JP2017059756A - Light-emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting device that is easy to assemble, that improves wavelength conversion efficiency by accelerating heat radiation from a fluorescence substance layer for converting the wavelength of light emitted from a plurality of light emitting elements, and that has increased optical density of a light-emitting area.SOLUTION: A light-emitting device 1 comprises: a base 10 having a reflection surface on an upper surface 11 thereof; a plurality of base plates 20 arranged on the base 10, inclining to the base 10, and forming an opening 3 in the center thereof; a plurality of light-emitting elements 30 mounted on an inclined mounting-surface 21 opposite the base 10 of the plurality of base plates 20; a fluorescence substance layer 40 containing a fluorescence substance excited by light emitted from the plurality of light-emitting elements 30, and disposed on the reflection surface of the base 10 below the opening 3; and a wavelength selection filter 50 disposed in contact with the upper surface of the base 10, having a face inclined along the mounting surface 21 between the plurality of light-emitting elements 30 and the fluorescence substance layer 40, transmitting light emitted from the plurality of light-emitting elements 30 and reflecting fluorescent light from the fluorescence substance layer 40.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a light emitting device.

  Patent Document 1 describes an LED lamp system having a chamber that includes a plurality of LED elements and includes a radiation opening for emitting light and a plurality of inner side wall surfaces. In this LED lamp system, the inner side wall surfaces are each mainly formed by a plurality of LED emission surfaces, a fluorescent material is provided at a distance in front of one of the LED emission surfaces, and the LED emission surface And a wavelength filter is arrange | positioned between fluorescent materials.

Japanese Patent No. 4813484

  In order to construct a high-output point light source, a light-emitting device in which many light-emitting elements are mounted to increase the light density in the light-emitting region is required. In particular, in a light-emitting device that converts the wavelength of light from a light-emitting element by a phosphor layer containing a phosphor and emits the light, the phosphor layer generates heat as the light-emitting element emits light. Therefore, it is necessary to efficiently dissipate the heat. There is. In the LED lamp system of Patent Document 1, the brightness is increased by a plurality of LED emission surfaces, but the heat dissipation path of the fluorescent material is only the route through the LED emission surface, and further, between the fluorescent material and the LED emission surface. Since there is also a wavelength filter, the heat dissipation of the fluorescent material is low. Further, since the LED element is a brittle material, when assembling the LED element as a side wall as in this LED lamp system, extreme care is taken so that, for example, the elements do not come into contact with each other and damage such as damage occurs. There is a need.

  Therefore, an object of the present invention is easy to assemble, promotes heat radiation from the phosphor layer that converts the wavelength of light emitted from a plurality of light emitting elements, improves wavelength conversion efficiency, and increases the light density in the light emitting region. It is to provide a light emitting device.

  A base having a reflective surface formed on the upper surface, a plurality of substrates disposed on the base so as to be inclined with respect to the base and forming an opening in the center, and an inclination facing the bases of the plurality of substrates A plurality of light emitting elements mounted on the mounting surface and a phosphor excited by light emitted from the plurality of light emitting elements, and disposed on the reflection surface of the base below the opening A layer and a surface that is in contact with the top surface of the base and is inclined along the mounting surface between the plurality of light emitting elements and the phosphor layer, and transmits light emitted from the plurality of light emitting elements from the phosphor layer. And a wavelength selective filter that reflects the fluorescence of the light emitting device.

The wavelength selective filter is preferably a hollow truncated pyramid having a shape in which an upper surface and a bottom surface are opened, and is disposed on the phosphor layer.
The wavelength selection filter is a plurality of flat members, and is preferably bonded to the light emitting element on each of the plurality of substrates.
It is preferable to further have a heat conduction member that is disposed on the base and is in contact with the upper surface of the base and the surface opposite to the mounting surface of the plurality of substrates.

The plurality of substrates have a pair of electrodes connected to an external power source to supply power to the plurality of light emitting elements, and the one set of electrodes is more than the plurality of light emitting elements and the phosphor layer on the base. It is preferable to arrange at a position on the peripheral side.
It is preferable that the base has a step that is one step higher on the lower side of the opening, the phosphor layer is disposed above the step, and one set of electrodes is disposed above the lower step.
The pair of electrodes is preferably arranged on the surface opposite to the mounting surface of the plurality of substrates.
It is preferable that the plurality of substrates bend with respect to the mounting surface whose peripheral edge portion is inclined to have a horizontal surface at the peripheral edge portion, and the one set of electrodes be disposed on the horizontal surface.

