JP2017050356A - Manufacturing method for light-emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance the emission efficiency of a plurality of light emitting portions through multiple lenses, when a common substrate or lens is thermally expanded by driving a light-emitting device.SOLUTION: A manufacturing method for a light-emitting device (2) has a step of forming a plurality of light emitting portions (20) by mounting a plurality of sets of light-emitting elements (30) on a substrate (10), a step of placing a lens array (40) including a plurality of lenses (41) arranged according to the arrangement position of a plurality of light emitting portions on the plurality of light emitting portions, and a step of positioning the substrate and lens array, while deviating the plurality of light emitting portions and plurality of lenses from each other by a distance (Δd) corresponding to the thermal expansion coefficients of the substrate and lens array, so that the relative positions of the plurality of light emitting portions and plurality of lenses match when the plurality of light emitting portions are lighted and the substrate and lens array are expanded thermally.SELECTED DRAWING: Figure 10

Description

  The present invention relates to a method for manufacturing a light emitting device.

  A COB (Chip On Board) light emitting device in which a light emitting element such as an LED (light emitting diode) element is mounted on a general-purpose substrate such as a ceramic substrate or a metal substrate is known. In such a light-emitting device, for example, an LED element that emits blue light is sealed with a resin containing a phosphor, and light obtained by exciting the phosphor with light from the LED element is mixed, depending on the application. White light is obtained.

  For example, Patent Document 1 discloses a highly heat-conductive heat radiation base having a mounting surface for die bonding, a hole that is placed on the heat radiation base and exposes a part of the mounting surface, and an outside of the heat radiation base. A circuit board having a projecting portion projecting outward from the periphery, a light emitting element mounted on the mounting surface through the hole, and a translucent resin body that seals the upper side of the light emitting element; There is described a light emitting diode in which a through hole that is electrically connected to a light emitting element is formed on the outer peripheral edge of the protruding portion, and an external connection electrode is provided on the upper and lower surfaces of the through hole.

  Patent Document 2 discloses a cavity in which a recess is formed, a convex heat slug (pedestal) attached to the cavity so as to penetrate the bottom of the recess, and a submount substrate mounted on the heat slug. And a plurality of LED chips arranged on the submount substrate, a lead frame electrically connected to each LED chip, a phosphor layer enclosing each LED chip, and a silicone resin sealed in the recess. An LED package having a lens is described.

  There is also known an illumination device that increases the amount of light by arranging and arranging a plurality of LEDs. For example, Patent Document 3 discloses a lens array in which a plurality of LEDs 3, a substrate 4 on which these LEDs 3 are mounted, and a plurality of lens elements for condensing or diverging irradiation light emitted from the LEDs are integrally formed. 2 is described.

JP 2006-005290 A JP 2010-170945 A JP 2012-042670 A

  Produces a light-emitting device in which multiple light-emitting parts are formed on one common substrate to collect a high amount of parallel light, and the light emitted from each light-emitting part is condensed and emitted by a lens corresponding to the light-emitting part. Think about what to do. In particular, when a plurality of light emitting elements are mounted on each light emitting unit, the number of elements included in the entire light emitting device increases, and the amount of heat generated during driving increases, so the expansion of the common substrate and lens due to the heat cannot be ignored. .

  Accordingly, an object of the present invention is to improve the emission efficiency from a plurality of light emitting units through a plurality of lenses when the light emitting device is driven and thermal expansion occurs in the common substrate or the lens.

  A step of mounting a plurality of sets of light emitting elements on a substrate to form a plurality of light emitting sections, and a lens array including a plurality of lenses arranged in accordance with the arrangement positions of the plurality of light emitting sections on the plurality of light emitting sections. According to the thermal expansion coefficient of the substrate and the lens array so that the relative positions of the plurality of light emitting units and the plurality of lenses are matched when the plurality of light emitting units are turned on and the substrate and the lens array are thermally expanded. And a step of positioning the substrate and the lens array by shifting the plurality of light emitting units and the plurality of lenses from each other by a predetermined distance.

In the above manufacturing method, the substrate is rectangular, and in the step of arranging, the relative positions of the plurality of light emitting units and the plurality of lenses can be changed according to thermal expansion and contraction, so that the substrate and the lens array can be changed. In the step of fixing and positioning the end portion in the same housing, the substrate and the lens array are brought into contact with the housing by bringing two adjacent sides of the substrate and the end portions of the lens array corresponding to the two sides into contact with the housing. It is preferable to position.
In the above-described forming step, for each of the plurality of light emitting portions, a plurality of LED elements are mounted on a substrate as light emitting elements, the plurality of LED elements are electrically connected to each other with wires, and a sealing material containing a phosphor It is preferable to seal a plurality of LED elements by filling a resin on the substrate.
In the forming step, a plurality of LED packages configured by covering the upper surface and the side surface of the LED element with a resin layer containing a phosphor for each of the plurality of light emitting portions are flip-chipd on the substrate as light emitting elements. It is preferable to implement.

  According to the present invention, it is possible to improve the emission efficiency from a plurality of light emitting units through a plurality of lenses when the light emitting device is driven and thermal expansion occurs in the common substrate or the lens.

