JP2990920B2 - Semiconductor device sealing device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates are used in the resin encapsulation of a semiconductor element such as a bare chip, to seal TomeSo location of the semiconductor device.

Conventionally, in a hybrid integrated circuit device, a method has been adopted in which a bare chip is installed on a substrate, and a sealing resin is installed on the substrate from above, and the resin is sealed. In such resin sealing, the fluidity of the sealing resin greatly affects the reliability of the sealing. When the sealing resin is heated to an extremely liquefied state, the fluidity is improved, but when the resin is supplied onto the substrate, it flows and an appropriate lump state cannot be obtained, thereby realizing a necessary sealing state. Can not do. That is, appropriate thixotropy is required.

However, if the fluidity is reduced in order to increase the lump state, the flow on the substrate is correspondingly poor, which also causes the sealing state to deteriorate. For this reason, there is a method of heating the entire substrate and supplying a sealing resin onto the substrate maintained at an appropriate heating temperature.
That is, it is very difficult to set the temperature at which the characteristics of the various mounted components are not degraded so as to give the sealing resin an appropriate fluidity. The allowable temperature differs for each part, and the temperature range that satisfies all conditions is extremely narrow, and it is difficult to control the temperature by examining the temperature conditions therefor.

Conventionally, when a sealing resin having a high fluidity is used or when there is an excessive fluidity, a method of installing a guard ring as a flow stopper around an element to be sealed has been adopted. However, such a method requires a step of installing a guard ring and a step of curing a guard ring,
There is a disadvantage that an increase in the number of manufacturing steps causes an increase in the manufacturing cost.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a semiconductor device sealing device in which a substrate is selectively heated to enable resin sealing.

[0006]

[0007]

According to the present invention, there is provided an apparatus for sealing a semiconductor device having a high thermal conductivity on a mounting table (18) of a substrate (2) on which a semiconductor device (bare chip 4) to be sealed is mounted. A heating unit (20) formed of a material; a low heating unit (22) formed of a material having a low thermal conductivity by providing a gap around the heating unit; and a heater (20) installed on the lower surface of the heating unit. 2
And 4) heating the heating unit by the heater (24) to select a sealing area (28) of the semiconductor element on the substrate and locally heat and seal the semiconductor element. And

[0008]

The substrate is selected in the sealing range of the semiconductor element ,
Since the heating is performed locally, the portion to which the sealing resin is supplied is kept at an appropriate temperature, and the fluidity of the sealing resin can be promoted. That is, as compared with the case where the entire substrate is heated, the heating temperature condition becomes gentler, heating is facilitated, and deterioration of characteristics of other components can be prevented. In addition, even if a sealing resin having a high thixotropy is used, appropriate fluidity is obtained by heating the substrate side, and the sealing resin spreads to a predetermined range near the heated portion, but the heated portion is set locally. Therefore, it is possible to prevent the sealing resin from spreading at the non-heated portion around it, and it is possible to control the installation range of the sealing resin to an appropriate range without taking measures such as guard rings.

A heating section is selectively provided on a mounting table on which a substrate to be sealed is mounted, that is, in accordance with a portion requiring heating, and a material having high thermal conductivity is provided in the heating section. By using and heating , the area that needs heating can be localized
Can be heated . Unnecessary heating and unnecessary spreading of the sealing resin can be prevented, and a decrease in the reliability of the circuit device can be prevented. In particular, since the heating portion is selectively formed and there is a non-heating portion around the heating portion, that is, a low-temperature portion, the expansion of the sealing resin is suppressed at the low-temperature portion. The need for a ring can be eliminated.

[0010]

EXAMPLES Hereinafter, the sealing TomeSo location of the semiconductor device of the present invention with reference to embodiments shown in the drawings will be described in detail.

[0011] Figures 1-5 illustrate an embodiment of a sealing TomeSo location of the semiconductor device of the present invention. As shown in FIG. 2, on a surface of a substrate 2 formed of an insulating material such as glass epoxy resin (or alumina), a bare chip 4 is provided as a semiconductor element to be sealed at a predetermined position. It is fixed on the semiconductor substrate 2 with an insulating or conductive adhesive 6. A conductor pattern 8 is formed on the surface of the substrate 2 around the bare chip 4, and each conductor pattern 8 is formed of, for example, a Cu conductor. The surface of the conductor pattern 8 is covered with a solder resist 10 as an insulating layer with a part thereof exposed. In addition, a conductor wire 16 is connected between the electrode 14 of the bare chip 4 and a predetermined conductor pattern 8, and a predetermined electrical connection is made. For example, a gold wire is used as the conductor wire 16. In order to connect the conductor wire 16 to the conductor pattern 6, a connection pad made of, for example, nickel and gold is laminated at a connection portion of the conductor pattern 6. 17 are formed.

