JP5349167B2 - Manufacturing method of LED light source device - Google Patents

Description

  The present invention relates to an LED light source device including a resin layer containing a phosphor that emits wavelength-converted light when excited by receiving light emitted from a light emitting element, and a method for manufacturing the LED light source device.

  Conventionally, light-emitting diodes (hereinafter abbreviated as LEDs), which are compound semiconductors, are widely used as light source devices by taking advantage of their long life and miniaturization. In addition, LEDs that emit blue light using gallium nitride-based compound semiconductors (hereinafter abbreviated as GaN-based semiconductors) have been developed and commercialized, so that a resin that seals LED elements contains a phosphor that emits yellow light. LED light source devices that obtain pseudo white light by mixing blue light and yellow light have been put into practical use. In addition, LEDs having a peak wavelength from ultraviolet light to near ultraviolet light (for example, 350 to 410 nm) have been developed by GaN-based semiconductors, and are excited by receiving this ultraviolet light to near ultraviolet light, thereby causing red light, green light, An LED light source device that obtains white light using three types of phosphors that emit blue light is also disclosed.

  In such a white LED, a manufacturing method is disclosed in which after the photocurable phosphor-containing composition is applied to the LED element, the LED element emits light to cure the photocurable phosphor-containing composition (for example, Patent Document 1). The manufacturing method of this white LED light source device includes a step of forming a photocurable phosphor-containing composition layer on the surface of the LED element, a step of causing the LED element to emit light and curing the photocurable phosphor-containing composition, And a step of removing the uncured product so as to leave a cured product of the photocurable phosphor-containing composition after the curing step. And when using ultraviolet LED as an LED element, it has shown that a blue fluorescent substance, a red fluorescent substance, and a green fluorescent substance are mix | blended with a photocurable fluorescent substance containing composition, respectively.

  And even if uneven mixing of the phosphor particles contained in the photocurable phosphor-containing composition occurs, in the optical path where there are a lot of phosphor particles, the curing of the composition does not proceed, the cured region becomes thin, It has been shown that in an optical path with few phosphor particles, the cured region becomes thicker as the composition is cured. Thereby, it is shown that the converted light from the phosphor is adjusted to suppress uneven color and uneven light emission.

JP 2008-159756 A (pages 4 and 10)

However, the manufacturing method of the white LED light source device of Patent Document 1 has the following problems.
In the production method in which the LED element self-emits to cure the photocurable phosphor-containing composition, usable resins are limited to UV curable resins. In other words, if a resin that cures with light having a longer wavelength than ultraviolet to near-ultraviolet light is used in the LED light source device, the sealing resin has an absorption band in the visible light region, and the sealing resin absorbs light emitted from the LED element. As a result, the luminance is reduced. Therefore, in the conventional LED light source device, a photocurable resin other than the UV curable resin cannot be used.

Moreover, in the manufacturing method of the white LED light source device of patent document 1, in order to carry out resin hardening using UV curable resin for the said reason, the LED element which can be used is limited to n-UV light emission LED. Therefore, there is a problem that the above-described blue LED and other visible light emitting LEDs cannot be applied to the present technology.

  Moreover, in the manufacturing method of the white LED light source device of patent document 1, when the LED element self-emits and the photocurable phosphor-containing composition is cured, the phosphor layer formed by curing has the light emission intensity of the LED element. Since it is formed depending on the LED element, it becomes a substantially semispherical shape with the LED element as the center, and there is a problem that color unevenness (chromaticity variation) due to the emission angle occurs. The reason will be described below.

FIG. 20 shows an example of a conventional LED light source device for explaining the above problem. As shown in FIG. 20, reference numeral 100 is an example of a conventional LED light source device disclosed in Patent Document 1 or the like.
In the LED light source device 100, the LED element 102 is mounted on the substrate 101, the LED element 102 is covered, and the phosphor layer 110 containing the phosphor has a photocurable phosphor-containing composition formed by self-emission of the LED element. This is a cured region, and is formed in a substantially semispherical shape according to the light emission intensity of the LED element 102.

  That is, since the emitted light 120a emitted from the LED element 102 in the vertical direction has a high emission intensity, the phosphor layer 110 is cured to a distance far from the emission surface 102a of the LED element 102. Further, since the emitted light 120b emitted from the LED element 102 in the diagonal direction on the left side in the drawing has a low emission intensity, the curing of the phosphor layer 110 stops at a relatively close distance from the emission surface 102a of the LED element 102. Further, since the emitted light 120c emitted from the LED element 102 in the lateral direction on the right side in the drawing has a low emission intensity, the curing of the phosphor layer 110 stops at a relatively close distance from the emission surface 102a of the LED element 102. As described above, the phosphor layer 110 has a substantially hemispherical shape centered on the LED element 102 because the vertical distance from the LED element 102 becomes longer and the oblique direction and the lateral direction gradually become shorter from the LED element 102. It is formed.

  Here, when the LED light source device 100 is driven, the emitted light 120a emitted perpendicularly from the LED element 102 is emitted to the outside through the phosphor layer 110, but from the emission surface 102a of the LED element 102. A length passing through the phosphor layer 110 is defined as a path length 121a. Similarly, the emitted light 120b emitted in the diagonal direction on the left side of the drawing from the LED element 102 is similarly emitted obliquely through the phosphor layer 110, but is emitted from the emission surface 102a of the LED element 102 to the outside. The length passing through the layer 110 is defined as a path length 121b. Similarly, the emitted light 120c emitted from the LED element 102 in the lateral direction on the right side in the drawing similarly passes through the phosphor layer 110 in the lateral direction and is emitted to the outside, but is emitted from the emission surface 102a of the LED element 102. A length passing through the body layer 110 is defined as a path length 121c.

  Here, the path length 121a in the vertical direction and the path lengths 121b and 121c in the oblique direction and the horizontal direction are different depending on the direction from the emission surface 102a of the LED element 102 to the end of the phosphor layer 110 as described above. It can be understood that the vertical path length 121a is long and the diagonal and horizontal path lengths 121b and 121c are short. Thereby, the outgoing light 120a in the vertical direction is incident on and absorbed by many phosphors 111 in the phosphor layer 110 because the path length 121a is long. In addition, since the path lengths 121b and 121c are short, the outgoing lights 120b and 120c in the oblique direction and the lateral direction are incident on and absorbed by the few phosphors 111 in the phosphor layer 110. Accordingly, the wavelength conversion ratio of the emitted light varies depending on the emission angle of the emitted light from the LED element 102.

That is, the emitted light 120a in the vertical direction of the LED element 102 has a high ratio of wavelength conversion, so that the amount of converted light increases. However, the emitted light 120 in the oblique and lateral directions of the LED element 102 is increased.
Since b and 120c have a small wavelength conversion rate, the amount of converted light is small. As a result, color unevenness occurs depending on the emission angle of the emitted light, which is a problem.

  An object of the present invention is to solve the above-described problems, and to provide an LED light source device and a method for manufacturing the same that are not limited to the emission wavelength of an LED element and have little color unevenness.

  In order to solve the above problems, the LED light source device and the manufacturing method thereof according to the present invention employ the following means.

  The LED light source device of the present invention is an LED light source device having a resin layer covering the LED element. The resin layer is a thermosetting material mixed with a phosphor, and the amount of heat generated when the LED element emits light. The LED element is formed so as to cover the periphery of the LED element with the thickness determined by the above.

  In addition, the LED element in the LED light source device of the present invention is mounted on a heat conductive pattern through which heat generated by the LED element is transmitted, and the resin layer covers the entire region where the heat conductive pattern is formed, It is formed by covering an LED element.