It is the front view and back view of the illuminating device 1. FIG. It is the upper side figure and side view of the light-emitting device 2. 3 is a top view of the lens array 40. FIG. 2 is a top view and a longitudinal sectional view of the light emitting unit 20. FIG. 1 is an overall circuit diagram of a light emitting device 2. FIG. _{3 is} a top view of the light emitting unit 203. FIG. 3 is a diagram schematically showing the arrangement of LED elements 30 in the light emitting device 2. FIG. 3 is a flowchart illustrating an example of a manufacturing process of the light emitting device 2. 4 is a diagram illustrating an example of a method for fixing the lens array 40 to the substrate 10. FIG. It is a figure which shows the example of the positioning method of the board | substrate 10 and the lens array 40. FIG. It is the top view and side view of 2 A of light-emitting devices. It is a top view of 20 A of light emission parts. It is a figure which shows typically arrangement | positioning of the LED element 30 in the light-emitting device 2B. It is a top view of the light-emitting device 20C in the light-emitting device 2C and the light-emitting device 2C. It is a figure which shows typically arrangement | positioning of the LED element 30 in light-emitting device 2D. It is a figure which shows typically arrangement | positioning of the LED element 30 in the light-emitting device 2E. It is the upper side figure and side view of the light-emitting device 2F. It is the upper side figure and longitudinal cross-sectional view of the light emission part 20G.

  Hereinafter, a light emitting device and a manufacturing method thereof will be described with reference to the drawings. However, it should be understood that the present invention is not limited to the drawings or the embodiments described below.

  FIG. 1A and FIG. 1B are a front view and a rear view of the lighting device 1. The illuminating device 1 is a device that can be used as, for example, a lighting projector. As an example, the illuminating device 1 includes a total of six light emitting devices 2 arranged in two rows and three columns as shown in FIG. The lighting device 1 is configured as one device by arranging the cases (housings) 3 of the respective light emitting devices 2 close to each other. There are various examples of the number of light emitting devices 2 included in one lighting device, for example, two, four, eight or more, in addition to those illustrated. As shown in FIG. 1B, the lighting device 1 has heat radiation fins (heat sinks) 4 for promoting the release of heat generated in the light emitting device 2 on the back surface of the case 3 of each light emitting device 2.

  2A and 2B are a top view and a side view of the light emitting device 2, respectively. As shown in FIGS. 2A and 2B, the light emitting device 2 is disposed on the substrate 10, the plurality of light emitting units 20 formed on the substrate 10, and the plurality of light emitting units 20. And a lens array 40. Further, as shown in FIGS. 1B and 2B, each light emitting device 2 has heat radiating fins 4 on the back surface of the substrate 10 for radiating heat generated by the plurality of light emitting units 20.

  The substrate 10 is a substantially rectangular substrate having a circular opening 13 at the center thereof. For example, the vertical and horizontal lengths of the substrate 10 are each about 10 cm, and the thickness of the substrate 10 is about 1 to 2 mm. The substrate 10 is configured, for example, by bonding the circuit substrate 12 on the metal substrate 11 with an adhesive sheet. The edge part of the board | substrate 10 is fixed to case 3 of the light-emitting device 2 shown to FIG. 1 (A).

  Since the metal substrate 11 functions as a mounting substrate for mounting the light emitting unit 20 and a heat radiating substrate that dissipates heat generated in the light emitting unit 20, the metal substrate 11 is made of, for example, aluminum having excellent heat resistance and heat dissipation. However, as long as the material of the metal substrate 11 is excellent in heat resistance and heat dissipation, another metal such as copper may be used.

  The circuit board 12 is an insulating substrate such as a glass epoxy substrate, a BT resin substrate, a ceramic substrate, or a metal core substrate. On the upper surface of the circuit board 12, a wiring pattern 14 for electrically connecting the light emitting units 20 to each other is formed. Two connection electrodes 15 for connecting the light emitting device 2 to an external power source are formed on the right end of the circuit board 12 shown in FIG. One of the connection electrodes 15 is a positive electrode and the other is a negative electrode. When the connection electrode 15 is connected to an external power source and a voltage is applied, the light emitting units 20 of the light emitting device 2 emit light.

  The light emitting units 20 are a plurality of independent light emitting units formed on the substrate 10 which is one common substrate, and are equally arranged on the substrate 10 so as to surround the opening 13. In the illustrated example, the light emitting device 2 includes 22 light emitting units 20. As will be described later, each light emitting unit 20 includes a plurality of LED elements (an example of a light emitting element). In order to make the emitted light from the light emitting device 2 uniform, the interval (pitch) between the light emitting units 20 is preferably a constant size. However, the pitch of the light emitting units 20 may be different between the vertical direction and the horizontal direction of the substrate 10.

  FIG. 3 is a top view of the lens array 40. The lens array 40 is a lens assembly in which a plurality of lenses 41 are integrally formed. In the illustrated example, the lens array 40 has 22 lenses 41 arranged close to each other except the center thereof. The central portion 42 of the lens array 40 is preferably an opening. As shown in FIG. 2B, the optical axis X of each lens 41 coincides with the normal direction of the substrate 10. Each lens 41 is provided in the same arrangement as the light emitting unit 20 on the substrate 10 corresponding to each light emitting unit 20, and condenses the emitted light from the corresponding light emitting unit 20, respectively. Each lens 41 has, for example, the same shape and size. The end of the lens array 40 is fixed to the case 3 of the light emitting device 2 shown in FIG. In particular, in the use of a projector, it is required to make the light emitting device 2 as small as possible so that the resistance received by wind during use becomes small. For this reason, it is preferable to make the density of the lens 41 part with respect to the whole lens array 40 contact the mutually adjacent lenses 41, without spacing. Since the light emitting unit 20 and the lens 41 correspond one-to-one, the pitch of the light emitting unit 20 is determined by the diameter of the lens 41.

