED element 10, the thickness of each phosphor layer is determined according to the emission intensity distribution of the LED element 10. Thereby, the film thickness of each fluorescent substance layer can be controlled easily, and the white LED light source device with which the color adjustment of light emission is easy and color balance is optimal can be manufactured.

  The basic structure of the manufacturing method according to the second embodiment and the LED light source device 70 manufactured according to the second embodiment is the same as the manufacturing method according to the first embodiment described above and the LED light source device 60 manufactured according to the first embodiment. Therefore, the second embodiment also has many excellent effects and features as in the first embodiment.

[Schematic Explanation of Manufacturing Process of Manufacturing Method of LED Light Source Device of Example 3: FIG. 1]
Next, the outline of the manufacturing process of Example 3 of the present invention will be described. The feature of Example 3 is that the LED element is a blue LED element, and an LED light source device that emits white light by two phosphor layers containing the first and second phosphors is manufactured. And since the manufacturing method of Example 3 is the same as that of Example 1, only the manufacturing process different from Example 1 is demonstrated using FIG. 1 explaining the process of Example 1 mentioned above.

  In FIG. 1, the collective substrate manufacturing process (process M1) and the LED element mounting process (process M2) are the same as those in the first embodiment, and thus the description thereof is omitted. In Example 3, the LED element mounted on the collective substrate is a blue LED element having an emission wavelength of about 450 nm.

  Next, the potting process (process M3) to the drying process (process M6) are the same as in Example 1, but in Example 1, the potting process to the drying process were repeated three times, and the periphery of the LED element was In addition, the phosphor layers of the first, second, and third layers are laminated and formed, but in Example 3, the repetition from the potting process to the drying process is only two times. A first phosphor layer and a second phosphor layer are laminated around the LED element.

  Next, when the second drying step (step M6) is completed, a sealing step is performed in which the second phosphor layer formed on the outermost surface on the aggregate substrate is filled with a transparent sealing member and cured. Implement (step M7). Thereafter, the collective substrate sealed by the sealing member is cut at a predetermined cutting position to complete a plurality of LED light source devices (step M8).

[Description of Configuration and Operation of LED Light Source Device Manufactured by Example 3: FIG. 17]
Next, the details of each manufacturing process of the third embodiment are basically the same as those of the first embodiment, so that the description thereof is omitted, and the configuration and operation of the LED light source device manufactured by the manufacturing method of the LED light source device of the third embodiment. The outline of will be described with reference to FIG. FIG. 17 is a side view illustrating the configuration and operation of an LED light source device having two phosphor layers manufactured in Example 3 of the present invention. The LED light source device manufactured according to the third embodiment is similar in basic structure to the LED light source device manufactured according to the first embodiment. Therefore, the same reference numerals are given to the same elements, and a duplicate description is partially omitted. To do.

  As shown in FIG. 17, reference numeral 80 denotes an LED light source device manufactured according to the third embodiment. The LED light source device 80 emits blue light having an emission wavelength of about 450 nm on the substrate 1 ′ as an example. Is mounted, and the blue LED element 81 is covered to form a first phosphor layer 23 composed of two layers and a second phosphor layer 33. These phosphor layers are formed into a transparent sealing member 61. It is the structure sealed with. And the 1st fluorescent substance layer 23 which directly coat | covers the blue LED element 81 contains the 1st fluorescent substance 20 which is a red fluorescent substance, and the 2nd fluorescent substance layer 33 of the outer side is a green fluorescent substance. A second phosphor 30 is contained.

  When driving this LED light source device 80, as shown in FIG. 17, it is mounted on an external printed circuit board (not shown) or the like in the same manner as in the first embodiment, and the driving voltage is applied from the printed circuit board to the back electrodes 2a and 2b. Apply. As a result, the driving voltage is transmitted to the surface electrodes 2a and 2b through the through-holes 3a and 3b, and the driving current is supplied to the blue LED element 81 through the wires 11 and 12, so that the blue LED element 81 has blue light 16B. Is emitted.