  In the LED light source device of the present invention, the heat conductive pattern is one of a pair of electrodes electrically connected to the LED element.

  Moreover, the heat conductive pattern in the LED light source device of the present invention is characterized in that a heat radiating plate is connected through a through hole formed in the substrate.

  Moreover, the LED light source device of the present invention further includes a transparent sealing member that covers the resin layer.

Moreover, the manufacturing method of the LED light source device according to the present invention is a method of manufacturing an LED light source device having a resin layer that covers the LED element. A step of curing a resin member around the LED element by heat generated when the LED element emits light, and a resin layer covering the LED element by removing an uncured portion of the resin member And a step of forming.

  Moreover, the manufacturing method of the LED light source device of the present invention includes an LED element mounting process for mounting an LED element on the surface of a heat conductive pattern for transmitting heat generated when the LED element emits light, and a resin coating process. The partial curing step is a step in which the resin member around the LED element is partially cured along the shape of the heat conductive pattern.

  Moreover, the phosphor is mixed in the resin layer in the manufacturing method of the LED light source device of this invention, It is characterized by the above-mentioned.

  Moreover, the manufacturing method of the LED light source device of the present invention is characterized in that the resin layer is further sealed with a transparent sealing member.

  In addition, according to the method of manufacturing the LED light source device of the present invention, a plurality of LED light source devices are arranged on a collective substrate, and a plurality of LED light source devices are self-luminous simultaneously, thereby forming a resin layer having a determined film thickness around each LED element. It is characterized by doing.

  According to the LED light source device of the present invention, by using a thermosetting material, it is possible to form a resin layer around the LED elements in all LED elements without being limited to the emission wavelength of the LED elements. In addition, since the resin layer is cured by the amount of heat generated when the LED element emits light, it can be formed with a substantially uniform thickness with respect to the light emitting layer without being affected by the directivity characteristics of the LED element. For this reason, when the phosphor is mixed in the resin layer, the probability that the light beam from the LED element enters the phosphor is the same in any direction, so that the color unevenness can be reduced.

  Further, by making the pattern for mounting the LED element a heat conductive pattern, heat when the LED element is caused to emit light is transferred to the heat conductive pattern, and heat energy is given to the resin also from the heat conductive pattern. Therefore, the resin layer is cured by heat generated from the surface of the LED element and the heat conductive pattern, and is formed in a shape covering the LED element and the heat conductive pattern. For this reason, it becomes possible to form the resin layer of the shape along the pattern shape by changing the pattern shape of a heat conductive pattern.

  Moreover, according to the manufacturing method of the LED light source device of the present invention, the thickness of the resin layer depends on the amount of heat generated when the LED element emits light. The thickness can be easily controlled by changing the total amount of heat energy generated from the element.

  In addition, since the resin is cured by the amount of heat when the LED element is made to emit light by covering the thermosetting resin, the resin layer can be formed without being affected by the wire that electrically connects the LED element and the substrate. This is a manufacturing method suitable for mounting by bonding.

  In addition, by mounting a plurality of LED elements on a collective substrate and simultaneously emitting a plurality of LED elements, a resin layer having a predetermined film thickness can be uniformly formed around each LED element. A small number of LED light source devices with stable characteristics can be manufactured in large quantities.

It is a side view which shows the LED light source device concerning Example 1 of this invention. It is a flowchart which shows the process of the manufacturing method of the LED light source device concerning Example 1 of this invention. It is the top view and sectional drawing explaining the manufacturing process of the aggregate substrate concerning Example 1 of this invention. It is the top view and enlarged side view explaining the mounting process of the LED element concerning Example 1 of this invention. It is a circuit diagram explaining the connection of the LED element formed by the mounting process concerning Example 1 of this invention. It is an enlarged side view explaining the potting process which apply | coats the resin member concerning Example 1 of this invention. It is the top view and enlarged side view explaining the hardening process of the resin member concerning Example 1 of this invention. It is a typical side view explaining the washing | cleaning process of the resin member concerning Example 1 of this invention. It is an enlarged side view explaining the drying process concerning Example 1 of this invention. It is the perspective view and enlarged side view explaining the resin layer formed on the aggregate substrate concerning Example 1 of this invention. It is a perspective view explaining the sealing process which seals the LED element and resin layer on the aggregate substrate concerning Example 1 of this invention. It is a perspective view which shows the cutting process which isolate | separates many LED light source devices completed on the aggregate substrate concerning Example 1 of this invention, and the single LED light source device completed by the cutting process. It is a side view which shows the LED light source device concerning Example 2 of this invention. It is the top view and sectional drawing explaining the manufacturing process of the aggregate substrate concerning Example 2 of this invention. It is the top view and enlarged side view explaining the mounting process of the LED element concerning Example 2 of this invention. It is the perspective view and enlarged side view explaining the resin layer formed on the aggregate substrate concerning Example 2 of this invention. It is a side view which shows the manufacturing method of the LED light source device concerning the modification of Example 2 of this invention. It is a side view which shows the LED light source device concerning Example 3 of this invention. It is a flowchart which shows the process of the manufacturing method of the LED light source device concerning Example 3 of this invention. It is a side view explaining the path | route length of the emitted light of the conventional LED light source device.

  Specific embodiments of the LED light source device and the method for manufacturing the LED light source device of the present invention and modifications thereof will be described in detail below with reference to the drawings.

[Description of LED Light Source Device of Example 1: FIG. 1]
The configuration of the LED light source device according to the first embodiment of the present invention will be described with reference to FIG. In addition, the detail of the manufacturing process which manufactures the LED light source device of a present Example is mentioned later. In FIG. 1, electrodes 2a and 2b are arranged on a substrate 1, and the electrodes 2a and 2b are connected to the front surface side and the back surface side of the substrate 1 through through holes 3a and 3b, respectively. The substrate 1 is formed of an insulating substrate such as epoxy, and the electrodes 2a and 2b are made of conductive copper foil or the like. The LED element 4 is mounted on a substrate and is electrically connected to the electrodes 2a and 2b by wires 5a and 5b. In this embodiment, it is assumed that the LED element 4 is mounted on the electrode 2a. In addition, as a method of electrically connecting the LED element 4 and the electrodes 2a and 2b, flip-chip mounting can be used without using the wires 5a and 5b.

  The LED element 4 is covered with a resin layer 6 including phosphors 7 that are dispersed substantially uniformly. The resin material of the resin layer 6 is a thermosetting resin, and the resin layer 6 is formed to cover the periphery of the LED element 4 with a thickness determined by the amount of heat generated when the LED element 4 emits light. Furthermore, it has the sealing member 8 which covers this resin layer 6, wire 5a, 5b, electrode 2a, 2b. This sealing member 8 is made of a transparent resin material, and is provided to physically and chemically protect the electrodes 2a, 2b and the like, and to prevent deterioration due to aging.

  Here, in this embodiment, the LED element 4 is a blue light emitting LED element, and the phosphor 7 is a phosphor that absorbs blue light such as YAG and emits yellow light. Is incident on the phosphor 7 dispersed in the resin layer 6 and wavelength-converted into yellow light. Therefore, the light emitted from the LED light source device 40 is a mixture of blue light 10B and yellow light 10Y, and the LED light source device 40 emits pseudo white light 10W.

At this time, the thickness of the resin layer 6 is determined by the amount of heat when the LED element 4 emits light, and is formed with a substantially uniform thickness with respect to the light emitting layer of the LED element 4. Therefore, since the blue light emitted from the LED element 4 is converted into yellow light at almost the same rate in any direction, the light emitted from the LED light source device 40 is blue light and yellow light in any direction. The ratio becomes equal, and the color unevenness of the LED light source device 40 becomes very small.