  The above light-emitting device is easy to assemble, promotes heat dissipation from the phosphor layer that converts the wavelength of light emitted from a plurality of light-emitting elements, improves wavelength conversion efficiency, and can increase the light density in the light-emitting region. become.

1 is a perspective view of a light emitting device 1. FIG. It is the vertical sectional view of the light-emitting device 1 along the IIA-IIA line, and the elements on larger scale of the end surface. 1 is an exploded perspective view of a light emitting device 1. FIG. FIG. 3 is a diagram illustrating an arrangement example of LED elements 30. It is a vertical end view of another light emitting device 1A. It is a vertical end view of another light-emitting device 1B. FIG. 3 is a vertical sectional view of the light emitting device 2 corresponding to FIG. 3 is an exploded perspective view of the light emitting device 2. FIG. It is a vertical end view of another light emitting device 2A. It is a vertical end view of another light emitting device 2B.

  Hereinafter, a light emitting device will be described in detail with reference to the accompanying drawings. However, it should be understood that the present invention is not limited to the drawings or the embodiments described below.

  FIG. 1 is a perspective view of the light emitting device 1. 2A is a vertical cross-sectional view of the light-emitting device 1 along the line IIA-IIA shown in FIG. 1, and FIG. 2B is a view of the end surface of the light-emitting device 1 along the same IIA-IIA line. It is the figure which expanded the center part. FIG. 3 is an exploded perspective view of the light emitting device 1.

  The light emitting device 1 includes a base 10, a mounting substrate 20, a heat conducting member 25, an LED element 30, a phosphor layer 40, and a wavelength selection filter 50 as main components. The light-emitting device 1 is a reflective light-emitting device that reflects light emitted from the LED element 30 on the mounting substrate 20 on the upper surface of the base 10, converts the wavelength through the phosphor layer 40, and emits the light from the upper opening 3. For example, it can be used for a light source such as a projector.

  The base 10 is a flat plate member made of metal, and has a size of several cm square, for example. As shown in FIGS. 2A to 3, the base 10 has a step at its center, and a rectangular upper surface 11 that is one step higher than the upper surface 12 of the peripheral edge is formed at the center. . A reflection surface is formed on the upper surface 11 of the base 10, and the emitted light from the LED element 30 is reflected toward the upper rectangular opening 3. The base 10 is a substrate of the light emitting device 1 and also functions as a heat dissipation substrate that dissipates heat generated in the light emitting device 1. The material of the base 10 is preferably a metal excellent in heat resistance and heat dissipation, for example, aluminum, but may be another metal such as copper.

  As shown in FIG. 2 (B), the mounting substrate 20 is inclined toward the upper surface 11 at the center of the base 10 and the phosphor layer 40 on the base 10 with the mounting surface 21 obliquely downward. 10 is attached to the heat conduction member 25 on the upper surface. In the light emitting device 1, four mounting boards 20 are provided corresponding to the sides of the rectangular upper surface 11 and the rectangular opening 3 located thereabove. The four mounting boards 20 are arranged on the base 10 so as to be inclined with respect to the base 10 and to form the opening 3 in the center. The mounting substrate 20 is, for example, a metal substrate made of aluminum, and a wiring pattern (not shown) is formed on the mounting surface 21 via an insulating layer. A plurality of LED elements 30 are mounted on the mounting surface 21 of each mounting substrate 20. The mounting substrate 20 may be other than a metal such as a ceramic substrate, but is preferably a metal substrate from the viewpoint of heat resistance and heat dissipation.

  Each mounting board 20 has a pair of electrodes 23 and 24 connected to an external power source to supply power to the LED elements 30 on the board. As shown in FIG. 2B, the mounting substrate 20 extends obliquely downward toward the upper surface 12 which is the lower step of the base 10, and the electrodes 23 and 24 are located above the upper surface 12, that is, The LED element 30 and the phosphor layer 40 on the base 10 are arranged at positions on the peripheral side. A lead wire (not shown) is connected to the electrodes 23 and 24, and the lead wire is drawn out of the light emitting device 1 through a groove portion (not shown) formed in the heat conducting member 25 and connected to an external power source.

