CN210668362U - Packaging module and lighting device - Google Patents

Abstract

The utility model discloses an encapsulation module and lighting device, this encapsulation module include the base plate and set up the luminescence unit on the base plate, and the luminescence unit includes first luminescence unit and second luminescence unit at least, and first luminescence unit and second luminescence unit have different light-emitting areas respectively, and the shape of first luminescence unit and second luminescence unit is one kind or the multiple combination in circular, square or the rectangle. In this way, the utility model discloses can optimize the circuit, evenly arrange the chip of different colours in a flexible way, realize the hi-lite.

Description

Packaging module and lighting device

Technical Field

The utility model relates to the field of lighting technology, concretely relates to encapsulation module and lighting device.

Background

With the development of Light Emitting Diode (LED) technology, the brightness of LED chips, packaged devices or packaged modules has been greatly improved, and LED packaged modules have been developed in the direction of high power, high power density and high brightness, especially in the aspect of white Light illumination. However, when the brightness of the LED white light is increased, the requirement of people on the light quality is also increasing, and in the white light aspect with special requirements on the color rendering index, the industry generally uses blue light to excite red phosphor or green phosphor with a certain waveband to achieve the effect of improving the color rendering index, but the purity of monochromatic light generated by exciting the phosphor is not high, so the light quality, dimming and color mixing are not good enough.

The utility model discloses an inventor discovers in long-term research and development, for realizing high-quality light-emitting effect and photochromic adjustable performance, has adopted red Chip, green Chip and blue Chip collocation white light to carry out the technique of encapsulating on the market at present, and the common four unification encapsulation devices that have RGBW and the Chip on board (COB, Chip OnBoard) product that forms by the Chip mixture of many different colours, nevertheless often can appear luminance not high, the circuit is complicated, the inhomogeneous phenomenon of light-emitting. In addition, when the existing RGBW four-in-one packaging device needs to realize the independent driving of each chip, each chip needs to be provided with at least two pins, and the complexity of a circuit is further increased.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the problem of main solution provides a encapsulation module and lighting device, can optimize the circuit, evenly arranges the chip of different colours in a flexible way, realizes the hi-lite.

In order to solve the above technical problem, the utility model discloses a technical scheme provide an encapsulation module, this encapsulation module includes: the light-emitting unit at least comprises a first light-emitting unit and a second light-emitting unit, the first light-emitting unit and the second light-emitting unit are respectively provided with different light-emitting areas, and the first light-emitting unit and the second light-emitting unit are in one or more combinations of circles, squares or rectangles.

In order to solve the above technical problem, another technical solution adopted in the present invention is to provide a lighting device, which includes the above-mentioned package module.

By the proposal, the beneficial effects of the utility model are that: the utility model provides an encapsulation module includes: the light-emitting unit at least comprises a first light-emitting unit and a second light-emitting unit, the first light-emitting unit and the second light-emitting unit are respectively provided with different light-emitting areas, and the first light-emitting unit and the second light-emitting unit are in one or a combination of multiple of a circle, a square or a rectangle; the original chips with different colors and the same size are decomposed into chips with different sizes and are arranged and combined, the number of pins and electrode leads on the substrate is reduced, circuits can be optimized, and the LED chips with different colors can be flexibly and uniformly arranged, so that the lighting requirements of high brightness and high quality are met.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts. Wherein:

fig. 1 is a schematic structural diagram of a first embodiment of a package module according to the present invention;

FIG. 2 is a schematic diagram of the overall arrangement of the LED chips in the embodiment shown in FIG. 1;

FIG. 3 is another schematic diagram of the overall arrangement of LED chips in the embodiment shown in FIG. 1;

FIG. 4 is a schematic diagram of an LED chip in the embodiment shown in FIG. 1;

fig. 5 is a schematic structural diagram of a second embodiment of the package module according to the present invention;

fig. 6 is a schematic view of the overall arrangement of the light emitting diode chips in the embodiment shown in fig. 5;

FIG. 7 is another schematic diagram of the overall arrangement of LED chips in the embodiment shown in FIG. 5;

FIG. 8 is a schematic diagram of an LED chip in the embodiment shown in FIG. 5;

fig. 9 is another schematic diagram of the led chip of the embodiment shown in fig. 5;

fig. 10 is a schematic structural diagram of an embodiment of the lighting device provided by the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work all belong to the protection scope of the present invention.

Referring to fig. 1, fig. 1 is a schematic structural diagram of a first embodiment of an encapsulation module according to the present invention, which includes: a substrate 10, and a light emitting unit 20 disposed on the substrate 10.

The substrate 10 is a substrate 10 for LED package, and may be a ceramic substrate 10, a Metal Core Printed Circuit Board (MCPCB), an Epoxy Molding Compound (EMC), a Plastic Chip Carrier with leads (PLCC), or the like.