  Next, the outline of the manufacturing process of the LED light source device 40 in the present embodiment will be described with reference to FIG. FIG. 2 is a flowchart showing an overall outline of the manufacturing process according to the first embodiment of the present invention. Details of each manufacturing process will be described later.

  As shown in FIG. 2, first, a collective substrate manufacturing process for manufacturing a collective substrate for mounting a plurality of LED elements is performed (process M1).

  Next, an LED element mounting step is performed in which a plurality of LED elements are fixed on the completed aggregate substrate, and each LED element is electrically connected to the electrode portion of the aggregate substrate by wire bonding (process M2).

  Next, a potting step of covering the plurality of LED elements mounted on the aggregate substrate with the resin member containing the phosphor is performed (step M3). The resin member is a thermosetting resin.

  Next, a resin curing process is performed in which a predetermined current is supplied to each of the mounted LED elements to cause the LED elements to generate heat, and a resin member around the LED elements is partially cured (process M4).

  Next, a cleaning process for removing the uncured resin member by immersing the aggregate substrate covered with the resin member in an organic solvent is performed (process M5).

  Next, a drying process for drying the cleaned aggregate substrate by heating or the like is performed (process M6). Thereby, a resin layer is formed around the plurality of LED elements.

  Next, a sealing step of filling and sealing the transparent sealing member so as to cover the resin layer and the electrode is performed (step M7).

  Next, the collective substrate sealed by the sealing member is cut at a predetermined cutting position to complete a plurality of LED light source devices (step M8).

[Description of Assembly Substrate Manufacturing Process (Process M1) of Example 1: FIG. 3]
Next, details of the manufacturing process of the collective substrate according to the first embodiment of the present invention will be described with reference to FIG. 3 shows a collective substrate of the LED light source device manufactured according to the present invention, FIG. 3 (a) is a plan view of the collective substrate, and FIG. 3 (b) is a section line AA ′ of FIG. 3 (a). It is sectional drawing of the collective substrate cut | disconnected by.

  As shown in FIGS. 3A and 3B, electrodes 2a to 2e are arranged on a substrate 1 made of an insulating material such as an epoxy material, and the electrodes 2a to 2e pass through through holes 3a to 3e, respectively. The front surface side and the back surface side of the substrate 1 are connected. Here, as shown in the figure, the electrodes 2a are vertically formed on the substrate 1 at predetermined intervals on the drawing, and the electrodes 2b are adjacent to the electrodes 2a, and are drawn on the substrate 1 at predetermined intervals like the electrodes 2a. It is formed vertically upward. Similarly, the electrodes 2c to 2e are also vertically formed on the substrate 1 at a predetermined interval on the drawing.

  As a result, the electrodes 2a to 2e are formed in a matrix on the substrate 1. In FIG. 3, a total of 30 electrodes 2a to 2e are formed in 5 rows in the horizontal direction on the drawing and 6 rows in the vertical direction on the drawing. However, the number of the electrodes 2a to 2e is not limited to this number, and may be formed in an arbitrary number depending on the size of the substrate 1, the electrode shape, or the like. Note that the electrodes 2a to 2e are formed on the back surface of the substrate 1 in the same manner as the electrodes 2a to 2e on the front surface.

  Further, 3a to 3e are through holes formed in the regions of the electrodes 2a to 2e on the front surface and the back surface of the substrate 1. Here, the through hole 3a is formed at a position closer to the left side in the drawing within the region of the electrode 2a, and electrically connects the electrode 2a on the front surface of the substrate 1 and the electrode 2a on the back surface. The through hole 3b is formed at a position closer to the left side in the drawing within the region of the electrode 2b, and electrically connects the electrode 2b on the front surface of the substrate 1 and the electrode 2b on the back surface. Similarly, the through holes 3c to 3e are formed at positions on the left side in the drawing within the respective regions of the electrodes 2c to 2e, and the electrodes 2c to 2e on the front surface of the substrate 1 and the electrodes 2c to 2e on the back surface are electrically Connect.

  Reference numerals 11 and 12 denote electrode terminals, which are formed in a line shape in contact with the electrodes 2a and 2e at the left and right ends on the substrate 1 in the drawing. Here, since the electrode terminal 11 is formed in contact with the end of the electrode 2 a, all the electrodes 2 a are electrically connected by the electrode terminal 11. Further, since the electrode terminals 12 are formed in contact with the end portions of the electrodes 2e, all the electrodes 2e are electrically connected by the electrode terminals 12. The electrode terminals 11 and 12 are used as terminals for supplying current to the LED elements mounted on the collective substrate, and details will be described later. The electrode pattern of the collective substrate shown in FIG. 3 is an example, and the configuration of the electrode pattern is not limited.

[Description of LED Element Mounting Step (Step M2) of Example 1: FIGS. 4 and 5]
Next, details of the LED element mounting process according to the first embodiment of the present invention will be described with reference to FIGS. FIG. 4 shows the mounting process of the LED element of Example 1 of the present invention, FIG. 4 (a) is a plan view of the collective substrate on which the LED element is mounted, and FIG. 4 (b) is the LED element mounted. It is an enlarged side view of an aggregate substrate.

  As shown in FIGS. 4 (a) and 4 (b), first, as a mounting process of the LED element, the LED element is placed in a region on the substantially right half of the electrodes 2a to 2d (that is, a region other than the through holes 3a to 3d). 4 is fixed and mounted with an adhesive or the like (not shown). That is, as shown in the figure, six electrodes 2a to 2d are formed vertically, so that a total of 24 LED elements 4 in six rows and four columns are mounted on one collective substrate. It is not mounted on the electrode 2e at the right end in the drawing. Here, in Example 1, the LED element 4 is a blue diode having an emission wavelength of about 450 nm as an example.

  Next, the mounted LED element 4 is wire-bonded by a wire bonder (not shown), and is electrically connected to the electrodes 2a to 2e by wires 5a and 5b made of gold fine wires as connection members. That is, as illustrated, the anode (not shown) of the LED element 4 mounted on the electrode 2a is electrically connected to the electrode 2a by the wire 5a, and the cathode (not shown) of the LED element 4 is connected by the wire 5b. It is electrically connected to the adjacent electrode 2b.

  Similarly, the anode (not shown) of the LED element 4 mounted on the electrode 2b is electrically connected to the electrode 2b by the wire 5a, and the cathode (not shown) of the LED element 4 is adjacent to the side by the wire 5b. It is electrically connected to the electrode 2c. Similarly, the LED element 4 mounted on the electrode 2c and the LED element 4 mounted on the electrode 2d are also electrically connected to the respective electrodes by wires 5a and 5b.

  As a result, the four rows of LED elements 4 in the drawing are connected in series between the electrode terminals 11 and 12 via the electrodes 2a to 2e. Similarly, since the LED elements 4 are mounted in six rows in the vertical direction in the drawing, the LED elements 4 in all six rows are also connected to the electrodes 2a to 2e by wires 5a and 5b. As a result, a circuit composed of a total of 24 LED elements 4 is formed, which is composed of six parallel connection groups in which the four LED elements 4 between the electrode terminals 11 and 12 are connected in series.

  FIG. 5 shows a connection circuit of the LED elements 4 mounted on the collective substrate 1. Here, as described above, the four LED elements 4 are connected in series as one group, and further, since these six groups are connected in parallel, a predetermined positive voltage is applied to the electrode terminal 11, When a zero voltage is applied to the electrode terminal 12, a drive current flows from the anode to the cathode of all the LED elements 4, and all the LED elements 4 can be turned on.