  As shown in FIG. 1, the heat conducting member 25 is a rectangular flat plate member disposed on the base 10, and has a rectangular opening 3 at the center thereof. The opening 3 has a size of, for example, several mm square, and the light whose wavelength is converted by the phosphor layer 40 is emitted from here. As shown in FIGS. 2A to 3, below the opening 3, the heat conducting member 25 has a quadrangular pyramid-shaped recess corresponding to the light emitting region 4, and the step of the base 10 is Housed inside. The heat conducting member 25 is configured, for example, by bonding four members 25a to 25d whose upper surfaces each having one side of the opening 3 shown in FIG.

  Similarly to the base 10, the heat conducting member 25 is made of, for example, aluminum having excellent heat resistance and heat dissipation, but the material may be another metal such as copper. The bottom surface of the heat conducting member 25 is a horizontal plane and is in contact with the top surface 12 of the base 10. The side surface of the concave portion of the heat conducting member 25 is an inclined surface and is in contact with the surface on the opposite side of the mounting surface 21 of the mounting substrate 20. Thereby, the heat conduction member 25 transmits the heat generated by the LED elements 30 on the mounting substrate 20 to the base 10 to dissipate heat.

  FIG. 4 is a diagram illustrating an arrangement example of the LED elements 30. The LED elements 30 are an example of light emitting elements, and a plurality of LED elements 30 are mounted on the inclined mounting surfaces 21 facing the base 10 of the four mounting substrates 20. For example, the individual LED elements 30 may be electrically connected using wires, but in the light emitting device 1, in order to reduce the mounting area, the LED elements 30 are mounted on the mounting substrate 20 using gold bumps. Flip chip mounted. FIG. 4 shows an example in which 16 LED elements 30 are mounted in a 4 × 4 grid pattern as an example. Each LED element 30 emits light in the same wavelength region (same color) such as ultraviolet light having a wavelength of about 300 to 400 nm or blue light having a wavelength of about 450 to 460 nm.

  The phosphor layer 40 contains a phosphor that is excited by the light emitted from the LED element 30 and functions as a wavelength conversion member that converts the wavelength of the light emitted from the LED element 30. As shown in FIG. 2B, the phosphor layer 40 is disposed on the upper surface 11 that is the reflecting surface of the base 10 below the opening 3. The phosphor layer 40 is configured, for example, by containing phosphor particles in a transparent resin or a translucent material such as glass or ceramic.

  When the light emitting device 1 is used as a white light source, a phosphor material (yellow phosphor) that emits yellow light such as YAG (yttrium aluminum garnet) is dispersed and mixed in the phosphor layer 40. For example, when each LED element 30 emits blue light, the light emitting device 1 mixes blue light from the LED element 30 and yellow light obtained by exciting yellow phosphors thereby. The resulting white light is emitted.

When the light-emitting device 1 is used as a red light source, a phosphor material (red phosphor) that emits red light, such as CaAlSiN ₃ : Eu ^2+, is dispersed and mixed in the phosphor layer 40. When the light emitting device 1 is used as a light source of green light, a phosphor material (green phosphor) that emits green light such as (BaSr) ₂ SiO ₄ : Eu ²⁺ is dispersed and mixed in the phosphor layer 40. The When the light emitting device 1 is used as a blue light source, a phosphor material (blue phosphor) that emits blue light such as (BaMgAl) ₁₀ O ₁₇ : Eu ²⁺ is dispersed and mixed in the phosphor layer 40. The For example, when each LED element 30 emits ultraviolet light, the light emitting device 1 emits red light, green light, or blue light obtained by exciting the phosphor in the phosphor layer 40 with the ultraviolet light. .

  The wavelength selection filter 50 is a flat member having a dichroic coating, and is configured by coating a dielectric multilayer film that reflects light in a specific wavelength range on the surface of a light-transmitting plate made of glass or sapphire, for example. The light emitting device 1 includes four wavelength selection filters 50 corresponding to the four mounting substrates 20, and each wavelength selection filter 50 is bonded to the LED element 30 on the corresponding mounting substrate 20. . The wavelength selection filter 50 is disposed so as to be in contact with the end portion of the upper surface 11 of the base 10, and is bonded to the LED element 30 on the mounting substrate 20, whereby the LED element 30 and the phosphor layer 40 are bonded. In between, it has the surface inclined along the mounting surface 21 of the mounting substrate 20. In order to increase the light extraction efficiency from the opening 3, it is better to match the arrangement angle of the LED element 30 and the wavelength selection filter 50 with respect to the upper surface 11 (reflection surface) of the base 10. The arrangement angle can be easily adjusted.