The light emitting unit 20 at least includes a first light emitting unit 21 and a second light emitting unit 22, the first light emitting unit 21 and the second light emitting unit 22 respectively have different light emitting areas, and the first light emitting unit 21 and the second light emitting unit 22 can emit light of at least one color; the light emission colors of the first and second light emitting units 21 and 22 may be red, green, blue, cyan, white, orange, violet, or the like. The shapes of the first light emitting unit 21 and the second light emitting unit 22 may be one or a combination of plural kinds of circles, squares, rectangles, or the like.

The light emitting unit 20 may be a light emitting diode or include a light emitting diode and phosphor, that is, the light emitting diode directly emits light of a corresponding color or the light emitting diode excites the phosphor to generate light of a corresponding color, and the light emitting unit 20 may be specifically realized by coating phosphor on the surface thereof, attaching a phosphor film or a ceramic phosphor sheet, and the like. For example, the light emitting unit 20 is a violet light emitting diode, which can directly generate violet light, and also can generate violet light by generating blue laser light to excite a phosphor of a certain color.

The first light emitting unit 21 is a main light emitting unit, and the second light emitting unit 22 is an auxiliary light emitting unit; in order to increase the light emitting area and the light emitting brightness of the primary color light, the size of the primary light emitting chip may be set to be relatively large, that is, the size of the first light emitting unit 21 is larger than that of the second light emitting unit 22; therefore, the light emitting area of the first light emitting unit 21 is far larger than that of the second light emitting unit 22, the distance between the light emitting units is reduced by increasing the size of the first light emitting unit 21, the improvement of the light emitting efficiency of a light source is facilitated, the adjustment range of the driving power corresponding to the first light emitting unit 21 is increased, the power can be adjusted more finely, the first light emitting unit 21 is controlled to emit emergent light with different brightness gradients, and the adjustment range of the brightness is enlarged.

In addition, the colors and positions of the first light-emitting unit 21 and the second light-emitting unit 22 can be adjusted according to specific requirements, so that the circuit can be simplified, the light-emitting brightness can be ensured, and the light and color can be uniformly and finely adjusted.

In addition, this encapsulation module can also include the electrode lead (not shown in the figure), and this electrode lead is used for connecting the luminous element 20 and the pin (not shown in the figure) of base plate 10, and every luminous element 20 includes first electrode and second electrode (not shown in the figure) respectively, and every luminous element 20's first electrode and second electrode are connected with two pins respectively, compare prior art and need set up a plurality of sizes and be equivalent luminous element 20, the utility model discloses a set up a luminous element of great light-emitting area, have less pin and electrode lead, can simplify circuit design, save space, conveniently regulate and control first luminous element 21 and second luminous element 22 moreover.

Being different from the prior art, this implementation provides an encapsulation module, and this encapsulation module includes: the light-emitting device comprises a substrate 10, a first light-emitting unit 21 and a second light-emitting unit 22, wherein the first light-emitting unit 21 and the second light-emitting unit 22 are arranged on the substrate 10, and the light-emitting area of the first light-emitting unit 21 is larger than that of the second light-emitting unit 22; the number of the light emitting units 20 is reduced by increasing the light emitting area of the first light emitting unit 21, so that the number of pins and electrode leads on the substrate 10 is reduced, the circuit can be optimized, the light emitting area can be increased, the light emitting efficiency is improved, the power adjusting range corresponding to the first light emitting unit 21 can be increased, the power can be adjusted more finely, and the adjusting range of the brightness is enlarged.

In a specific embodiment, the light emitting unit is a light emitting diode chip 20, and the light emitting diode chip 20 includes a first light emitting diode chip 21 and a second light emitting diode chip 22; the first led chips 21 are disposed in the middle of the substrate 10, and the plurality of second led chips 22 are disposed around the first led chips 21; the overall arrangement shape of the light emitting diode chip 20 may be a rectangle, a hexagon, or the like, as shown in fig. 2 and 3.

Each light emitting diode chip 20 can be driven independently, or the light emitting units with the same light emitting color can be driven in series, so that the effect of uniform and adjustable brightness, color rendering index and color temperature of the packaging module is achieved.

In a specific scheme, as shown in fig. 4, the second led chip 22 includes a red light chip 221, a first green light chip 222, a first blue light chip 223, a first sub-chip 224, a second sub-chip 225, or a third sub-chip 226, where the number of the red light chips 221 and the first sub-chip 224 is two, the two red light chips 221 are symmetrically disposed around the middle position of the substrate 10, the two first sub-chips 224 are symmetrically disposed around the middle position of the substrate 10, and it should be noted that the light emitting areas of the plurality of second led chips 22 are all the same.