  As described above, the substrate 10 has the opening 13 in the center. The opening 13 is formed at the same position on the metal substrate 11 and the circuit board 12. Further, it is preferable that the lens 41 is not disposed above the opening 13 and the lens array 40 is opened above the opening 13. The shape of the opening 13 is not limited to a circle but may be other shapes such as a rectangle, and the position of the opening 13 may not be strictly at the center of the substrate 10. In the light emitting device 2, the opening 13 in the substrate 10 is advantageous in terms of heat dissipation, as will be described below.

  First, in the light emitting device 2, since the metal substrate 11 is exposed at the edge of the opening 13, an area where the metal substrate 11 is in contact with the outside air is widened. As a result, part of the heat transferred from the light emitting unit 20 (light emitting element) to the metal substrate 11 is also released from the edge of the opening 13 to the outside of the apparatus. Further, in the light emitting device 2, the radiation fins 4 on the back side of the substrate 10 come into contact with the outside air on the front side of the substrate 10 through the openings 13, so that the area where the radiation fins 4 come into contact with the outside air is widened. As a result, part of the heat transferred from the metal substrate 11 to the heat radiation fin 4 is also released to the front side of the substrate 10 through the opening 13. Therefore, in the light emitting device 2, the opening 13 can promote the release of heat generated in each light emitting unit 20 (light emitting element) to the outside of the device.

  From the viewpoint of heat dissipation, the diameter of the opening 13 needs to have a certain size. For example, the diameter d1 of the opening 13 is preferably at least larger than the diameter d2 of each light emitting unit 20, and more preferably larger than the arrangement interval (pitch) d3 of the plurality of light emitting units 20. In the illustrated example, the pitch d3 of the light emitting units 20 is larger than the diameter d2 of the light emitting units 20.

  Further, as shown in FIG. 2A, on the upper surface of the circuit board 12, an inspection terminal 16 for confirming the operation (lighting) of the light emitting unit 20 is provided for each light emitting unit 20. Each of the inspection terminals 16 is arranged so as to sandwich the corresponding light emitting unit 20 with two terminals as one set. The inspection terminal 16 is arranged outside the light emitting unit 20, but there is also a wiring pattern 14 on the circuit board 12 for lighting the plurality of light emitting units 20 at the same time. If it is too far away from the part 20, it is difficult to route the wiring. Therefore, as shown in FIG. 2A, each set of inspection terminals 16 is formed on the circuit board 12 at a position that is within the diameter of the main surface of the lens 41 corresponding to the target light emitting unit 20. .

  Further, in order to prevent erroneous measurement, the two terminals constituting each set of inspection terminals 16 are evenly arranged with a common interval d between the plurality of light emitting units 20. Further, if possible in relation to the wiring pattern 14, it is preferable that the two terminals constituting each set of the inspection terminals 16 are arranged so as to be aligned at a common angle with respect to the side of the substrate 10. As described above, when the plurality of sets of inspection terminals 16 are arranged, it is easy to check the operation of each light emitting unit 20 when the operations of the light emitting units 20 are sequentially confirmed, and the frequency of occurrence of erroneous measurement can be reduced. It becomes possible to lower.

  4A to 4C are a top view and a longitudinal sectional view of the light emitting unit 20. More specifically, FIG. 4A is a top view of the light-emitting portion 20, FIG. 4B is a cross-sectional view taken along line IVB-IVB in FIG. 4A, and FIG. 4C is FIG. 4 is a cross-sectional view taken along line IVC-IVC. The light emitting unit 20 includes a plurality of LED elements 30, a sealing frame 23, and a sealing resin 24 as main components.

  The LED element 30 is an example of a light emitting element, and is, for example, a blue LED that emits blue light having an emission wavelength band of about 450 to 460 nm. In each light emitting unit 20, the circuit board 12 has an opening 21, and the metal substrate 11 is exposed through the opening 21. The LED element 30 is mounted on the metal substrate 11 exposed through the opening 21. As described above, the LED element 30 is directly mounted on the metal substrate 11, thereby radiating heat generated by the LED element 30 and phosphor particles described later.

  Further, the LED elements 30 are mounted in a grid pattern in, for example, a rectangular mounting region 22 in the opening 21. FIG. 4A shows an example in which 16 LED elements 30 in 4 rows and 4 columns are mounted. In this case, four LED elements 30 are connected in series, and the four sets are further connected in parallel. In this way, the LED elements 30 are connected in series and parallel with each other in the light emitting units 20 with the number of series and the number of parallels set for the light emitting unit 20.

Hereinafter, when the number of LED elements 30 in series refers to four light emitting units, it is referred to as “light emitting unit 20 ₄ ”. When the light emitting units are not distinguished by the number of LED elements 30 in series, they are simply expressed as “light emitting unit 20”.

