KR20100098463A

KR20100098463A - Light emitting module

Info

Publication number: KR20100098463A
Application number: KR1020090015387A
Authority: KR
Inventors: 이상민
Original assignee: 서울반도체 주식회사
Priority date: 2009-02-24
Filing date: 2009-02-24
Publication date: 2010-09-07
Also published as: KR101562774B1

Abstract

A light emitting module including a PCB and LED light sources arranged on the PCB is disclosed, wherein the LED light sources of the light emitting module include a plurality of white light sources each composed of a combination of a blue LED chip and a yellow phosphor, and a blue LED chip. It comprises a plurality of red light sources each consisting of a combination of red phosphors.

Description

Light emitting module {LIGHT EMITTING MODULE}

The present invention relates to a light emitting module used in a luminaire or a back light unit (BLU), and more particularly, to a light emitting module including a plurality of white light sources and a plurality of red light sources.

The development of lighting devices or backlight units using LEDs is increasing. LED is basically composed of p-type and n-type semiconductor junction, and it is a device using light emitting semiconductor that emits energy corresponding to band gap of semiconductor in the form of light by combining electron and hole when voltage is applied.

White light emitting devices are known which produce white light using three primary LEDs of red, green and blue colors. Such a white light emitting device has a problem in that the circuit configuration is complicated, the uniform white light is difficult to be realized due to the distance difference between the three primary LEDs, and the economy is also poor. In addition, the method using the three primary color LED has a poor color rendering problem.

FIG. 11 shows the full color of the conventional white light emitting device on the CIE1931 chromaticity coordinate diagram. Referring to FIG. 11, a triangle representing the three primary color coordinates used by the NTSC standard is displayed, and a red color within the triangle is shown. The light in the white region may be implemented according to the change in the slope of the coordinates due to the current applied to the (R), green (G), and blue (B) LEDs. At this time, the white region is displayed along a black body locus curve (BBL curve), and the slope of the black body radiation curve increases from ∞ to about 4000K based on the horizontal axis and the vertical axis xy and then decreases after about 4000K. It has an aspect. Therefore, the red, blue, and green LEDs alone do not implement good color rendering light (particularly, warm white light) following the blackbody radiation curve.

On the other hand, a white light emitting device for producing white light by using a combination of a blue LED and a yellow phosphor is also known. Such a conventional white light emitting device has the advantages of a simple circuit configuration and a low cost, but of course the color rendering is inferior. However, the color reproducibility is also greatly reduced due to the low light intensity at long wavelengths.

Further, a light emitting device that produces white light by a combination of red and green phosphors having different excitation wavelengths and a blue LED chip is also known in the art. Such a white light emitting device has blue, green, and red peak wavelengths, and therefore, color rendering and color reproducibility are better than those of light emitting devices using a kind of yellow phosphor. However, such a light emitting device has a problem in that the light loss is large and the efficiency of the phosphor is also low because heterogeneous phosphors are positioned without being separated from each other in one encapsulant.

On the other hand, in the related art, a hybrid type light emitting module in which a red LED chip is added to an existing white light emitting device has been proposed as a part for compensating relatively insufficient red light and improving color rendering. However, such a hybrid type light emitting module has difficulty in achieving white balance due to the use of a red LED chip vulnerable to heat and its deterioration phenomenon, and therefore, it has not been mass produced or put into practical use.

Therefore, the technical problem of the present invention is to provide a light emitting module having improved color rendering, color reproducibility, color uniformity, etc. by adding red light sources emitting red light by a combination of a blue LED chip and a red phosphor to white light sources.

According to an aspect of the present invention, there is provided a light emitting module including a printed circuit board (PCB) and LED light sources arranged on the PCB, wherein the LED light sources include a plurality of white light sources, a blue LED chip and a red phosphor. It includes a plurality of red light source each consisting of a combination of. Herein, the light emitting module may be applied to a backlight unit or a general lighting device.

According to an embodiment of the present invention, each of the LED light sources may be formed by mounting an LED package including an LED chip and a phosphor on the PCB. According to another embodiment, each of the LED light sources may be formed after the LED chip is mounted on the PCB, the LED chip is covered by a phosphor. According to yet another embodiment, some of the LED light sources are made of an LED package including an LED chip and a phosphor is mounted on the PCB, the rest of the LED light sources, the LED chip is mounted on the PCB After that, the phosphor may be formed on the LED chip.