The positions and the number of the electrode leads (not shown in the figure) can be adjusted according to the practical application scene; the colors and sizes of the first sub-chip 224, the second sub-chip 225 and the third sub-chip 226 may be set according to specific needs to meet the requirement of high brightness.

As a specific solution of the first embodiment of the package module of the present invention, the first led chip 21 can be a white chip, and the first sub-chip 224 can be an orange chip or a yellow chip; the led chip 20 is a vertical structure, the first led chip 21 is a white chip, and in order to increase the light output of white light, the size of the first led chip 21 disposed in the middle of the substrate 10 is larger; the first sub-chip 224 is an orange chip or a yellow chip, the second sub-chip 225 is a second green chip, the third sub-chip 226 is a third blue chip, the first green chip 222 and the second green chip are symmetrically arranged around the middle position of the substrate 10, the first green chip 222 and the second green chip can emit light in the same manner, and the first blue chip 223 and the third blue chip are symmetrically arranged around the middle position of the substrate 10; two red light chips 221, a first green light chip 222, a first blue light chip 223, two orange light chips, a second green light chip and a third blue light chip are symmetrically distributed around the white light chip, so that the number of pins 11 on the substrate 10 can be reduced, the circuit is optimized, and the five colors can be uniformly and adjustably realized integrally.

According to the actual product requirement, on the basis of the scheme shown in fig. 4, the second green chip can be replaced by a cyan chip; the first sub-chip 224 is an orange chip, the second sub-chip 225 is a cyan chip, the third sub-chip 226 is a third blue chip, the first led chip 21 is a white chip, the cyan chip and the first green chip 222 are symmetrically disposed around the middle of the substrate 10, and the first blue chip 223 and the third blue chip are symmetrically disposed around the middle of the substrate 10, so that six colors can be adjusted.

In another scheme, the third sub-chip 226 may be set as a fourth blue chip on the basis of the previous scheme, the light emitting wavelength of the first blue chip 223 is smaller than that of the fourth blue chip, the first blue chip 223 is disposed between the first green chip 222 and the orange chip, and the fourth blue chip is disposed between another orange chip and the cyan chip; the third blue light chip in the previous scheme is replaced by a fourth blue light chip with different wavelengths, so that seven-color adjustability is achieved.

In addition, a plurality of second light emitting units can be further disposed as required, as shown in fig. 5, fig. 5 is a schematic structural diagram of a second embodiment of the package module provided by the present invention, in which the light emitting units are light emitting diode chips.

The led chip at least includes a first led chip 21, a second led chip 22 and a third led chip 23, and the first led chip 21, the second led chip 22 and the third led chip 23 have different light emitting areas respectively.

The LED chip can be rectangular, round, square and the like; the arrangement of the first led chip 21, the second led chip 22 and the third led chip 23 is not limited to that shown in fig. 5, and the arrangement may be performed according to specific needs, for example, the second led chip 22 and the third led chip 23 are respectively disposed on two opposite sides of the first led chip 21 or in a diagonal direction; the overall arrangement shape of the light emitting diode chip 20 may be a rectangle, a hexagon, or the like, as shown in fig. 6 and 7.

In addition, at least three second led chips 22 may be disposed on the substrate 10 as required, the second led chips 22 may be uniformly distributed around the first led chip 21, and the gaps between the led chips are relatively small, so as to fully utilize the space and increase the light emitting area.

The original chips with different colors and the same size are decomposed into chips with different sizes and are arranged and combined, so that the number of pins and electrode leads on the substrate 10 is reduced, the circuit can be optimized, and the light-emitting units with different colors can be flexibly and uniformly arranged, so that the requirements of high brightness and high quality are met.

In a specific embodiment, as shown in fig. 8, the second led chip 22 includes two red chips 221, a green chip 222, a first blue chip 223, a cyan chip 224, and a third blue chip 225; the size of the third led chip 23 is larger than the size of the red light chip 221, the first green light chip 222, the first blue light chip 223 and the cyan light chip 224, and the sizes of the red light chip 221, the first green light chip 222, the first blue light chip 223 and the cyan light chip 224 are equal, that is, the size of the third led chip 23 is larger than the size of the second led chip 22; the LED chips with large size and small size can be matched, and the specific size and position can be flexibly adjusted according to the requirements, and are not limited to the LED chips shown in FIG. 8.

The first led chip 21 may be a yellow chip, a white chip or an orange chip, and the third led chip 23 may be an orange chip or a yellow chip; in some specific applications, the uv chip may be matched with other led chips, for example, the first led chip 21 is a yellow led chip, and the third led chip 23 is a uv chip.