  The lower surface of the LED element 30 is fixed to the upper surface of the metal substrate 11 with, for example, a transparent insulating adhesive. The LED element 30 has a pair of element electrodes on the upper surface, and the element electrodes of the adjacent LED elements 30 are electrically connected to each other by wires 31 as shown in FIG. The wires 31 coming out of the LED elements 30 located on the outer peripheral side of the opening 21 are finally connected to the wiring pattern 14 of the circuit board 12. Thereby, a current is supplied to each LED element 30 via the wire 31.

  The sealing frame 23 is a substantially rectangular resin frame made of, for example, white resin in accordance with the size of the opening 21 of the circuit board 12, and the circuit board surrounds the LED elements 30 in the light emitting unit 20. 12 is fixed to the outer peripheral portion of the opening 21 on the upper surface. The sealing frame 23 is a dam material for preventing the sealing resin 24 from flowing out. In addition, the sealing frame 23 is provided with a reflective coating on the surface thereof, so that the light emitted from the LED element 30 to the side is above the light emitting unit 20 (as viewed from the LED element 30). Reflected toward the opposite side of the substrate 11. In FIG. 4A, the sealing frame 23 is illustrated as being transparent.

  The sealing resin 24 is filled in a region surrounded by the sealing frame 23 on the metal substrate 11, and integrally covers and protects (seals) the LED elements 30 and the wires 31 of the light emitting unit 20. As the sealing resin 24, for example, a colorless and transparent resin such as an epoxy resin or a silicone resin, particularly a resin having a heat resistance of about 250 ° C. may be used.

  The sealing resin 24 is mixed with a phosphor (not shown) such as a yellow phosphor. The yellow phosphor is a particulate phosphor material such as YAG (yttrium aluminum garnet) that absorbs blue light emitted from the LED element 30 and converts the wavelength into yellow light. The light emitting unit 20 emits white light obtained by mixing blue light from the LED element 30 that is a blue LED and yellow light obtained by exciting the yellow phosphor.

Alternatively, the sealing resin 24 may contain a plurality of types of phosphors such as a green phosphor and a red phosphor. The green phosphor is a particulate phosphor material such as (BaSr) ₂ SiO ₄ : Eu ²⁺ that absorbs blue light emitted from the LED element 30 and converts the wavelength into green light. The red phosphor is a particulate phosphor material such as CaAlSiN ₃ : Eu ²⁺ that absorbs blue light emitted from the LED element 30 and converts the wavelength into red light. In this case, the light emitting unit 20 is obtained by mixing blue light from the LED element 30 which is a blue LED and green light and red light obtained by exciting the green phosphor and the red phosphor thereby. Emits light.

5A and 5B are overall circuit diagrams of the light-emitting device 2. FIG. Reference numeral 50 indicates a driver that drives the 22 light emitting units 20 of the light emitting device 2, and reference numeral 203 indicates a light emitting unit having _three LED elements 30 in series. In the light emitting device 2, as shown in FIG. 2A, a total of five switching terminals 17 are provided on the upper surface of the circuit board 12. By changing the connection method of the switching terminals 17 according to the relationship between the number of light emitting devices 2 included in the lighting device 1 and the maximum voltage that can be supplied by the driver 50 to be used, the light emitting units 20 are connected in series and parallel. It is possible to switch. For example, depending on how the switching terminals 17 are connected, as shown in FIG. 5A, 22 light emitting units 20 are connected in series to the driver 50, or as shown in FIG. The 22 light emitting units 20 are divided into two sets connected in parallel to the driver 50, and 11 light emitting units 20 included in each set are connected in series with each other.

  As described above, each light emitting unit 20 includes a plurality of LED elements 30 which are divided into a plurality of columns connected in parallel to each other and connected in series in each of the plurality of columns. The light emitting device 2 is connected in series in each light emitting unit 20 so that the sum of the forward voltages (Vf) of the LED elements 30 connected in series in the entire device falls within the voltage range that can be driven by the driver 50. The number of LED elements 30 to be set is set. For this reason, in the light emitting device 2, not all the light emitting units 20 necessarily have the same number of LED elements 30. Generally, the number of LED elements 30 included in one light emitting unit 20 is different for each light emitting unit 20.

  For example, it is assumed that the maximum voltage that can be supplied by the driver 50 is 264V. Further, when an LED element (1) as the LED element 30 is used, it is assumed that Vf of one light emitting unit 20 having a series number of 4 is 10.5 to 11.7V. In this case, even if 22 light emitting units 20 are connected in series, Vf of the entire light emitting device 2 is 231.0 to 257.4 V, which is within a range that can be driven by the driver 50. On the other hand, when another LED element (2) is used as the LED element 30, it is assumed that the Vf of one light emitting unit 20 having a series number of 4 becomes 11.6 to 13.6V. In this case, when 22 light emitting units 20 are connected in series, Vf of the entire light emitting device 2 becomes 255.0 to 299.4 V, which exceeds the maximum voltage that can be driven by the driver 50.

For this reason, when using the latter LED element (2), the number of series in a part of the light emitting units 20 is three, and the number of series in which Vf is 11.6 to 13.6 V is four. a light emitting portion 20 _4, Vf combines a number of series and three light-emitting portion 20 ₃ is 8.69～10.21V. Then, out of a total of 22 light emitting units 20, if at least 11 in the light emitting portion 20 _3, Vf across the light emitting device 2 becomes less 264V, falls within the scope that can be driven by a driver 50. Therefore, the light emitting device 2, when using the LED elements (1), the 22 light emitting units 20 is the series number of the four light-emitting portion 20 _4, when using the LED elements (2) among the 22 pieces of the light emitting portion 20, for example, the eleven serial number and four light emitting portion 20 _4, the remaining 11 pieces of the series number and three light-emitting portion 20 _3.