According to another embodiment of the present invention, each of the plurality of white light sources is included in each of a plurality of LED packages mounted on the PCB with a corresponding red light source, each of the white light source and the The red light sources may be optically independent of each other. In this case, the white light source and the red light source may be separated by a partition wall dividing a cavity of the LED package. More specifically, each of the plurality of LED packages includes an outer wall defining a cavity in which the white light source and the red light source are accommodated, and a partition wall separating the white light source and the red light source, wherein the outer wall is a light guide plate or an optical fiber. In contact with the panel and the partition wall is spaced apart from the light guide plate or the optical panel.

Preferably, each of the plurality of white light sources is located at vertices of a plurality of consecutive regular polygonal arrays, and each of the plurality of red light sources is located at the center of each of the regular polygonal arrays. More preferably, the regular polygonal arrangement may be a regular hexagonal arrangement.

Preferably, the light of each of the white light sources is in a rectangular region defined by color coordinates (0.29, 0.45), (0.33, 0.37), (0.52, 0.47), (0.45, 0.54) on the CIE chromaticity diagram, The light of each of the red light sources is in a rectangular region defined by color coordinates (0.36, 0.34), (0.44, 0.2), (0.67, 0.32), (0.55, 0.44) on the CIE chromaticity diagram.

Preferably, the white light sources can emit light alone or together with the red light source. In addition, the color temperature of the light generated by the white light sources and the red light sources may be 2500K-4500.

According to an embodiment, each of the blue LED chips of the white light sources may be a multi-cell type LED chip including a plurality of light emitting cells. In this case, the multi-cell type LED chip may be an AC LED chip operated by an AC power source. In this case, at least one of the white light sources may include a delayed phosphor.

Preferably, each of the white light sources is a combination of a blue LED chip and at least one phosphor having a peak wavelength in the range of 500 to 600 nm. Alternatively, the phosphor of each of the white light sources can be selected from a yellow phosphor, a combination of green and amber phosphors, and a combination of green, amber and red phosphors.

According to another aspect of the present invention, there is provided a light emitting module comprising a PCB and LED light sources arranged on the PCB, wherein the LED light sources are blue LED chips having a peak wavelength in the range of 400 to 480 nm, and in the range of 500 to 600 nm. A plurality of white light sources comprising a combination of one or more phosphors having a peak wavelength of; And a plurality of red light sources consisting of a combination of a blue LED chip having a peak wavelength in the range of 400 to 480 nm and at least one phosphor having a peak wavelength greater than 600 nm.

According to embodiments of the present invention, red light from red light sources is supplemented by white light from white light sources, in particular white light sources comprising a blue LED chip and at least one phosphor having a peak wavelength in the range of 500 to 600 nm. By doing so, white light having good color reproducibility and color rendering property, in particular, warm white light can be obtained. At this time, since the blue LED chip is used in place of the red LED chip, the red light source is vulnerable to heat, there is no degradation of the white balance due to deterioration. As used herein, the term 'white light' is defined as a broader range of white light, including warm white light.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The following embodiments are provided as examples to ensure that the spirit of the present invention to those skilled in the art will fully convey. Accordingly, the present invention is not limited to the embodiments described below and may be embodied in other forms. And, in the drawings, the width, length, thickness, etc. of the components may be exaggerated for convenience. Like numbers refer to like elements throughout.

1 shows a light emitting module according to an embodiment of the present invention.

As shown in FIG. 1, the light emitting module 10 of the present embodiment includes a PCB 100 and a plurality of LED light sources W and R arranged on the PCB 100. The PCB 100 includes a plurality of electrode patterns (not shown) on the top surface. The PCB 100 is sufficient to include an electrode pattern or a circuit capable of supplying power to the LED light sources W and R, and the material or structure of the substrate on which the electrode pattern or the circuit is formed may be variously modified. It is.

The LED light sources include a plurality of white light sources W and a plurality of red light sources R. In the present embodiment, the white light sources W generate white light by the blue LED chip and the yellow phosphor, and the red light sources R generate red light by the blue LED chip and the red phosphor. The white light sources W generate white light as basic light, and the red light sources R adjust the CRI of the white light. Therefore, the number of the white light sources W is greater than the number of the red light sources R, and preferably, the number ratio of the white light source to the red light source is 2: 1 to 7: 1.