A mounting table 18 is used as a sealing device for performing a sealing operation on the substrate 2. The mounting table 18 also serves as a heating table, and as shown in FIG.
It has. The mounting table 18 of this embodiment includes a low heating section 22 having a low thermal conductivity and a heating section 20 having a high thermal conductivity. The low heating section 22 is made of a heat-resistant organic material such as a phenol resin, an epoxy resin, or PTFE. The material and other insulating materials and the heating unit 20 are formed of a material having high thermal conductivity such as copper. That is, through holes 23 are formed in the mounting table 18 corresponding to the range and position of the heated portion of the substrate 2.
A heating unit 20 is provided with a gap 25 provided in the space. In this embodiment, the through hole 23 forms a circular hole surrounding the heating portion. A heater 24 is provided as a heating means on the lower surface of the mounting table 18, that is, on the lower surface of the heating unit 20. The heater 24 is connected to a power supply 26 having appropriate temperature control means and is supplied with power. .

Therefore, the unsealed substrate 2 after the completion of the wire bonding is mounted on the mounting table 18 maintained at a predetermined temperature by applying a current to the heater 24 for a predetermined time. as a result,
Only the sealing area 28 of the substrate 2 is selected by the heating unit 20.
And is locally heated.

Next, as shown in FIG. 4, a sealing resin 30 which is softened and in a fluidized state is sealed by a dispenser 32 which is a supply means for a sealing area 28 of the substrate 2 which is maintained in a heated state. Supply only the appropriate amount. Sealing area 2 of substrate 2
8 is heated to an appropriate temperature, the supplied sealing resin 30 is heated to maintain and promote fluidity and flow appropriately to the sealing area 28, and as shown in FIG. Is performed.

Thus, only the sealing area 28 of the substrate 2 is selected.
Alternatively, by locally heating, the fluidity of the sealing resin 30 can be maintained and promoted, and efficient resin sealing can be performed. In particular, in view of the fact that the sealing area 20 is heated to an appropriate temperature, the sealing resin 30 can be made of a resin having a low fluidity, that is, a resin having a high thixotropy. There is no.

Further, only the sealing area 28 of the substrate 2 is selected.
By heating locally , unnecessary heating can be prevented,
The other elements can be protected from overheating, and a decrease in the reliability of the circuit device due to overheating can be prevented.

The mounting table 18 as a sealing device has a very simple configuration including a heating section 20 and a low heating section 22, and only a predetermined range is selected using the heating section 20 formed selectively. Since the heating range is set locally, the area of the substrate 2 to be heated, that is, the sealing area 28 can be effectively heated.

In the embodiment, the low heating section 22 is set to set the temperature difference with respect to the heating section 20. However, the low heating section 22 is set as a non-heating section, and the low heating section 22 is set.
The cooling may be performed by circulating the cooling water to suppress the temperature rise of the non-heated portion of the substrate 2 with respect to the heated portion.

[0019]

As described above, according to the present invention,
The following effects are obtained. a. The fluidity of the sealing resin on the substrate can be increased, overheating outside the sealing range can be prevented, and the reliability of the circuit device can be increased. Moreover, since the fluidity of the sealing resin can be controlled by appropriately setting the heating conditions, conventional measures such as guard rings are not required, and the manufacturing cost can be reduced. b. The sealing area of the substrate can be selectively and efficiently heated, unnecessary portions of the substrate can be prevented from being overheated, and a decrease in the reliability of the circuit device due to overheating can be prevented.

[Brief description of the drawings]

1 is a longitudinal sectional view showing an embodiment of a sealing TomeSo location of the semiconductor device of the present invention.

FIG. 2 is a longitudinal sectional view showing a substrate on which a semiconductor element to be sealed is mounted.

3 is a plan view illustrating a pressurized heat portion of the mounting table.

FIG. 4 is a longitudinal sectional view showing resin sealing for a semiconductor element on a substrate.

FIG. 5 is a longitudinal sectional view of a hybrid integrated circuit device showing a substrate sealed with a resin.

Claims (1)

(57) [Claims] 1. A heating section formed of a material having a high thermal conductivity on a mounting table of a substrate on which a semiconductor element to be sealed is mounted, and a material having a low thermal conductivity formed by providing a gap around the heating section. And a heater installed on the lower surface of the heating unit, and heating of the heating unit by the heater,
Select a sealing range of the semiconductor element of the substrate and locally
A sealing device for a semiconductor element, wherein the device is heated and sealed.