  In addition, the connection of the LED element 4 is not limited to this Example 1, All the LED elements 4 can also be connected in series by devising the connection pattern of the electrode terminals 11 and 12. FIG. Here, if all the LED elements 4 are connected in series, the current value flowing through all the LED elements 4 can be made the same. Therefore, in the resin curing step described later, the resin curing conditions for the individual LED elements 4 are matched. However, even in the case of the series-parallel connection as in the first embodiment, the characteristics of the LED elements 4 are averaged within the group, so that almost the same curing conditions can be achieved.

[Description of Potting Step (Step M3) of Resin Member of Example 1: FIG. 6]
Next, details of the potting process according to the first embodiment of the present invention will be described with reference to FIG. FIG. 6 is an enlarged side view for explaining a potting process according to the first embodiment of the present invention. As shown in FIG. 6, a resin member 20 containing a phosphor 7 is applied by a dispenser 50 as a sealing resin that covers all the LED elements 4 mounted on the surface of the collective substrate.

  Here, the phosphor 7 is a phosphor that converts the wavelength of blue light from the LED element 4 into yellow light, and the resin member 20 is made of a thermosetting silicone resin that is cured by thermal energy. In addition, it is good to discharge resin, moving the dispenser 50 with respect to an aggregate substrate so that the resin member 20 may be apply | coated to the whole surface of an aggregate substrate surface, and all the LED elements 4 may be coat | covered. Thereby, it is possible to cover all the LED elements 4 on the collective substrate.

[Description of Resin Curing Process (Process M4) of Resin Member of Example 1: FIG. 7]
Next, details of the resin curing step of Example 1 of the present invention will be described with reference to FIG. FIG. 7 shows the resin curing process of Example 1 of the present invention, FIG. 7 (a) is a plan view showing that a DC power source is connected to the collective substrate coated with the resin member, and FIG. It is an enlarged side view which shows typically that the LED element 4 on a collective substrate light-emits, and hardens a resin member.

  As shown in FIG. 7A, a DC power source 15 that outputs a predetermined voltage is connected to the electrode terminals 11 and 12 of the collective substrate on which the resin member 20 is applied over the entire surface. That is, the plus line 16a of the DC power source 15 is connected to the electrode terminal 11 connected to the anode of the LED element 4 via the electrode 2a via the switch SW, and the electrode connected to the cathode of the LED element 4 via the electrode 2e. The negative line 16 b of the DC power supply 15 is connected to the terminal 12. The switch SW has a function of turning on / off the current from the DC power supply 15 and controls the LED element 4 so as to supply a drive current for a predetermined time.

  Next, in FIG. 7B, when the above-described switch SW is turned on for a predetermined time, a drive current is supplied to all the LED elements 4 on the collective substrate via the wires 5a and 5b. It emits light and emits thermal energy 17 accordingly. Thereby, since the resin member 20 that covers the LED element 4 is a thermosetting resin as described above, the region of the resin member 20 in the vicinity of the LED element 4 partially begins to cure, and the thermal energy 17 A resin layer 6 having a uniform thickness is formed around the LED element 4 according to the size.

The thickness of the resin layer 6 depends on the amount of heat generated from the LED element 4, and the film thickness of the resin layer 6 can be controlled by the magnitude of the drive current supplied to the LED element 4 and the supply time. That is, in order to increase the thickness of the resin layer 6, it is sufficient to increase the value of the drive current supplied to the LED element 4, increase the supply time of the drive current, or both. On the contrary, in order to reduce the thickness of the resin layer 6, the value of the drive current supplied to the LED element 4 is reduced, the supply time of the drive current is shortened, or both are performed. Just do it.

  Here, as described above, since the resin member 20 contains the phosphor 7 that is a yellow phosphor, in order to increase the amount of yellow light, the thickness of the resin layer 6 is increased to increase the thickness of the phosphor 7. It is sufficient to increase the amount of grains. Conversely, when it is desired to reduce the amount of yellow light, the film thickness of the resin layer 6 can be reduced to reduce the amount of grains of the phosphor 7. Thus, by controlling the value of the drive current for forming the resin layer 6 or the supply time, the amount of yellow light can be arbitrarily adjusted. In FIG. 7, the phosphor 7 contained in the resin layer 6 is not shown for easy viewing of the drawing.

[Description of Resin Member Cleaning Process (Process M5) of Example 1: FIG. 8]
Next, details of the cleaning process of Example 1 of the present invention will be described with reference to FIG. FIG. 8 is a schematic side view showing the cleaning process of the first embodiment of the present invention.

  As shown in FIG. 8, an aggregate substrate (in the drawing, only a part of the aggregate substrate is illustrated) in which the resin layer 6 is formed in the resin member 20 is immersed in an organic solvent 51 or the like, and the uncured resin member 20 is uncured. Remove the part. The uncured portion is a region other than the resin layer 6 in the resin member 20. Moreover, as the organic solvent 51, acetone, toluene, xylene, etc. are preferable, and an uncured part can be reliably removed in a short time by washing by ultrasonic washing or the like. Note that the cleaning process is not limited to this, and it is sufficient that the uncured portion in the resin member 20 can be removed.

[Description of Drying Step of Resin Layer of Example 1 (Step M6): FIG. 9]
Next, the details of the drying process of Example 1 of the present invention will be described with reference to FIG. FIG. 9 is an enlarged side view showing the drying process of Example 1 of the present invention.
As shown in FIG. 9, a collective substrate (only a part of the collective substrate is shown in the drawing) from which an uncured portion in the resin member 20 (see FIG. 8) has been removed by the organic solvent 51 is heated in a heating furnace or the like (FIG. 9). (Not shown) and dried by heat 52 or air as shown.

  As a result, only the resin layer 6 remains around the LED element 4. Here, the resin layer 6 is a region where the resin member 20 is cured as described above, and the resin member 20 contains the phosphor 7 which is a yellow phosphor. Therefore, the resin layer 6 is formed as a phosphor layer containing the phosphor 7.

[Description of Resin Layer of Example 1: FIG. 10]
Next, the resin layer 6 formed by the manufacturing method of the LED light source device of Example 1 of the present invention will be described with reference to FIG. FIG. 10 shows the resin layer 6 of the LED light source device formed according to Example 1 of the present invention, and FIG. 10 (a) is a perspective view showing the resin layer 6 covering the LED elements on the collective substrate. (B) is an enlarged side view of the collective substrate, showing a part of the side surface of the collective substrate, that is, the peripheral portion of the LED element 4.

Here, the resin layer 6 is formed in the immediate vicinity of the LED element 4 and directly covers the LED element 4, and the LED element depends on the intensity distribution of the radiant heat 17 from the LED element 4 (see FIG. 7B). 4 is formed in a substantially semicircular shape so as to cover the periphery of the substrate 4 with a uniform film thickness, so that the wavelength of light emitted from the LED element 4 can be converted almost uniformly by the phosphor 7 dispersed in the resin layer 6. I can do it. Moreover, the manufacturing method of the LED light source device of this invention mounts many LED elements 4 on a collective substrate, and coat | covers many LED elements 4 by uniform film thickness by making these LED elements 4 light-emit simultaneously. Since the resin layers 6 to be formed can be formed all at once, this is a manufacturing method suitable for mass production.

[Description of Sealing Process (Process M7) of Example 1: FIG. 11]
Next, details of the sealing process of the first embodiment of the present invention will be described with reference to FIG. FIG. 11 is a perspective view for explaining a sealing process according to the first embodiment of the present invention.
As shown in FIG. 11, after the resin layer 6 is formed on the collective substrate, a sealing step of filling and curing the transparent sealing member 8 is performed. The sealing member 8 is preferably either a thermosetting resin or a photocurable resin.