The LED light sources are preferably arranged such that the red light generated from each of the red light sources R is uniformly mixed with respect to the white light sources W adjacent to the corresponding red light source R.

To this end, in the embodiment shown in Figure 1, the white light source (W) is arranged to be located at the vertex of the regular hexagon (A1) indicated by a dashed line on the PCB (100). The regular hexagonal arrays are continuous in all directions. In addition, each of the red light sources R is located at the center of the corresponding hexagonal arrangement in which the white light sources W occupy six vertices. Therefore, the red light generated from the corresponding red light source R is mixed with the white light generated from all the white light sources W adjacent thereto at a predetermined distance to compensate for the relatively insufficient red light, and further, to adjust the CRI of the white light. Can be. At this time, it can also be seen that the small regular hexagon A1 array defined by the white light sources W is located in the large regular hexagon A2 (indicated by the double-dotted line) array defined by the red light sources R. Alternatively, the white light sources W may be located at the vertices of other regular polygonal arrangements other than the regular hexagon, and the corresponding red light source R may be located at the center of the regular polygonal arrangement. Also, it may be considered that the red light source R is spaced apart from the plurality of white light sources W adjacent thereto by a predetermined distance. The light emitting module in the arrangement as shown in FIG. 1 is applicable to lighting fixtures, but is very suitable for a backlight unit, in particular a direct backlight unit.

2 is a cross-sectional view taken along the line I-I of FIG.

Referring to FIG. 2, the white light source W is formed by mounting an LED package including a blue LED chip 112 and a yellow phosphor 114 on the PCB 100. In addition, the red light source R is formed by mounting an LED package including a blue LED chip 122 and a red phosphor 124 on the PCB 100.

In this case, each of the LED package, the reflector (110, 120) having a cavity is formed, the LED chips 112, 122 are attached to the bottom of the cavity of the reflector (110, 120), respectively. The reflectors 110 and 120 have lead terminals (not shown), each of which is electrically connected to each of the LED chips 112 and 122 in each of the reflectors 110 and 120. The phosphors 114 and 124 are formed to cover the LED chips 112 and 122, respectively. The transmissive encapsulants 111 and 121 are formed to fill the cavities of the reflectors 110 and 120 having the LED chips 112 and 122 and the phosphors 114 and 124, respectively. The LED packages as described above are mounted on the PCB 100, and as a result, the above-described white light source W and red light source R are prepared. At this time, lead terminals of the LED packages are electrically connected to electrode patterns on the PCB 100.

As shown, the phosphors 114 and 124 may be mixed with a liquid or gel-like resin such as silicon or epoxy before the encapsulant is formed, and may be formed on the LED chips 112 and 122 in a dotting manner. Unlike, by electrophoresis, it may be formed so as to cover the LED chip alone without resin.

In addition, the phosphors may be included in the form of particles in the coating layer or the secondary molded material formed on the upper surface of the encapsulant, or may be included in the form of particles in the film attached to the upper surface of the encapsulant. In addition, the phosphors may be located scattered widely in the encapsulant. In addition, other types of LED packages including a substrate having a lead terminal pattern or a similar function component may be used instead of the above-described reflector.

In the present embodiment, the white light source W is formed by the combination of the blue LED chip 112 and the yellow phosphor 114, and the red light source R is the blue LED chip 122 and the red phosphor 124. Is made by a combination of The emission peak wavelength range of the blue LED chips 112 in the white light source W may be approximately 400 to 480 nm, and the emission peak wavelength range of the blue LED chip 122 in the red light source R may also be approximately 400 to 480 nm. have. According to an embodiment of the present invention, the yellow phosphor is preferably used as the phosphor 114 paired with the blue LED chip 112 in the white light source W, but depending on the purpose, for example, in addition to the yellow phosphor, , A combination of an amber phosphor and a green phosphor, or a combination of an amber phosphor, a green phosphor, and a red phosphor may be used. As a phosphor in a white light source, various phosphors may be used regardless of the wavelength range, such as partially using a red phosphor, but one or more phosphors that may be used in the white light source W may have a peak wavelength range of 500 nm to 600 nm. It's best to stay inside.

The red phosphor 124 in the red light source R preferably has a peak wavelength range larger than 600 nm.