  As described above, in the light emitting device 2, the number of the LED elements 30 connected in series in each light emitting unit 20 is different such that m in one light emitting unit 20 and n in another light emitting unit 20. As a result, the total forward voltage of the LED elements 30 connected in series in the entire apparatus is adjusted to be within the voltage range that can be driven by the target driver 50. For this reason, even if the type of the LED element 30 to be used is changed, the light emitting device 2 can be driven by the common driver 50 regardless of the forward voltage of the individual LED elements 30.

Figure 6 is a top view of the light emitting portion 20 _3. Figure 4 (A) light emitting section 20 _third light emitting portion 20 (the light emitting portion 20 ₄₎ shown in FIG 6 shown in differs only the number of the LED elements 30, but otherwise have the same configuration. A light-emitting portion 20 ₄ 16 LED element 30, they are connected by four in series, whereas the four pairs are further connected in parallel, the light emitting portion 20 _3, 12 LED elements 30 and they are connected in series three by three, and the four sets are further connected in parallel. In both the light emitting units 20 ₄ and 20 ₃ , the mounting area 22 is a rectangular area having the same shape and size, and the LED elements 30 are always mounted at least at the four corners of the mounting area 22. In addition, for example, the LED elements 30 are equally mounted inside the mounting region 22 in both the light emitting units 20 ₄ and 20 ₃ . In the light emitting units 20 ₄ and 20 ₃ , the mounting density of the LED elements 30 is different from each other because the mounting area 22 has the same size and the inter-element pitch is different. In addition, the light emitting portions 20 ₄ and 20 ₃ have different light emission densities when the light emitting portion is viewed as one light emitter.

FIG. 7 is a diagram schematically showing the arrangement of the LED elements 30 in the light emitting device 2. In FIG. 2A and FIG. 2B, the plurality of light emitting units are simply referred to as “light emitting unit 20” without being distinguished, but in the light emitting device 2, the forward voltage of the entire device is adjusted as described above. Therefore, for example, the number of series is four light-emitting portion 20 ₄ and the number of series is combined with three light-emitting portion 20 _3. FIG. 7 shows an example in which the light emitting portion 20 ₄ and the light emitting portion 20 ₃ are connected alternately. However, depending on the driver 50 to be used, the number of LED elements 30 in series may be the same in all the light emitting units 20, or there may be two or less or five or more light emitting units 20 in series.

  As described above, the LED elements 30 of the respective light emitting units 20 are mounted in the mounting region 22 having a shape and size common to the plurality of light emitting units 20 according to the series number and the parallel number set for the light emitting unit 20. Implemented in density. Thereby, since the light emission diameters are the same among the plurality of light emitting units 20, a lens array including a plurality of lenses 41 having the same shape and size regardless of the number of LED elements 30 included in each light emitting unit 20. 40 can be used.

  In addition, since the emitted light amount decreases in the light emitting unit 20 in which the number of the LED elements 30 is relatively reduced, when the light emitting units 20 having different numbers in series and / or in parallel are combined, the light emitting device 2 as a whole has unevenness in the emitted light amount. Can occur. Therefore, an LED element having a higher forward voltage may be used as the LED element 30 as the light emitting unit 20 has a smaller number of LED elements 30 in series and in parallel. If the LED element has a high forward voltage, the emitted light becomes brighter. Therefore, by selecting the LED element to be used for each light emitting unit 20, the amount of emitted light is made uniform among the plurality of light emitting units 20, and the unevenness is reduced. It becomes possible to emit no light.

  However, since the illumination device 1 is used as a projector, the illumination device 1 is installed at a position far away from the human eye, and thus uneven brightness on the light-emitting device 2 does not become a problem. For this reason, the light emitting units 20 having different numbers in series and / or in parallel need not be arranged uniformly in the light emitting device 2. Moreover, you may use the LED element with the same forward voltage in all the light emission parts 20. FIG.

  FIG. 8 is a flowchart illustrating an example of a manufacturing process of the light emitting device 2. When manufacturing the light emitting device 2, first, a plurality of light emitting units 20 are collectively formed on the substrate 10, and a plurality of sets of LED elements 30 are mounted on each light emitting unit 20. In that case, about each light emission part 20, several LED element 30 is mounted on the metal substrate 11 in the opening part 21 of the circuit board 12 (S1). Next, these LED elements 30 are connected in series and parallel with each other by wires 31 (S2). Further, the sealing frame 23 is fixed to the outer peripheral portion of the opening 21 (S3). Further, a sealing resin 24 containing a phosphor is filled in a region surrounded by the sealing frame 23 on the metal substrate 11, and the plurality of LED elements 30 are sealed (S4).

  As shown in FIG. 2A, two positioning holes 18 a and 18 b are formed as an example on the diagonal line on the upper surface of the circuit board 12, and the circuit board 12 corresponding to each light emitting unit 20 is formed. The position of the opening 21 is determined based on the positions of the positioning holes 18a and 18b. That is, the mounting position of the LED element 30 and the arrangement position of the sealing frame 23 of each light emitting unit 20 are determined based on the positions of the positioning holes 18a and 18b. Thereby, the variation in the formation position of the light emission part 20 decreases.