  Through this process, the LED element 4, the wires 5a and 5b, the resin layer 6, and the entire surface of the collective substrate are sealed, electrically and mechanically protected, and an LED light source device having excellent environmental resistance is manufactured. I can do it.

[Description of Cutting Process (Process M8) of Example 1: FIG. 12]
Next, the cutting process of Example 1 of this invention is demonstrated with reference to FIG. FIG. 12 shows a cutting process according to the first embodiment of the present invention, and FIG. 12A is a perspective view showing a part of the collective substrate for explaining a cutting process for separating a large number of LED light source devices completed on the collective board. FIG. 12B is a perspective view showing an example of a single LED light source device completed by the cutting process.

  As shown in FIG. 12A, the collective substrate sealed by the sealing member 8 is cut and separated by a dicing device (not shown) or the like along predetermined cutting lines X and Y, and a plurality of LED light sources are obtained. The device is completed. The cutting line X is set between the electrodes 2a to 2e on the substrate 1, and the cutting line Y is set to pass through the centers of the through holes 3a to 3e on the collective substrate.

  As shown in FIG. 12B, in the completed LED light source device 40, electrodes 2a and 2b are formed on the substrate 1 cut and separated from the collective substrate. The electrodes 2a and 2b include through holes 3a and 3b cut at the center, and are electrically connected to the electrodes 2a and 2b (not shown) on the back surface of the substrate 1 through the through holes 3a and 3b. Further, the LED element 4 is mounted on the surface of the electrode 2a, and the LED element 4 is electrically connected to the electrodes 2a and 2b by the two wires 5a and 5b as described above.

  With this connection, when a drive voltage is supplied to the electrodes 2a and 2b from the outside, a drive current flows to the LED element 4 via the wires 5a and 5b, and the LED element 4 emits light. The LED element 4 is covered with the resin layer 6 containing the phosphor 7 as described above, and the resin layer 6 is sealed with a transparent sealing member 8.

  In the completed LED light source device 40, the electrodes 2a and 2b become the electrodes 2b and 2c, the electrodes 2c and 2d, or the electrodes 2d and 2e depending on the position separated from the collective substrate. Similarly, the through holes 3a and 3b become through holes 3b and 3c, through holes 3c and 3d, or through holes 3d and 3e depending on the positions separated from the collective substrate. Of course, the LED light source device 40 is the same. Thus, this invention can manufacture many LED light source devices collectively.

  Moreover, regarding the manufacturing method of the LED light source device of Example 1 of this invention, since the thermosetting resin is used, it is not limited by the light emission wavelength of the LED element 4. In the present embodiment, a blue light emitting element having a wavelength of about 450 nm is used as the LED element 4, but the LED element 4 is not limited to this, and the LED element 4 having any light emission wavelength can be manufactured. Further, since the thickness of the resin layer 6 containing the phosphor 7 can be made uniform, the wavelength conversion is performed by uniformly irradiating the phosphor particles with the emitted light from the LED element 4, and as a result, the color mixing property is good. Thus, an LED light source device that emits white light with little color unevenness can be manufactured.

  Moreover, since the film thickness of the resin layer 6 which coat | covers the LED element 4 is determined according to the calorie | heat amount at the time of making the LED element 4 light-emit, a film thickness can be controlled easily, As a result, the color tone adjustment of light emission Thus, a white LED light source device with an optimal color balance can be manufactured. Further, since the resin layer 6 is formed in a relatively narrow region close to the LED element 4, it is a manufacturing method that can easily realize a reduction in size and thickness of the LED light source device.

  In addition, by applying a thermosetting resin and curing the resin by the self-emission of the LED element 4, without being affected by the wires 5a and 5b that electrically connect the LED element 4 and the electrodes 2a and 2b of the substrate, Since the resin layer 6 having a small film thickness can be formed with high accuracy without causing any distortion in the gaps between the wires 5a and 5b and the substrate 1, it may adversely affect the directivity and color mixing of the emitted white light. There is no. Thereby, this invention is suitable for the LED light source device of wire bonding mounting.

  Further, according to the present invention, a large number of LED elements 4 are mounted on a collective substrate, and a large number of resin layers simultaneously self-emit, thereby forming a resin layer having a predetermined film thickness around each LED element. Therefore, a plurality of LED light source devices with little variation in characteristics such as color unevenness can be manufactured in large quantities at once.

[Description of LED Light Source Device of Example 2: FIG. 13]
The configuration of the LED light source device according to the second embodiment of the present invention will be described with reference to FIG. In addition, the detail of the manufacturing process which manufactures the LED light source device of a present Example is mentioned later. In FIG. 13, electrodes 2a and 2b are arranged on a substrate 1, and the electrodes 2a and 2b are connected to the front surface side and the back surface side of the substrate 1 through through holes 3a and 3b, respectively. The substrate 1 is formed of an insulating substrate such as epoxy, and the electrodes 2a and 2b are made of conductive copper foil or the like. In this embodiment, the heat conductive pattern 30a is disposed on the substrate 1, and the front surface side and the back surface side of the substrate 1 are similarly connected through a flat through hole or the like. The heat conductive pattern 30a is made of, for example, silver as a material having high heat conductivity.

  The LED element 4 is mounted on the thermally conductive pattern 30a and is electrically connected to the electrodes 2a and 2b by wires 5a and 5b. Here, in the present embodiment, the thermal conductive pattern 30a and the electrodes 2a and 2b are different from each other. However, the present invention is not limited to this, and the thermal conductive pattern 30a may be either the electrode 2a or 2b. good.

  The LED element 4 has a phosphor 7 in a substantially uniformly dispersed state and is covered with a resin layer 6 ′ made of a thermosetting resin. The resin layer 6 'is formed to cover the LED element 4 and the heat conductive pattern 30a with a thickness determined by the amount of heat generated when the LED element 4 emits light. Further, the resin layer 6 ′, the wires 5 a and 5 b, and the electrodes 2 a and 2 b are sealed with a sealing member 8. The sealing member 8 is made of a transparent resin material, and is provided to physically and chemically protect the electrodes 2a, 2b and the like, and to prevent deterioration due to aging.

  Here, in this embodiment, the LED element 4 is a blue light emitting LED element, and the phosphor 7 is a phosphor that absorbs blue light such as YAG and emits yellow light. Is incident on the phosphor 7 dispersed in the resin layer 6 ′ and wavelength-converted into yellow light. Therefore, the light emitted from the LED light source device 41 is a mixture of the blue light 10B and the yellow light 10Y, and the LED light source device 41 emits pseudo white light 10W.

At this time, the thickness of the resin layer 6 ′ is determined by the amount of heat when the LED element 4 is caused to emit light, and the shape of the resin layer 6 ′ is the shape of the LED element 4 and the heat conductive pattern 30a. Are formed along. Therefore, by changing the pattern shape of the thermal conductive pattern 30a under the LED element, the resin layer 6 ′ having a shape along the pattern shape can be easily formed.
If the LED element 4 has a square cross section in the horizontal direction, the heat conductive pattern 30a is circular. If the LED element 4 has a rectangular cross section in the horizontal direction, the heat conductive pattern 30a is long with the LED element 4. By forming an ellipse with aligned axes, the thickness of the resin layer 6 ′ is formed with a substantially uniform thickness with respect to the LED element 4. Therefore, since the blue light emitted from the LED element 4 is converted into yellow light at almost the same rate in any direction, the light emitted from the LED light source device 41 is yellow and the blue light 10B in any direction. The ratio of the light 10Y becomes equal, and the color unevenness of the LED light source device 41 becomes very small.