  The wavelength selection filter 50 transmits the emitted light from the LED element 30 and reflects the fluorescence from the phosphor layer 40. For example, when the phosphor layer 40 contains a yellow phosphor and each LED element 30 emits blue light, the wavelength selection filter 50 transmits blue light from the LED element 30, and the phosphor layer 40 Reflects yellow light generated by wavelength conversion. When each LED element 30 emits light, light enters the light emitting region 4 surrounded by the side surface with the wavelength selection filter 50, the bottom surface with the phosphor layer 40, and the opening 3 on the top surface through the wavelength selection filter 50, The light is reflected from the upper surface 11 of the base 10, converted in wavelength by the phosphor layer 40, and then emitted from the upper opening 3. At this time, since the wavelength selection filter 50 is present, yellow light from the phosphor layer 40 does not enter the mounting substrate 20 side, and therefore, the yellow light is not absorbed by the mounting substrate 20 or the LED element 30. Therefore, the light extraction efficiency from the opening 3 can be increased.

  In the light emitting device 1, since the phosphor layer 40 is disposed on the upper surface 11 of the base 10 having excellent heat resistance and heat dissipation, heat generated in the phosphor layer 40 can be efficiently radiated from the base 10. it can. For this reason, since it becomes difficult to raise the temperature of the fluorescent substance layer 40, while wavelength conversion efficiency becomes high and emitted light amount increases, fluorescent substance becomes difficult to deteriorate. Therefore, in the light emitting device 1, the light density of light emitted from the opening 3 can be increased.

  Further, in the light emitting device 1, the mounting substrate 20 is disposed obliquely with respect to the step of the base 10, so that the electrodes 23 and 24 of the mounting substrate 20 are placed outside the light emitting region 4 on the upper surface 11 of the base 10. And it can arrange | position in the position away from the mounting area | region of the LED element 30. FIG. For this reason, in the light emitting device 1, the number of LED elements 30 that can be mounted on the mounting substrate 20 can be increased as compared with the case where electrodes are arranged on the mounting surface 21. Further, in the light emitting device 1, the electrodes 23 and 24 are arranged at positions away from the mounting region of the LED element 30, thereby causing the heat conducting member 25 to directly contact the back surface of the mounting region on the mounting substrate 20 to generate heat. It is also possible to promote heat dissipation from a large amount of area.

  FIG. 5 is a vertical end view of another light emitting device 1A. FIG. 5 is an enlarged view of the central portion of the vertical end face of the light emitting device 1A corresponding to FIG. The light emitting device 1A is different from the light emitting device 1 only in the shape of the base and the arrangement positions of the electrodes 23 and 24, and has the same configuration as the light emitting device 1 in other points. For this reason, the description of the parts overlapping with the light emitting device 1 is omitted. The light emitting device 1A also has the same heat conducting member 25 as that of the light emitting device 1, but in FIG. 5, the heat conducting member 25 is not shown for simplicity.

  As shown in FIG. 5, the base 10 </ b> A of the light emitting device 1 </ b> A does not have a step unlike the light emitting device 1, and the side surfaces 13 and 14 are inclined obliquely so that the top surface is smaller than the bottom surface. The lower end of the mounting substrate 20 is affixed to the side surfaces 13 and 14 of the base 10A. In the light emitting device 1 </ b> A, the electrodes 23 and 24 are disposed on the upper surface 22 </ b> A opposite to the mounting surface of the mounting substrate 20. As described above, the side surfaces 13 and 14 of the base 10A are inclined obliquely, and the electrodes 23 and 24 are disposed on the upper surface 22A of the mounting substrate 20, so that the electrodes 23 and 24 can be formed without providing a step on the base 10A. 24 can be arranged at a position away from the mounting area of the LED element 30. Thereby, in the light emitting device 1A, the area where the mounting substrate 20 contacts the base 10A and the heat conducting member 25 increases, which is advantageous in terms of heat dissipation.