In other specific schemes, the second led chip further includes two fourth sub-chips 226 symmetrically disposed around the middle position of the substrate 10, the third led chip 23 is an orange chip, one fourth sub-chip 226 is disposed between the red led chip 221 and the orange chip, and the other fourth sub-chip 226 is disposed between the other red led chip 221 and the other orange chip; by adjusting the position, number and color of the led chips 20, eight-color adjustability can be achieved.

Specifically, the first led chip 21 may be a white chip or a yellow chip, and the fourth sub-chip 226 may be an ultraviolet chip or a yellow chip.

According to the scheme, the plurality of light emitting diode chips 20 can be arranged according to a certain rule to form a packaging module, the number and the types of the light emitting diode chips 20 are not limited, and the light emitting diode chips 20 with large size and small size can be matched; the packaging module can be applied to multi-color LED packaging modules, such as twelve-in-one ceramic substrate 10 packaging and multi-color COB packaging, and has a good protection effect on the packaging or chip matching mode of multi-color products.

Referring to fig. 10, fig. 10 is a schematic structural diagram of an embodiment of the lighting device according to the present invention, and the lighting device 100 includes the package module 101 in the above embodiment.

The package module 101 includes a first led chip with a larger size and a second led chip (not shown in the figure) surrounding the first led chip, and by dividing a plurality of original chips with different colors and equivalent sizes into chips with different sizes, the number of pins on the substrate can be reduced, thereby optimizing the circuit, and flexibly and uniformly arranging the led chips with different colors to achieve higher brightness.

The above is only the embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structures or equivalent processes of the present invention are used in the specification and the attached drawings, or directly or indirectly applied to other related technical fields, and all the same principles are included in the protection scope of the present invention.

Claims (10)

1. The packaging module is characterized by comprising a substrate and a light emitting unit arranged on the substrate, wherein the light emitting unit at least comprises a first light emitting unit and a second light emitting unit, the first light emitting unit and the second light emitting unit are respectively provided with different light emitting areas, and the first light emitting unit and the second light emitting unit are in one or more combinations of circles, squares or rectangles.

2. The package module of claim 1,

the light-emitting unit is a light-emitting diode chip, the light-emitting diode chip comprises a first light-emitting diode chip and at least one second light-emitting diode chip, the first light-emitting diode chip is arranged in the middle of the substrate, the second light-emitting diode chip is arranged around the first light-emitting diode chip in a surrounding mode, and the light-emitting area of the first light-emitting diode chip is larger than that of the second light-emitting diode chip.

3. The package module of claim 2,

the second light-emitting diode chip comprises two red light chips, two first green light chips, two first blue light chips, two first sub-chips, two second sub-chips or three sub-chips, wherein the two red light chips and the two first sub-chips are symmetrically arranged around the middle position of the substrate, and the two first sub-chips are symmetrically arranged around the middle position of the substrate.

4. The package module of claim 2,

the first light emitting diode chip comprises a second blue light chip and fluorescent powder arranged on a light emitting surface of the second blue light chip, and the fluorescent powder is excited by blue light emitted by the second blue light chip to generate fluorescence.

5. The package module of claim 3,

the first light-emitting diode chip is a white light chip, the first sub-chip is an orange light chip or a yellow light chip, the second sub-chip is a second green light chip, the third sub-chip is a third blue light chip, the first green light chip and the second green light chip are symmetrically arranged around the middle position of the substrate, and the first blue light chip and the third blue light chip are symmetrically arranged around the middle position of the substrate.

6. The package module of claim 3,

the first light-emitting diode chip is a white light chip, the first sub-chip is an orange light chip or a yellow light chip, the second sub-chip is a cyan light chip, the third sub-chip is a third blue light chip, the cyan light chip and the first green light chip are symmetrically arranged around the middle position of the substrate, and the first blue light chip and the third blue light chip are symmetrically arranged around the middle position of the substrate.

7. The package module of claim 6,

the third sub-chip is a fourth blue chip, the light-emitting wavelength of the first blue chip is smaller than that of the fourth blue chip, the first blue chip is arranged between the first green chip and the first sub-chip, and the fourth blue chip is arranged between the other first sub-chip and the blue chip.

8. The package module of claim 2,

the light-emitting diode chip further comprises a third light-emitting diode chip, the light-emitting area of the third light-emitting diode chip is larger than that of the second light-emitting diode chip and smaller than that of the first light-emitting diode chip, and the second light-emitting diode chip and the third light-emitting diode chip are arranged around the first light-emitting diode chip in a surrounding mode.

9. The package module of claim 8,

the second LED chip also comprises two fourth sub-chips which are symmetrically arranged around the middle position of the substrate, and the fourth sub-chips are arranged between the red light chip and the orange light chip.

10. A lighting device, characterized in that the lighting device comprises the packaged module of any one of claims 1-9.

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