[Description of Assembly Board Manufacturing Process (Process M1) of Example 2: FIG. 14]
Next, details of the manufacturing process of the collective substrate according to the second embodiment of the present invention will be described with reference to FIG. FIG. 14 shows a collective substrate of the LED light source device manufactured according to the present invention, FIG. 14 (a) is a plan view of the collective substrate, and FIG. 14 (b) is a cutting line BB ′ of FIG. 14 (a). It is sectional drawing of the collective substrate cut | disconnected by.

  As shown in FIGS. 14 (a) and 14 (b), electrodes 2a to 2e are arranged on a substrate 1 made of an insulating material such as an epoxy material, and the electrodes 2a to 2e pass through through holes 3a to 3e, respectively. The front surface side and the back surface side of the substrate 1 are connected. In the present embodiment, thermal conductive patterns 30a to 30d are disposed between the electrodes 2a to 2e. In the present embodiment, the heat conductive patterns 30a to 30d are formed by connecting the front surface side and the back surface side of the substrate 1 with flat through holes or the like. Here, the electrodes 2a are vertically formed on the substrate 1 at a predetermined interval as shown in the drawing. Further, the heat conductive pattern 30a is adjacent to the electrodes 2a and 2b, and the heat conductive pattern 30b is adjacent to the electrodes 2b and 2c, and is vertically arranged on the substrate 1 at a predetermined interval like the electrode 2a. It is formed. Similarly, the heat conductive patterns 30c to 30d and the electrodes 2c to 2e are also formed vertically on the substrate 1 at predetermined intervals on the drawing.

  Thus, the electrodes 2a to 2e and the heat conductive patterns 30a to 30d are formed in a matrix on the substrate 1. In FIG. 14, the electrodes 2a to 2e are arranged in five rows in the horizontal direction in the drawing and in the vertical direction in the drawing. A total of 24 heat conductive patterns 30a to 30d in 6 rows and 4 rows in the horizontal direction in the drawing and 6 rows in the vertical direction in the drawing are formed, but the number is not limited to this. It may be formed in an arbitrary number depending on the size of 1 or the electrode shape.

  Further, 3a to 3e are through holes formed in the regions of the electrodes 2a to 2e on the front surface and the back surface of the substrate 1. Here, the through hole 3a is formed in the region of the electrode 2a, and electrically connects the electrode 2a on the front surface of the substrate 1 and the electrode 2a on the back surface. The through hole 3b is formed in the region of the electrode 2b, and electrically connects the electrode 2b on the front surface of the substrate 1 and the electrode 2b on the back surface. Similarly, the through holes 3c to 3e are formed in the respective regions of the electrodes 2c to 2e, and electrically connect the electrodes 2c to 2e on the front surface of the substrate 1 and the electrodes 2c to 2e on the back surface, respectively.

  Reference numerals 11 and 12 denote electrode terminals, which are formed in a line shape in contact with the electrodes 2a and 2e at the left and right ends on the substrate 1 in the drawing. Here, since the electrode terminal 11 is formed in contact with the end of the electrode 2 a, all the electrodes 2 a are electrically connected by the electrode terminal 11. Further, since the electrode terminals 12 are formed in contact with the end portions of the electrodes 2e, all the electrodes 2e are electrically connected by the electrode terminals 12. The electrode terminals 11 and 12 are used as terminals for supplying current to the LED elements mounted on the collective substrate, and details will be described later. The electrode pattern of the collective substrate shown in FIG. 14 is an example, and the configuration of the electrode pattern is not limited.

[Description of LED Element Mounting Process (Process M2) of Example 2: FIG. 15]
Next, the details of the LED element mounting process of Example 2 of the present invention will be described with reference to FIG. FIG. 15 shows the mounting process of the LED element of Example 2 of the present invention, FIG. 15 (a) is a plan view of the collective substrate on which the LED element is mounted, and FIG. 15 (b) is the LED element mounted thereon. It is an enlarged side view of an aggregate substrate.

  As shown in FIGS. 15A and 15B, first, as a mounting process of the LED element, the LED element 4 is fixedly mounted on the heat conductive patterns 30a to 30d with an adhesive or the like (not shown). That is, as shown in the figure, the heat conductive patterns 30a to 30d are each formed in six pieces vertically, so that a total of 24 LED elements 4 in six rows and four columns are mounted on one collective substrate. Is done. Here, in Example 2, the LED element 4 is a blue diode having an emission wavelength of about 450 nm as an example.

  Next, the mounted LED element 4 is wire-bonded by a wire bonder (not shown), and is electrically connected to the electrodes 2a to 2e by wires 5a and 5b made of gold fine wires as connection members. That is, as illustrated, the anode (not shown) of the LED element 4 mounted on the thermal conductive pattern 30a is electrically connected to the electrode 2a by the wire 5a, and the cathode (not shown) of the LED element 4 is The wires 5b are electrically connected to the adjacent electrodes 2b.

  Similarly, the anode (not shown) of the LED element 4 mounted on the heat conductive pattern 30b is electrically connected to the electrode 2b by the wire 5a, and the cathode (not shown) of the LED element 4 is connected by the wire 5b. It is electrically connected to the adjacent electrode 2c. Similarly, the LED element 4 mounted on the heat conductive pattern 30c and the LED element 4 mounted on the heat conductive pattern 30d are also electrically connected to the respective electrodes by wires 5a and 5b.

  As a result, the four rows of LED elements 4 in the drawing are connected in series between the electrode terminals 11 and 12 via the electrodes 2a to 2e. Similarly, since the LED elements 4 are mounted in six rows in the vertical direction in the drawing, the LED elements 4 in all six rows are also connected to the electrodes 2a to 2e by wires 5a and 5b. As a result, a circuit composed of a total of 24 LED elements 4 is formed, which is composed of six parallel connection groups in which the four LED elements 4 between the electrode terminals 11 and 12 are connected in series.

  Next, a potting process (see FIG. 6) and a resin curing process (see FIG. 7) are performed in the same manner as in Example 1. Then, the resin member 20 in the present embodiment is partially cured in a shape along the outer shape of the LED element 4 and the pattern shape of the heat conductive pattern. In Example 1, since heat energy is mainly emitted from the LED element 4 to the resin member 20, the resin member 20 is partially cured in a shape along the outer shape of the LED element 4. This is because the heat generated from the LED element 4 is transferred to the thermal conductive pattern directly below, and the thermal energy of both the LED element 4 and the thermal conductive pattern is mainly radiated to the resin member 20. is there.

  Next, in the same manner as in FIG. 8 shown in Example 1, the above structure is immersed in a solvent to remove unnecessary resin members, and hot air or the like is applied in the same manner as in FIG. Then, a drying process for drying the resin member from which unnecessary portions are removed is performed.

[Description of Resin Layer of Example 2: FIG. 16]
Next, the resin layer 6 ′ of the structure formed through the above steps will be described with reference to FIG. FIG. 16 shows the resin layer 6 ′ of the LED light source device formed according to Example 2 of the present invention, and FIG. 16A is a perspective view showing the resin layer 6 ′ covering the LED elements on the collective substrate. FIG.
) Is an enlarged side view of the aggregate substrate, and shows a part of the side surface of the aggregate substrate, that is, the peripheral portion of the LED element 4.

  In the structure listed in the above process, the resin layer 6 ′ is formed in the immediate vicinity of the LED element 4 to directly cover the LED element 4, and the intensity distribution of the radiant heat from the LED element 4 and the thermal conductive pattern 30 is obtained. Accordingly, it is formed in a substantially semicircular shape so as to cover the LED element 4 and the thermal conductive pattern 30. As a result, the emitted light from the LED element 4 can be wavelength-converted almost uniformly by the phosphor 7 dispersed in the resin layer 6 ′. Further, according to the present embodiment, it is possible to form the resin layer 6 ′ having a shape along the pattern shape by changing the pattern shape of the heat conductive pattern 30.