In the present embodiment, the white light source W generates a basic light of white or yellowish white by mixing blue light by the blue LED chip 112 and yellow light by the yellow phosphor 114. At this time, part of the blue light generated from the blue LED chip 112 excites the yellow phosphor 114, whereby the yellow phosphor 114 emits yellow light. The rest of the blue light generated from the blue LED chip 112 proceeds as it is, avoiding the yellow phosphor 114. Accordingly, the white light source W may generate a basic light of white or yellowish white by mixing the yellow light and the blue light.

However, since the basic light as described above lacks red light and decreases color rendering, it is necessary to supplement red light and adjust CRI. The red light source R generates red light mixed with the basic light emitted from the white light source W. At this time, the red light source R emits red light by mixing the blue light emitted by the blue LED chip 122 and the red light emitted by the red phosphor 124 excited by the blue light. Red light at this time is defined as including pink light close to red.

In the CIE 1931 chromaticity diagram shown in FIG. 3, the color coordinate range of the basic light by the white light source W is as far as possible from the blackbody radiation curve, that is, the Y coordinate value of the CIE 1931 chromaticity diagram is large. However, it is preferable that the color coordinate range of the basic light is set to such an extent that the color coordinate range can be pulled near the blackbody radiation curve by the CRI control light which is red light from the red light source R having a fixed color.

The white light generated by the white light source W, i.e., the basic light, has a rectangular shape determined by the color coordinates (0.29, 0.45), (0.33, 0.37), (0.52, 0.47), and (0.45, 0.54) on the CIE chromaticity diagram. The CRI tunable light generated by the red light source R, which is determined to be in the first region, is the color coordinates (0.36, 0.34), (0.44, 0.2), (0.67, 0.32), (0.55, 0.44) on the CIE chromaticity diagram. It is determined to be within the second area of the rectangle defined by. At this time, the light obtained by the white light source W and the red light source R is warm white light instead of cool white light and is near the black body radiation curve. The color temperature range of the obtained warm white light may be approximately 2500K to 4500K, most preferably 2500K to 3500K.

The red light source R and the white light source W are completely separated by belonging to different LED packages. In addition, the red light source R and the white light source W may be operated together to produce warm white light, or only the white light source W may be operated to produce cool white light.

Ideally, all the light generated from the blue LED chip 122 of the red light source R may work with the red phosphor 124, but in reality, some of the blue light from the blue LED chip 122 remains external as it is. Is released. However, even if the blue light of such a red light source R comes out without wavelength conversion, since it is mixed with the yellow light wavelength-converted by the yellow phosphor 114 in the white light source W, the red light source R It is not necessary to strictly limit blue light emission from the.

4 is a plan view illustrating a light emitting module according to another embodiment of the present invention, and FIG. 5 is a cross-sectional view taken along II-II of FIG. 4. 4 and 5, after the LED chips 112 and 122 are mounted on the PCB 100 in both the white light sources W and the red light sources R, the corresponding LED chips 112 and 122 are mounted. Are formed by being covered by the phosphors 114 and 124. As a method of covering the LED chips 112 and 122 with the phosphors 114 and 124, for example, there may be a method of doping liquid resins in which the phosphors 114 and 124 are mixed on the corresponding LED chips 112 and 122. Can be.

In addition, as shown in FIG. 6, some of the LED light sources, that is, the white light source W includes an LED package including a blue LED chip 112 and a yellow phosphor 114 on the PCB 100. The remaining light sources of the LED light sources, that is, the red light sources R are red on the blue LED chip 122 after the blue LED chip 122 is mounted on the PCB 100. The phosphor 124 is formed by being covered by, for example, a dotting method. On the contrary, the red light source R may be mounted on the PCB 100 in an LED package structure, and the white light source W may be covered with a yellow phosphor after the blue LED chip is mounted on the PCB.

7 illustrates a light emitting module including a multi-cell type LED chip according to another embodiment of the present invention.

Referring to FIG. 7, the light emitting module of the present embodiment, like the previous embodiment, has a white light source W having a blue LED chip 112 and a yellow phosphor 114, another blue LED chip 122, and a red light. And red light sources R having the phosphor 124. A plurality of white light sources W are disposed around each of the red light sources R. According to the present embodiment, the white or yellowish white primary light generated in the white light source W may be evenly mixed with the CRI-mixed light generated from the red light source R positioned in the vicinity thereof without biasing to one side. Thus, the combinations can produce more uniform warm white light without color deviation.