  Subsequently, the lens array 40 including a plurality of lenses 41 is arranged on the light emitting unit 20 with the relative positions of the respective light emitting units 20 and the corresponding lenses 41 roughly aligned (S5). At this time, for example, the lens array 40 is fixed to the substrate 10 by holding the end portions of the substrate 10 and the lens array 40 with the case 3. Alternatively, the lens array 40 may be fixed to the substrate 10 by the method described below.

  9A to 9C are diagrams illustrating an example of a method for fixing the lens array 40 to the substrate 10. 9A to 9C show a top view of the substrate 10, a top view of the lens array 40, and a longitudinal sectional view of the light emitting device 2 along the diagonal L, respectively. In FIGS. 9A to 9C, the number of the light emitting units 20 and the lenses 41 is shown as eight for simplicity.

  In the illustrated example, the substrate 10 and the lens array 40 are positioned using the positioning holes 18a and 18b. In this case, two support portions 43a and 43b are provided in advance on the diagonal line L of the lower surface of the lens array 40 (the surface facing the substrate 10) in accordance with the positions of the positioning holes 18a and 18b. The support portions 43 a and 43 b are columnar members that are formed integrally with the lens array 40 or bonded to the lens array 40. The substrate 10 and the lens array 40 are positioned by fitting the support portions 43a and 43b into the positioning holes 18a and 18b, respectively. Thereby, since the optical axis of each lens 41 can be easily aligned with the center of each light emitting unit 20, the process of adjusting the relative positions of the plurality of light emitting units 20 and the plurality of lenses 41 is simplified.

  The positioning holes 18a and 18b have larger diameters along the diagonal line L as the distance from the one end portion P of the diagonal line L increases. For example, as shown in FIGS. 2A and 9A, the positioning holes 18a and 18b are both circular, and the positioning hole 18b farther from the one end P than the positioning hole 18a has a diameter. large. Alternatively, the positioning holes 18a and 18b may be elliptical (long holes) whose major axis is the direction of the diagonal line L. In this case, the positioning hole 18b has a larger major diameter than the positioning hole 18a. Moreover, the diameter of the part fitted to positioning hole 18a, 18b in the lower end of support part 43a, 43b is a little thinner than positioning hole 18a, 18b. As a result, the relative positions of the plurality of light emitting units 20 and the plurality of lenses 41 along the diagonal L can be changed. Therefore, even when the substrate 10 and the lens array 40 are thermally expanded or contracted at different rates, the relative positions are changed. Can be finely adjusted.

  Thus, the relative positions of the plurality of light emitting units 20 and the plurality of lenses 41 can be changed according to the thermal expansion when the light emitting device 2 is turned on and the thermal contraction when the light emitting device 2 is turned off. The lens array 40 is fixed to each other. Then, the substrate 10 and the lens array 40 are accurately positioned by the method described below (S6).

  The positioning of the substrate 10 and the lens array 40 in S6 is performed according to the following concept. Due to the heat generated when the light emitting device 2 is turned on, the aluminum metal substrate 11 and the resin circuit substrate 12 and the glass lens array 40 constituting the substrate 10 expand with different thermal expansion coefficients. For example, assuming that the temperature of the substrate 10 and the lens array 40 rises by about 100 ° C. due to lighting, in the case of the substrate 10 having one side of about 10 cm, the amount of extension of about 1 mm is between the substrate 10 and the lens array 40. Differences can occur. Therefore, the relative position between each light emitting unit 20 and each lens 41 is shifted in advance in the opposite direction by Δd in consideration of the difference Δd in elongation. Thereby, when the light emitting device 2 is driven (the plurality of light emitting units 20 are turned on) and thermal expansion occurs, the difference between the preset deviation amount and the amount of elongation due to thermal expansion cancels each other, and each light emitting unit 20 And the optical axis of each lens 41 coincide. Therefore, when the light emitting device 2 is driven and thermal expansion occurs in the substrate 10 and the lens array 40, it is possible to improve the emission efficiency from each light emitting unit 20 through each lens 41.

  FIG. 10A and FIG. 10B are diagrams illustrating an example of a positioning method between the substrate 10 and the lens array 40. When positioning the substrate 10 and the lens array 40, for example, as shown in FIG. 10A, two adjacent sides of the substrate 10 and end portions of the lens array 40 corresponding to the two sides are used as a reference plane. It is brought into contact with the wall of the case 3. Then, the lens array 40 having a smaller coefficient of thermal expansion is shifted farther from the reference plane by a length corresponding to the difference Δd in the amount of elongation due to thermal expansion between the substrate 10 and the lens array 40. Due to the thermal expansion, the substrate 10 and the lens array 40 expand uniformly, and the whole is enlarged. Therefore, when the plurality of light emitting units 20 are turned on and the substrate 10 and the lens array 40 are thermally expanded by the above-described process, as shown in FIG. The relative position can be adjusted.

  The manufacturing process of the light emitting device 2 is thus completed. Below, the modification of the light emission part 20 is demonstrated.