  If the LED element 4 has a square cross section in the horizontal direction, the heat conductive pattern 30 is circular or square, and if the LED element 4 has a rectangular cross section in the horizontal direction, the heat conductive pattern 30 is changed to the LED element 4. As a result, the resin layer 6 ′ is formed with a substantially uniform thickness with respect to the LED element 4. Therefore, the blue light emitted from the LED element 4 is converted into yellow light at substantially the same rate in any direction. Moreover, the manufacturing method of the LED light source device of this invention mounts many LED elements 4 on a collective substrate, and makes these LED elements 4 self-light-emit at the same time, The resin layer 6 which coat | covers many LED elements 4 'Can be formed in a lump, making it suitable for mass production.

  Next, in the same manner as in FIG. 11 of the first embodiment, a sealing process for sealing the LED elements 4 with the sealing member 8 and, in the same manner as in FIG. The LED light source apparatus 41 shown in FIG. 13 is completed by performing the cutting process which performs.

  As described above, according to the manufacturing method of the LED light source device 41 of the second embodiment of the present invention, as in the first embodiment, a large number of resin layers 6 ′ having a uniform film thickness are simultaneously formed around the LED elements 4. be able to. Further, since a thermosetting resin is used for the resin layer 6 ′, the resin layer 6 ′ is not limited by the emission wavelength of the LED element 4. In this embodiment, the LED element 4 having a blue light emission of around 450 nm is used. However, the present invention is not limited to this, and the LED element 4 having any emission wavelength can be manufactured. Further, since the thickness of the resin layer 6 ′ containing the phosphor 7 can be made uniform, the emitted light from the LED element 4 is uniformly irradiated to the phosphor particles to perform wavelength conversion. As a result, the color mixing property is improved. It is possible to manufacture an LED light source device that emits white light with good color unevenness.

  Further, by changing the pattern shape of the heat conductive pattern 30, the resin layer 6 'having a shape along the pattern shape can be formed. By changing the pattern shape of the thermal conductive pattern 30 in accordance with the shape of the LED element 4, the thickness of the resin layer 6 ′ can be made more uniform, and the color unevenness of the LED light source device can be made extremely small. Is possible.

  In addition, the LED light source device and the manufacturing method of the LED light source device according to the second embodiment have many parts that are the same as the LED light source device and the manufacturing method of the LED light source device according to the first embodiment described above. Similar to 1, it has many excellent effects and features.

[Description of LED Light Source Device of Modification of Example 2: FIG. 17]
Next, the outline of the LED light source device 42 of the modification of Example 2 of this invention is demonstrated using FIG.
The LED light source device 42 of Example 2 shown in FIG. 17 has a configuration in which a heat radiating plate 70 is connected to the heat conductive pattern 30a in addition to the configuration of the LED light source device 41 similar to that shown in FIG. And this heat conductive pattern 30a connects the front side and the back side of the board | substrate 1 by the flat through hole, and the heat_generation | fever from LED element 4 is transmitted to the heat sink 70 via the heat conductive pattern 30a, and heat is radiated outside. It can be done. For example, when a large current is passed through the LED element 4, the light source device becomes very hot. Therefore, by using such a heat dissipation mechanism, it is possible to suppress a rise in heat around the LED element 4. As a result, it is possible to prevent the LED light source device 42 from being hindered from increasing the brightness and extending its life due to heat.

  In addition, this heat sink 70 is connected to the back surface of the substrate 1 after the resin curing step of partially curing the resin member by causing the LED element 4 to emit light by itself as shown in FIG. Is preferred. That is, the resin layer 6 ′ is cured by thermal energy from the LED elements 4 and the heat conductive pattern 30 a. Therefore, if the heat sink 70 is connected during the resin curing process, the heat generated from the LED elements 4 is generated by the heat sink 70. This is because the resin member cannot be efficiently cured.

[Description of LED Light Source Device of Example 3: FIG. 18]
Next, the configuration of the LED light source device of Example 3 of the present invention will be described with reference to FIG. 18, and the manufacturing method will be described with reference to FIG. The feature of the third embodiment is that the LED element is an LED element that emits n-UV light, and an LED light source device that emits white light by three phosphor layers containing the first, second, and third phosphors. Is to manufacture. Further, in the structure of the present embodiment, the same reference numerals are given to the same portions as those in the above-described embodiment, and the detailed description is omitted.

  As shown in FIG. 18, in the LED light source device 43 of the present embodiment, an LED element 81 is mounted on a substrate 1, a phosphor layer composed of three layers is formed by covering the LED element 81, and the phosphor layer. Is sealed with a transparent sealing member 8. Here, the LED element 81 is an LED element that emits n-UV light, and the phosphor layer has a first phosphor layer 85 containing the first phosphor 82 and a second phosphor from the immediate vicinity of the LED element 81. The second phosphor layer 86 containing 83 and the third phosphor layer 87 containing the third phosphor 84 are laminated in this order. In this embodiment, the first phosphor 82 is a red phosphor, the second phosphor 83 is a green phosphor, and the third phosphor 84 is a blue phosphor.

  Here, the resin material of the 1st fluorescent substance layer 85, the 2nd fluorescent substance layer 86, and the 3rd fluorescent substance layer 87 is a thermosetting resin, The 1st fluorescent substance layer 85, the 2nd fluorescent substance Each of the layer 86 and the third phosphor layer 87 is formed to cover the periphery of the LED element 81 with a thickness determined by the amount of heat generated when the LED element 81 emits light.

  Here, when the emitted light from the LED element 81 is incident on the first phosphor 82 which is a red phosphor contained in the first phosphor layer 85, the first phosphor 82 is emitted from the LED element 81. The emitted light is absorbed and excited to emit red light 90R which is wavelength converted light, passes through the second phosphor layer 86, the third phosphor layer 87, and the transparent sealing member 8, and is emitted to the outside. To do.

  In addition, the light emitted from the LED element 81 that has not entered the first phosphor 82 and has passed through the first phosphor layer 85 is the second phosphor that is a green phosphor contained in the second phosphor layer 86. When entering the phosphor 83, the second phosphor 83 absorbs and excites light emitted from the LED element 81, emits green light 90G, which is wavelength-converted light, and emits the third phosphor layer 87 and transparent. It passes through the sealing member 8 and exits to the outside.

In addition, the emitted light from the LED element 81 that has not entered the second phosphor 83 and passed through the second phosphor layer 86 is a third phosphor that is a blue phosphor contained in the third phosphor layer 87. When entering the phosphor 84, the third phosphor 84 absorbs and excites the light emitted from the LED element 81, emits blue light 90 </ b> B that is wavelength-converted light, passes through the transparent sealing member 8, and is externally transmitted. To exit. This
The LED light source device 43 emits blue light 90B, green light 90G, and red light 90R, and the respective lights are mixed and emitted as white light 90W.

  At this time, the thicknesses of the first phosphor layer 85, the second phosphor layer 86, and the third phosphor layer 87 are determined by the amount of heat when the LED element 81 emits light. Each of the light emitting layers is formed with a substantially uniform thickness. Therefore, since the n-UV light emitted from the LED element 81 is wavelength-converted in each phosphor layer at almost the same rate in any direction, the light emitted from the LED light source device 43 is emitted in any direction. The ratios of red light, green light, and blue light are equal, and the color unevenness of the LED light source device 43 is very small.