  The blue light 16B diffuses radially around the front surface of the blue LED element 81, and first enters the first phosphor 20 that is a red phosphor contained in the first phosphor layer 23. The phosphor 20 absorbs the blue light 16B and is excited, emits red light 16R which is wavelength-converted light, passes through the second phosphor layer 33 and the sealing member 61, and is emitted to the outside.

  Further, the blue light 16 </ b> B that has not entered the first phosphor 20 and has passed through the first phosphor layer 23 enters the second phosphor 30 that is a green phosphor contained in the second phosphor layer 33. When incident, the second phosphor 30 absorbs and excites the blue light 16B, emits green light 16G as wavelength-converted light, passes through the sealing member 61, and exits to the outside.

  Further, the remaining blue light 16B that has passed through the two phosphor layers without entering the first phosphor 20 and the second phosphor 30 passes through the transparent sealing member 61 without being wavelength-converted, and is externally transmitted. To exit. Thereby, blue light 16B, green light 16G, and red light 16R are emitted from the LED light source device 80, and the respective lights are mixed and emitted as white light 16W.

  As described above, the LED light source device 80 manufactured according to the third embodiment contains the red phosphor that emits a long wavelength in the first phosphor layer 23 closest to the blue LED element 81, and the second phosphor on the outside thereof. By including a green phosphor that emits an intermediate wavelength in the phosphor layer 33, the influence of the interaction of wavelength-converted light by the two phosphors can be suppressed, so that the secondary excitation of the phosphor is suppressed and the luminous efficiency of the LED is suppressed. Can be improved.

Moreover, since the blue LED element 81 emits blue light 16B, a phosphor layer containing a blue phosphor is not required, and a resin coating or curing process for one layer is performed as compared with the manufacturing method of Example 1. It can be reduced and the manufacturing process can be simplified.

  Further, since the first and second phosphor layers 23 and 33 are formed by being cured by self-emission from the blue LED element 81, the film thickness of each phosphor layer is the emission intensity distribution of the blue LED element 81. It is decided according to. Thereby, the film thickness of each fluorescent substance layer can be controlled easily, and the white LED light source device with which the color adjustment of light emission is easy and color balance is optimal can be manufactured.

  Further, the manufacturing method according to the third embodiment and the basic structure of the LED light source device 80 manufactured according to the third embodiment are the same as the manufacturing method according to the first embodiment and the LED light source device 60 manufactured according to the first embodiment. Since this is the same, the third embodiment also has many excellent effects and features as in the first embodiment.

  In addition, the 1st, 2nd resin member 21 and 31 as described in Example 1- Example 3 and the 3rd resin member 41 as described in Example 1 are the ultraviolet curable type | mold hardened | cured by an ultraviolet-ray or near-ultraviolet rays. Although shown as resin, it is not limited to this, The thermosetting resin hardened | cured by heat | fever may be sufficient. In this case, in the same manner as the manufacturing process shown in Example 1, the thermosetting resin including the first phosphor around the LED element was partially cured by causing the LED element to emit light by itself. Later, the uncured portion of the thermosetting resin is removed. The thickness of the phosphor layer formed of the thermosetting resin in this step is determined by the amount of heat generated when the LED element 10 or the blue LED element 81 is self-luminous. Subsequently, by repeating the phosphor layer forming step, an LED light emitting device in which a plurality of phosphor layers are stacked can be easily manufactured in the same manner as in the first embodiment.

  In addition, when a thermosetting resin is applied to this resin member, there may be a problem due to the interaction of wavelength-converted light described in the problem column, but according to the manufacturing method using the thermosetting resin, Compared with Example 1-3, it has the advantage that control of the film thickness of each fluorescent substance layer can be performed more accurately.

  Moreover, although the LED light source device manufactured by the present invention has been described on the assumption that white light is emitted in the embodiments, the emitted light of the LED light source device by the manufacturing method of the present invention is not limited to white light. Alternatively, an LED light source device that emits light of other colors may be used. Moreover, the LED light source device manufactured by this invention is not limited to the mounting by wire bonding, For example, it is applied also to the LED light source device by flip-chip mounting etc. The flowcharts, front views, side views, and the like shown in the embodiments of the present invention are not limited to these, and may be arbitrarily changed as long as they satisfy the gist of the present invention.