At this time, the blue LED chip 112 of the white light source (W) is preferably a multi-cell type LED chip including a plurality of light emitting cells. More preferably, the multi-cell type LED chip is an AC LED chip operated by an alternating current. An enlarged view of FIG. 7 exemplarily shows a structure of a multicell LED chip. Referring to this, the multi-cell type LED chip includes a substrate 112-1 and a plurality of light emitting cells C ₁ , C ₂ ,..., C formed by growth of semiconductor layers on the substrate 112-1. _n-1 , C _n ). At this time, the plurality of light emitting cells C ₁ , C ₂ , ..., C _n-1 , C _n are connected in series by the wirings W ₁ , W ₂ ,..., W _n-1 , W _n . Each of the light emitting cells is sequentially formed on the substrate 112-1 or a buffer layer (not shown) on the substrate 112-1, the active layer 1122, and the p-type semiconductor layer 1123. It includes. In this case, the transparent electrode layer 112-2 may be formed on the p-type semiconductor layer 1123. In addition, part of the active layer 1122 and the p-type semiconductor layer 1123 are removed from a portion of the n-type semiconductor layer 1121, and a light emitting cell adjacent to, for example, a portion of the n-type semiconductor layer 1121 is removed. An electrode that can be connected with a p-type semiconductor layer by wiring can be provided.

One wire W _{1 is} disposed between the n-type semiconductor layer 1121 of one light emitting cell C ₁ and the electrode of the p-type semiconductor layer 1123 of another light emitting cell C ₂ adjacent to the light emitting cell. Connect. In addition, the series array of the plurality of light emitting cells may be inversely connected to the series array of other light emitting cells on the same PCB.

As described above, the multi-cell type LED chip 112 grows an n-type semiconductor layer, an active layer, a p-type semiconductor layer, and the like on the substrate, and the semiconductor layers are divided into a plurality of light emitting cells C ₁ , C ₂ , and the like. ... C _n-1 , C _n ), and the light emitting cells may be connected in series. Alternatively, the AC LED chip may be made by mounting a plurality of LED chips made in advance on a submount, and then connecting the plurality of LED chips mounted on the submount in series and in parallel. In such a case, AlN, Si, Cu, Cu-W, Al ₂ O ₃ , SiC, Ceramic, etc. may be used as the material of the submount. If necessary, a material for insulating the submount and each LED chip can be interposed therebetween.

In addition, although not shown, the white light source W may include a layer including a delayed phosphor, that is, a delayed phosphor layer. The delayed phosphor layer is provided to reduce the flickering phenomenon of the multicell type blue LED chip 112 operated by alternating current, for example, on the upper surface of the encapsulant 111 covering the white light source (W). Can be formed.

Alternatively, since the cells of the LED chip connected to the AC power source are repeatedly turned on and off according to the direction of the current, flickering occurs when light flickers. In this case, if the DC LED chip 122 is used as the blue LED chip of the red light source R, and the DC LED chip 122 is connected to a DC power source, the flickering phenomenon may be reduced. In addition, in order to further improve the above flickering or THD (Total Harmonic Distortion) phenomenon, the AC LED or its operating circuit, the anti-flickering circuit part and / or anti-THD (Total Harmonic Distortion) in the form of an element or IC It is preferable to connect the circuit part in a circuit. In addition, according to the temperature change of the above-described AC LED and / or DC LED, the current control unit for controlling the current flowing to the AC LED can be connected to the operation circuit of the AC LED.

The delayed phosphor may be, for example, silicates, aluminates, sulfide phosphors, and the like disclosed in US Pat. Nos. 5,770,111, US Pat. No. 5,839,718, US Pat. For example, (Zn, Cd) S: Cu, SrAl2O4: Eu, Dy, (Ca, Sr) S: Bi, ZnSiO4: Eu, (Sr, Zn, Eu, Pb, Dy) O. (Al, Bi) 2O3, m (Sr, Ba) O.n (Mg, M) O.2 (Si, Ge) O2: Eu, Ln (where 1.5≤m≤3.5, 0.5≤n≤1.5, where M is Be, Zn and At least one element selected from the group consisting of Cd, Ln is Sc, Y, La, Ce, Pr, Nd, Sm, Gd, Tb, Dy, Ho, Er, Tm, Yb, KLu, B, Al, Ga, In , Tl, Sb, Bi, As, P, Sn, Pb, Ti, Zr, Hf, V, Nb, Ta, Mo, W, Cr and at least one element selected from the group consisting of Mn).