  In addition, in this way, the first phosphor layer 85 closest to the LED element 81 contains a red phosphor that emits a long wavelength, and the second phosphor layer 86 outside the green phosphor emits an intermediate wavelength. And the third phosphor layer 87 on the outermost surface contains a blue phosphor that emits a short wavelength, so that the influence of the interaction of wavelength-converted light by each phosphor can be suppressed. Secondary excitation can be suppressed and the luminous efficiency of the LED can be improved. Thereby, it is possible to realize a high-brightness and high-output LED light source device with little luminance variation.

  In addition, since the phosphors that emit RGB light are contained separately for each phosphor layer, the same phosphor particles contained in each phosphor layer are uniformly dispersed in each layer. That is, since each phosphor layer contains the same phosphor particles having the same specific gravity and particle size, the phosphor particles are uniformly dispersed in the layer without being biased. As a result, the phosphor layers in which the phosphor particles are uniformly dispersed are laminated, so that the wavelength conversion is performed by uniformly irradiating the phosphor particles of each layer with the emitted light from the LED element 81. As a result, the color mixing property is obtained. Therefore, it is possible to realize an LED light source device that emits white light with good color unevenness.

  Next, the outline of the manufacturing process of the LED light source device in the present embodiment will be described with reference to FIG. FIG. 19 is a flowchart showing an overall outline of the manufacturing process according to the third embodiment of the present invention. Since the manufacturing method of the third embodiment is basically the same as that of the first embodiment, only the manufacturing steps different from the first embodiment will be described in comparison with FIG. .

  First, a collective substrate manufacturing process (process M1) and an LED element mounting process (process M2) are performed. Since these steps are the same as those in the first embodiment, description thereof is omitted here. The next potting step (step M3) to be performed is the same as in Example 1, but in this example, a thermosetting resin containing the first phosphor 82 that is a red phosphor is potted. Next, in the same manner as in Example 1, the resin curing process (process M4), the cleaning process (process M5), and the drying process (process M6) are performed, as shown in the first example (FIG. 10). Similarly, a first phosphor layer is formed.

  Next, the loop L1 in FIG. 19 returns from the drying step (step M6) to the potting step (step M3) to form the second phosphor layer. That is, by potting a thermosetting resin containing the second phosphor 83, which is a green phosphor, by performing a resin curing step (step M4), a cleaning step (step M5), and a drying step (step M6), A second phosphor layer is formed. Similarly, the loop L1 returns from the drying process (process M6) to the potting process (process M3) to form a third phosphor layer. Through the steps so far, a phosphor layer having a three-layer structure is formed.

  Next, the sealing process (process M7) and the cutting process (process M8) are performed. Through the above steps, the LED light source device of this embodiment is manufactured.

  As described above, the first phosphor layer 85 closest to the LED element 81 contains the red phosphor that emits a long wavelength, and the second phosphor layer 86 outside the green phosphor that emits the intermediate wavelength. Including the blue phosphor that emits a short wavelength in the third phosphor layer 87 on the outermost surface can suppress the influence of the interaction of wavelength-converted light by each phosphor. Excitation can be suppressed and the luminous efficiency of the LED can be improved. Thereby, it is possible to manufacture an LED light source device with high luminance and high output with little luminance variation.

  In addition, since the phosphors that emit RGB light are contained separately for each phosphor layer, the same phosphor particles contained in each phosphor layer are uniformly dispersed in each layer. That is, since each phosphor layer contains the same phosphor particles having the same specific gravity and particle size, the phosphor particles are uniformly dispersed in the layer without being biased. As a result, the phosphor layers in which the phosphor particles are uniformly dispersed are laminated, so that the wavelength conversion is performed by uniformly irradiating the phosphor particles of each layer with the emitted light from the LED element 81. As a result, the color mixing property is obtained. LED light source device that emits white light with good color uniformity and little color unevenness can be manufactured.

  Further, since the film thicknesses of the first, second, and third phosphor layers 85, 86, and 87 covering the LED element 81 are determined according to the amount of heat generated by the LED element 81, each phosphor layer As a result, it is possible to manufacture a white LED light source device in which light emission color adjustment is simple and color balance is optimal. Further, since the phosphor layer is formed in a relatively narrow region close to the LED element 81, it is a manufacturing method that can easily realize a reduction in size and thickness of the LED light source device.

  In addition, the LED light source device and the manufacturing method of the LED light source device according to the third embodiment have many parts similar to the LED light source device and the manufacturing method of the LED light source device according to the above-described first embodiment. Similar to 1, it has many excellent effects and features.

  In the manufacturing method of the present embodiment, the first phosphor layer including the first phosphor that is the red phosphor, the second phosphor layer including the second phosphor that is the green phosphor, and the blue phosphor. Although an example in which a third phosphor layer including a certain third phosphor is sequentially laminated is shown, the lamination order of the first to third phosphor layers may be changed. In that case, it should be noted that the problem due to the interaction of wavelength-converted light is exacerbated.

  Moreover, although the LED light source device manufactured by the present invention has been described on the assumption that white light is emitted in the embodiments, the emitted light of the LED light source device by the manufacturing method of the present invention is not limited to white light. Alternatively, an LED light source device that emits light of other colors may be used. Moreover, the LED light source device manufactured by this invention is not limited to the mounting by wire bonding, For example, it is applied also to the LED light source device by flip-chip mounting etc. The flowcharts, front views, side views, and the like shown in the embodiments of the present invention are not limited to these, and may be arbitrarily changed as long as they satisfy the gist of the present invention.

  The manufacturing method of the LED light source device of the present invention can provide a white LED light source device with good color mixing and little color unevenness. Therefore, a white light source device for backlights such as liquid crystal color televisions and portable electronic devices, It is suitable as a method for manufacturing a white light source device.

DESCRIPTION OF SYMBOLS 1 Board | substrate 2a-2e Electrode 3a-3e Through hole 4 LED element 5a, 5b Wire 6, 6 'Resin layer 7 Phosphor 8 Sealing member 10B Blue light 10Y Yellow light 10W White light 11, 12 Electrode terminal 20 Resin member 30, 30a to 30d Thermal conductive patterns 40, 41, 42, 43 LED light source device 50 Dispenser 51 Organic solvent 52 Heat 70 Heat sink 81 n-UVLED element 82 First phosphor 83 Second phosphor 84 Third phosphor 85 First phosphor layer 86 Second phosphor layer 87 Third phosphor layer 90R Red light 90G Green light 90B Blue light 90W White light

Claims (5)

In the manufacturing method of the LED light source device having a resin layer covering the LED element,
A resin coating step of coating the LED element with a resin member made of a thermosetting resin; and
Wherein the thickness of the resin member around LED element, wherein the drive current supplied to the LED element size and supply controlled by time partially so that the thickness determined by the heat amount generated when light is emitted A partial curing step for curing;
Removing the uncured portion of the resin member to form a resin layer covering the LED element. A method for manufacturing an LED light source device, comprising: An LED element mounting step for mounting the LED element on the surface of a thermally conductive pattern for transmitting heat generated when the LED element is caused to emit light has, before the resin coating step,
2. The LED light source device according to claim 1 , wherein the partial curing step is a step of partially curing the resin member around the LED element along the shape of the thermal conductive pattern. Production method. The resin layer, the manufacturing method of the LED light source device according to claim 1 or 2, characterized in that the phosphor is mixed. The method for manufacturing an LED light source device according to claim 3 , wherein the resin layer is further sealed with a transparent sealing member. Arranging a plurality of the LED light source device to a set substrate, by a large number at the same time self-luminous, claim 1, characterized in that around the individual LED element, to form the resin layer having a thickness that the determined The manufacturing method of the LED light source device as described in any one of 4 .

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