  FIG. 11A and FIG. 11B are a top view and a side view of the light emitting device 2A. The light emitting device 2 shown in FIGS. 2A and 2B and the light emitting device 2A shown in FIGS. 11A and 11B are different in the shape of the light emitting portion 20 and the arrangement of the inspection terminals 16. In other respects, it has the same configuration. The light emitting unit 20 of the light emitting device 2 is substantially rectangular, whereas the light emitting unit 20A of the light emitting device 2A is slightly larger than the light emitting unit 20 and is circular. Thus, the shape of each light emitting unit in the light emitting device is not limited to a rectangle, but may be a circle or another shape. Further, the inspection terminal 16 of the light emitting device 2A is different from that of the light emitting device 2 in the interval between the two terminals for each light emitting unit 20A and the angle with respect to the side of the substrate 10, but in other respects it emits light. It has the same configuration as the device 2. The inspection terminals 16 are arranged on the substrate 10 with a distance d and an angle θ corresponding to the shape of the light emitting part.

12A and 12B are top views of the light emitting unit 20A. 12 (A) shows serial number of the LED elements 30 is four, the number of parallel shows four light emitting portion 20A _4. Further, FIG. 12 (B) series number of the LED elements 30 is four, the number of parallel shows three light emitting portion 20A _3. As described above, also in the light emitting device 2A, the LED elements 30 of the respective light emitting units 20A are arranged in a circular mounting region 22A having a common size in the plurality of light emitting units 20A, and the series number and the parallel number set for the light emitting unit 20A. It is mounted with the mounting density according to. In this case, the number of LED elements 30 in series, the number of parallel, or both may be different for each light emitting unit 20A.

FIG. 13 is a diagram schematically showing the arrangement of the LED elements 30 in the light emitting device 2B. The light-emitting device 2 shown in FIG. 7 and the light-emitting device 2B shown in FIG. 13 are different only in the number of LED elements 30 in series and in parallel in each light-emitting section, and have the same configuration in other respects. In the light emitting device 2, all the light emitting units 20 are arranged in the same parallel number, but for each light emitting unit 20, both the series number and the parallel number may be different. Emitting device 2B shown in FIG. 13, the number of series with the parallel number of four and even four light emitting section 20B _4, and a parallel number of three in series number five light emitting portion 20B _3. FIG. 13 shows an example in which the light-emitting portion 20B ₄ and the light emitting portion 20B ₃ are connected alternately. Even when both the number of series and the number of parallel are changed for each light emitting unit 20, the LED element 30 of each light emitting unit 20B may be mounted in the mounting region 22 having a common shape and size in the plurality of light emitting units 20B. preferable.

  14A and 14B are top views of the light emitting device 2C and the light emitting unit 20C in the light emitting device 2C. The light-emitting device 2 shown in FIG. 2A and the light-emitting device 2C shown in FIG. 14A differ only in the arrangement of the inspection terminals 16 of the respective light-emitting portions, and have the same configuration in other respects. In the light emitting device 2, each set of the inspection terminals 16 is arranged so as to sandwich the light emitting unit 20, but as shown in FIGS. 14A and 14B, each set of the inspection terminals 16 is The light emitting unit 20C may be disposed on one side without sandwiching the light emitting unit 20C. Even in this case, the two terminals constituting each set of the inspection terminals 16 are evenly arranged with a common interval d between the light emitting units 20C.

  FIG. 15 is a diagram schematically showing the arrangement of the LED elements 30 in the light emitting device 2D. The light emitting device 2D shown in FIG. 15 has the same configuration as the light emitting device 2 shown in FIG. 7 except that the size of the LED element 30 is different for each light emitting unit 20D. In the light emitting device 2D, the areas of the light emitting regions 22D of the respective light emitting units 20D are equal to each other, and the size of the LED elements 30 included in each light emitting unit 20D is smaller as the light emitting units 20D having a larger number of LED elements 30 in series. Thereby, even if the number of elements is changed for each light emitting unit 20D, a lens array including a plurality of lenses having the same outer shape can be used. Further, if the size of the element is reduced, the number of series in the light emitting region 22D having the same area can be increased, and the forward voltage for each light emitting unit 20D can be adjusted according to the number of series. It is also possible to make the voltage within a range that can be driven by a driver for the light emitting device 2D. In addition, among the light emitting devices 2A to 2C described so far, the LED elements 30 having different sizes may be used for the light emitting units having different numbers in series.

  FIG. 16 is a diagram schematically showing the arrangement of the LED elements 30 in the light emitting device 2E. The light emitting device 2E shown in FIG. 16 has the same configuration as the light emitting device 2 shown in FIG. 7 except that the size of each lens 41E in the lens array 40E differs for each light emitting unit 20E. The size of each lens 41E increases as the number of LED elements 30 included in the light emitting unit 20E corresponding to the lens 41E increases.

For example, the light-emitting unit 20E of the light-emitting device 2E includes a light-emitting unit 20E ₄ (an example of a first light-emitting unit) having 16 LED elements 30 connected in series and parallel to each other in 4 series and 4 parallel units, The light emitting unit 20E ₃ (an example of a second light emitting unit) having nine LED elements 30 connected in series and parallel with three in series and three in parallel. In the light emitting device 2E, the mounting density of the LED elements 30 is the same in each light emitting unit 20E, and as a result, the size of the light emitting region 22E is different for each light emitting unit 20E. The lens 41E of the light emitting device 2E is composed of a lens 41E ₄ corresponding to the light-emitting portion 20E _4, and corresponds to the light-emitting portion 20E ₃ lens 41E ₄ smaller lens 41E _3. FIG. 16 shows an example in which the light emitting units 20E ₄ and the light emitting units 20E ₃ are alternately arranged on the substrate 10. Thus, the number of LED elements 30 in each light-emitting portion 20E, that is, changing the size of the lens 41E according to the size of the light emitting region 22E, a small light-emitting portion 20E ₃ between the large emitting portion 20E ₄ Can be arranged. For this reason, in the light emitting device 2E, it becomes possible to form a large number of light emitting portions 20E at a higher density on the surface of the substrate 10, and the amount of emitted light increases.