  The manufacturing method of the LED light source device of the present invention can provide a high-performance white LED light source device with good color mixing, little color unevenness and excellent luminous efficiency, and therefore for a backlight for liquid crystal color televisions, portable electronic devices, etc. It is suitable as a manufacturing method of a white light source device or a white light source device for illumination.

DESCRIPTION OF SYMBOLS 1 Collective substrate 1 'Board | substrate 2a-2e Electrode 3a-3e Thru hole 4, 5 Electrode terminal 6 DC power supply 10 LED element 11, 12 Wire 15 Output light 16R Red light 16G Green light 16B Blue light 16W White light 20 1st fluorescent substance 21 1st resin member 22 1st hardening area | region 23 1st fluorescent substance layer 30 2nd fluorescent substance 31 2nd resin member 32 2nd hardening area 33 2nd fluorescent substance layer 40 3rd fluorescent substance 41 Third resin member 42 Third cured region 43, 72 Third phosphor layer 50 Dispenser 51 Organic solvent 52 Heat 60, 70, 80 LED light source device 61, 71 Sealing member 81 Blue LED element SW switch X, Y cutting line

Claims (11)

In the manufacturing method of the LED light source device formed by curing the sealing resin covering the LED element,
Applying the first resin member containing the first phosphor while covering the LED element;
A step of partially curing the first resin member around the LED element by causing the LED element to emit light;
Removing the uncured portion of the first resin member to form a first phosphor layer;
Applying a second resin member containing a second phosphor different from the first phosphor so as to cover the first phosphor layer;
A step of partially curing the second resin member around the first phosphor layer by causing the LED element to emit light;
Forming a second phosphor layer by removing an uncured portion of the second resin member. A method of manufacturing an LED light source device, comprising: After forming the second phosphor layer,
Applying a third resin member containing a third phosphor different from the first and second phosphors while covering the second phosphor layer;
A step of partially curing the third resin member around the second phosphor layer by causing the LED element to emit light;
The method for producing an LED light source device according to claim 1, wherein a step of forming a third phosphor layer is performed by removing an uncured portion of the third resin member. The LED element is an n-UV light emitting diode;
The first phosphor is a phosphor that converts the emission color from the LED element into red,
The second phosphor is a phosphor that converts the emission color from the LED element to green,
The method of manufacturing an LED light source device according to claim 2, wherein the third phosphor is a phosphor that converts a color emitted from the LED element into blue. The LED element is a blue light emitting diode;
The first phosphor is a phosphor that converts the emission color from the LED element into red,
The method of manufacturing an LED light source device according to claim 1, wherein the second phosphor is a phosphor that converts a color emitted from the LED element into green. The phosphor layer formed on the outermost surface is sealed with a transparent sealing member. The method of manufacturing an LED light source device according to any one of claims 2 to 4. The LED element is an n-UV light emitting diode;
The first phosphor is a phosphor that converts the emission color from the LED element into red,
The method of manufacturing an LED light source device according to claim 1, wherein the second phosphor is a phosphor that converts a color emitted from the LED element into green. The LED light source device according to claim 6, wherein the second phosphor layer is sealed with a transparent sealing member including a phosphor that converts a light emission color from the LED element into blue. Manufacturing method. The LED element is caused to emit light by supplying a current to the LED element through wire bonding in which an electrode part provided on a substrate and the LED element are electrically connected to each other. The manufacturing method of the LED light source device as described in any one of these. The first and second resin members are ultraviolet curable resins,
The method of manufacturing an LED light source device according to any one of claims 1 to 8, wherein the thickness of each phosphor layer is a film thickness determined by a light emission intensity distribution of the LED element. The first and second resin members are thermosetting resins,
The method of manufacturing an LED light source device according to any one of claims 1 to 8, wherein the thickness of each phosphor layer is a film thickness determined by an amount of heat when the LED element emits light by itself. . The phosphor layer having the determined film thickness is formed around each LED element by arranging a plurality of the LED light source devices on a collective substrate and causing a plurality of LED light source devices to emit light simultaneously. Or the manufacturing method of the LED light source device of 10.

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