The afterglow time of the delayed phosphor may be 1 msec or more, more preferably 8 msec or more. The upper limit of afterglow time of the delayed phosphor may vary depending on the use of the light emitting device, and is not particularly limited but is preferably 10 hours or less.

8 is a cross-sectional view of a light emitting module according to another embodiment of the present invention suitable for a luminaire.

Referring to FIG. 8, the frame may include a base 210 and a reflector 220. The PCB 100 is installed on the base portion 210, and a plurality of red light sources R and a plurality of white light sources W having a package structure are installed on the PCB 100. As in the previous embodiments, each of the white light sources W includes a blue LED chip 112 and a yellow phosphor 114, and each of the red light sources R has a different blue LED chip 122 and a red phosphor. 124. In this case, a blue LED chip of the white light source W and / or the red light source R may be an AC LED chip. In this case, the base part 210 or the PCB 100 may have an anti-flickering circuit part 152. And / or anti-THD circuitry 154 is preferably provided. In addition, a circuit 156 provided with various components such as a heat dissipation system, a ballast, a driver, and / or a driving circuit may be provided to the base unit 210 or the PCB 100. In addition, the reflector 220 may be formed of a delayed phosphor 193 only when using an AC LED chip.

9 is a cross-sectional view for describing a light emitting module having a structure suitable for a backlight unit, in particular, an edge type backlight unit.

Referring to FIG. 9, a light guide plate 30 constituting a part of the backlight unit together with the light emitting module and the light emitting module is illustrated.

Referring to FIG. 9, the light emitting module 10 is positioned on the side surface of the light guide plate 30. The light emitting module 10, like the previous embodiments, includes a PCB 100, a plurality of white light sources (W), and a plurality of red light sources (R). In addition, the white light source W and the red light source R are integrated in each of the LED packages 1000 mounted on the PCB 100 in pairs.

The LED package 1000 includes an outer wall 132 for accommodating both the white light source W and the red light source R therein. In addition, a partition 134 is formed in the cavity defined by the outer wall 132 to separately receive the white light source W and the red light source R. The height of the partition wall 134 is lower than the height of the outer wall 132, and thus, a region in which the white or yellowish white primary light generated in the white light source W and the red light generated in the red light source R may be mixed. It is provided adjacent to the side surface of this light guide plate 30.

The first blue LED chip 112 of the white light source is positioned on the left side of the partition 134 and covers the first blue LED chip 112, and the first flat fluorescent resin layer including the yellow phosphor 114 is included. It is formed at a height equal to or less than the partition wall 134. In addition, on the right side of the partition 134, a second blue LED chip 122 is positioned, and a flat second fluorescent resin layer including a red phosphor 124 is disposed to cover the second blue LED 122. It is formed at a height less than or equal to the barrier rib 134. In addition, the transparent resin layer T is formed to cover the first fluorescent resin layer and the second fluorescent resin layer. The transparent resin layer T has the same height as the outer wall 132 of the LED package described above and is in contact with the side surface of the light guide plate 30.

10 is a cross-sectional view for describing a light emitting module for a backlight unit according to another embodiment of the present invention.

As shown in FIG. 10, the light emitting module 10 of the present embodiment includes the LED package 1000 including the partition wall 134 smaller than the outer wall 132, as in the previous embodiment. By the partition wall 134, the white light source W and the red light source R are disposed independently of each other. However, the difference from the previous embodiment is that the resin containing the phosphor is hemispherical in shape, and the transparent resin layer T (see FIG. 9) of the previous embodiment is omitted. In this case, the hemispherical fluorescent resin parts of the white and red light sources including the phosphors 112 and 114, respectively, have a height lower than that of the outer wall 132.

1 is a plan view showing a light emitting module according to an embodiment of the present invention, showing an arrangement of LED light sources.

2 is a sectional view taken along the line I-I of FIG.

3 is a diagram illustrating a region of light generated by a white light source and a red light source of a light emitting module according to an embodiment of the present invention in a CIE1931 chromaticity diagram.

4 is a plan view for explaining a light emitting module according to another embodiment of the present invention;

5 is a cross-sectional view taken along II-II of FIG. 4.