  17A and 17B are a top view and a side view of the light-emitting device 2F. In the light emitting device 2F illustrated in FIG. 17A, unlike the light emitting device 2A illustrated in FIG. 11A, an opening is not provided in the center of the substrate 10F. Further, the substrate 10F and the lens array 40F of the light emitting device 2F are smaller than the substrate 10 of the light emitting device 2A, and the number of light emitting units 20F of the light emitting device 2F is smaller than the number of light emitting units 20A of the light emitting device 2A. In other respects, the light emitting device 2F has the same configuration as the light emitting device 2A. The light emitting unit 20F may have the same configuration as the light emitting units 20 and 20B to 20E described so far, and in that case, the opening may not be provided in the center of the substrate 10F.

  18A and 18B are a top view and a longitudinal sectional view of the light emitting unit 20G. More specifically, FIG. 18A is a top view of the light emitting unit 20G, and FIG. 18B is a cross-sectional view taken along the line XVIIIB-XVIIIB in FIG. FIG. 18A shows an example in which nine LED packages 30G are mounted in a 3 × 3 lattice pattern. The light-emitting portions 20 and 20A to 20F of the light-emitting devices 2 and 2A to 2F are not limited to those in which the LED elements 30 are connected to each other with the wires 31 and the whole is sealed with the sealing resin 24. FIG. Alternatively, the LED package 30G as shown in FIG. 18B may be configured by flip-chip mounting.

  The LED package 30 </ b> G includes an LED element 30 ′ having two element electrodes 32 formed on the lower surface, and a phosphor layer 33. The LED package 30G is a bump type light emitting element in which a flip chip bonding bump 34 is formed on an element electrode 32 on the lower surface of the LED element 30. The LED element 30 ′ is, for example, a blue semiconductor light emitting element (blue LED) that emits blue light having an emission wavelength band of about 450 to 460 nm.

  The phosphor layer 33 is configured by dispersing and mixing phosphor particles (not shown) in a colorless and transparent resin such as an epoxy resin or a silicone resin, for example, and the upper surface and the side surface of the LED element 30 ′ are uniformly formed. Cover. For example, the phosphor layer 33 contains a yellow phosphor such as YAG, absorbs blue light emitted from the LED element 30 ′, and converts the wavelength into yellow light. In this case, the LED package 30G emits white light obtained by mixing blue light from the LED element 30 ', which is a blue LED, and yellow light obtained by exciting the yellow phosphor. In addition, the kind of fluorescent substance which the fluorescent substance layer 33 contains may be other than this, and may differ for every LED package 30G.

DESCRIPTION OF SYMBOLS 1 Illuminating device 2,2A, 2B, 2C, 2D, 2E, 2F Light-emitting device 10,10F Board | substrate 11 Metal substrate 12 Circuit board 13 Opening part 16 Inspection terminal 18a, 18b Positioning hole 20, 20A, 20B, 20C, 20D , 20E, 20F, 20G Light emitting part 22 Mounting area 23 Sealing frame 24 Sealing resin 30, 30 'LED element 30G LED package 40, 40E, 40F Lens array 41, 41E Lens 43a, 43b Support part 50 Driver

Claims (4)

Mounting a plurality of sets of light emitting elements on a substrate to form a plurality of light emitting portions;
Disposing a lens array including a plurality of lenses arranged in accordance with an arrangement position of the plurality of light emitting units on the plurality of light emitting units;
The coefficient of thermal expansion of the substrate and the lens array so that the relative positions of the light emitting units and the plurality of lenses are matched when the plurality of light emitting units are turned on and the substrate and the lens array are thermally expanded. A step of positioning the substrate and the lens array by shifting the plurality of light emitting units and the plurality of lenses from each other by a distance of a size according to
A method for manufacturing a light-emitting device, comprising: The substrate is rectangular;
In the arranging step, the end portions of the substrate and the lens array are placed in the same housing so that the relative positions of the plurality of light emitting units and the plurality of lenses can be changed according to thermal expansion and contraction. Fixed,
The positioning step positions the substrate and the lens array by bringing two adjacent sides of the substrate and end portions of the lens array corresponding to the two sides into contact with the housing. Item 2. The manufacturing method according to Item 1. In the forming step, for each of the plurality of light emitting portions,
A plurality of LED elements are mounted on the substrate as the light emitting elements,
Electrically connecting the LED elements to each other with wires;
The manufacturing method according to claim 1 or 2, wherein a sealing resin containing a phosphor is filled on the substrate to seal the plurality of LED elements.   In the forming step, for each of the plurality of light emitting portions, a plurality of LED packages configured by covering the upper surface and side surfaces of the LED element with a resin layer containing a phosphor are formed on the substrate as the light emitting element. The manufacturing method according to claim 1, wherein flip chip mounting is performed.

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