6 is a cross-sectional view showing a light emitting module according to another embodiment of the present invention.

7 is a view for explaining a light emitting module including a multi-cell type LED chip according to another embodiment of the present invention.

8 is a cross-sectional view showing a light emitting module according to another embodiment of the present invention suitable for a luminaire.

9 is a cross-sectional view illustrating a light emitting module according to an embodiment of the present invention suitable for an edge type backlight unit.

10 is a cross-sectional view illustrating a light emitting module according to another embodiment of the present invention suitable for an edge type backlight unit.

11 is a CIE1931 chromaticity diagram showing the full color of a typical white light emitting device.

Claims

A light emitting module comprising a PCB and LED light sources arranged on the PCB, wherein the LED light sources,

A plurality of white light sources; And

A light emitting module comprising a plurality of red light sources each consisting of a combination of a blue LED chip and a red phosphor.

The light emitting module according to claim 1, wherein each of the LED light sources is formed by mounting an LED package including an LED chip and a phosphor on the PCB.

The light emitting module according to claim 1, wherein each of the LED light sources is formed after the LED chip is mounted on the PCB, and the LED chip is covered by a phosphor.

The method of claim 1, wherein some of the LED light source is an LED package including an LED chip and a phosphor is mounted on the PCB, the rest of the LED light source is LED after the LED chip is mounted on the PCB Light emitting module characterized in that the phosphor is formed on the chip is covered.

The light emitting module of claim 1, wherein each of the plurality of white light sources is positioned at vertices of a plurality of consecutive regular polygonal arrays, and each of the plurality of red light sources is located at the center of each of the regular polygonal arrays. .

The light emitting module of claim 5, wherein the regular polygonal array is a regular hexagonal array.

The light source of claim 1, wherein the light of each of the white light sources is in a rectangular region defined by color coordinates (0.29, 0.45), (0.33, 0.37), (0.52, 0.47), (0.45, 0.54) on a CIE chromaticity diagram. Light of each of the red light sources is in a rectangular region defined by color coordinates (0.36, 0.34), (0.44, 0.2), (0.67, 0.32), (0.55, 0.44) on the CIE chromaticity diagram. .

The light emitting module of claim 1, wherein the white light sources are capable of emitting light alone or together with the red light sources.

The method of claim 1, wherein each of the plurality of white light sources is included in each of a plurality of LED packages mounted on the PCB together with a corresponding red light source, wherein the white light source and the red light source are optically included in each LED package. Light emitting module, characterized in that independent from each other.

The light emitting module according to claim 9, wherein the white light source and the red light source are separated by a partition wall dividing a cavity of the LED package.

The light emitting module according to claim 1, wherein the color temperature of the light produced by the white light sources and the red light sources is 2500K to 4500K.

The light emitting module of claim 1, wherein each of the blue LED chips of the white light sources is a multi-cell type LED chip including a plurality of light emitting cells.

The light emitting module according to claim 12, wherein the multicell type LED chip is an AC LED chip operated by an AC power source.

The light emitting module of claim 13, wherein at least one of the white light sources comprises a delayed phosphor.

The light emitting device of claim 9, wherein each of the plurality of LED packages includes an outer wall defining a cavity in which the white light source and the red light source are accommodated, and a partition wall separating the white light source and the red light source, wherein the outer wall is a light guide plate or an optical fiber. A light emitting module in contact with a panel, wherein the partition wall is spaced apart from the light guide plate or the optical panel.

The light emitting module of claim 1, wherein each of the white light sources comprises a combination of a blue LED chip and at least one phosphor having a peak wavelength in a range of 500 to 600 nm.

The method according to claim 1, wherein each of the white light source is made of a combination of blue LED chip and a pair of phosphors, each phosphor of the white light source, a yellow phosphor, a combination of green and amber phosphor, green Light emitting module, characterized in that one selected from a combination of amber and red phosphor.

A plurality of white light sources comprising a combination of a blue LED chip having a peak wavelength in the range of 400 to 480 nm and at least one phosphor having a peak wavelength in the range of 500 to 600 nm;

A light emitting module comprising a plurality of red light sources comprising a combination of a blue LED chip having a peak wavelength in the range of 400 to 480 nm and at least one phosphor having a peak wavelength greater than 600 nm.