  FIG. 6 is a vertical end view of another light emitting device 1B. FIG. 6 is an enlarged view of the central portion of the vertical end surface of the light emitting device 1B corresponding to FIG. The light emitting device 1B differs from the light emitting device 1 only in the shape of the base and the mounting substrate and the arrangement positions of the electrodes 23 and 24, and has the same configuration as the light emitting device 1 in other points. For this reason, description about the part which overlaps with the light-emitting device 1 is abbreviate | omitted. In addition, although the light-emitting device 1B has the same heat conductive member 25 as the light-emitting device 1, the description of the heat conductive member 25 is omitted in FIG. 6 for simplicity.

  As shown in FIG. 6, the base 10 </ b> B of the light emitting device 1 </ b> B does not have a step unlike the light emitting device 1 and has a flat shape as a whole. The mounting substrate 20B of the light emitting device 1B has a horizontal plane 22B at the peripheral portion by bending the peripheral portion with respect to the inclined mounting surface, and is attached to the upper surface 11 of the base 10B under the horizontal plane 22B. In the light emitting device 1 </ b> B, the electrodes 23 and 24 are disposed on the horizontal surface 22 </ b> B of the mounting substrate 20. Thus, by bending the mounting substrate 20B and arranging the electrodes 23 and 24 on the horizontal plane 22B, the electrodes 23 and 24 are separated from the mounting region of the LED element 30 without providing a step in the base 10B. Can be placed at different positions. Thereby, also in the light-emitting device 1B, since the area where the mounting substrate 20 contacts the base 10B and the heat conducting member 25 increases, it is advantageous in terms of heat dissipation.

  FIG. 7 is a vertical sectional view of the light emitting device 2 corresponding to FIG. FIG. 8 is an exploded perspective view of the light emitting device 2. The light emitting device 2 is different from the light emitting device 1 only in the shape of the wavelength selection filter, and has the same configuration as the light emitting device 1 in other points. For this reason, the description of the parts overlapping with the light emitting device 1 is omitted.

  As shown in FIGS. 7 and 8, the wavelength selection filter 60 of the light emitting device 2 is a hollow pyramid having a shape in which an upper surface and a bottom surface are opened, and a lower end is brought into contact with the upper surface 11 to phosphor layer 40. It is placed on the top. More specifically, the wavelength selection filter 60 is obtained by coating a dielectric multilayer film that reflects light in a specific wavelength range on the surface of a light-transmitting plate made of glass or sapphire formed into a hollow quadrangular pyramid shape. Composed. The four side surfaces 62 of the wavelength selection filter 60 are arranged so as to correspond to the four mounting substrates 20, respectively, and have the same inclination angle as the mounting surface 21 of each mounting substrate 20 with respect to the upper surface 11 of the base 10. Have. In the illustrated example, a gap is provided between the side surface 62 of the wavelength selection filter 60 and the LED element 30, but the side surface 62 may be in contact with the LED element 30. The opening 61 on the upper surface of the wavelength selection filter 60 is disposed at a position that matches the opening 3 on the upper surface of the light emitting device 2.

  When each LED element 30 emits light, light enters the internal space of the wavelength selection filter 60 through the side surface 62 of the wavelength selection filter 60. The light is reflected by the upper surface 11 of the base 10 and wavelength-converted by the phosphor layer 40, and then is emitted to the outside of the light emitting device 2 through the opening 61 on the upper surface of the wavelength selection filter 60 and the opening 3 thereabove. Is done. Even in the light emitting device 2, since the yellow light from the phosphor layer 40 does not enter the mounting substrate 20 due to the wavelength selection filter 60, the yellow light is not absorbed by the mounting substrate 20 or the LED element 30. . Therefore, the light extraction efficiency from the opening 3 can be increased.

  In the light emitting device 1, since there is a gap between the four wavelength conversion filters 50, part of the converted light (here yellow light) radiated obliquely upward from the phosphor layer 40 is absorbed by the heat conducting member 25. Is done. On the other hand, in the light emitting device 2, since a closed space except for the opening 61 is formed above the wavelength conversion filter 60, the amount of converted light absorbed by the heat conducting member 25 can be reduced compared to the light emitting device 1. it can. Further, in the light emitting device 2, the wavelength selection filter 60 has a quadrangular pyramid shape, so that the light emission region of the converted light (here, yellow light) is narrowed compared to the case where the LED element 30 is covered with the wavelength selection filter. be able to. For this reason, the optical path length of the converted light can be shortened, and as a result, the attenuation of light in the air can be reduced.

  In the light emitting device 2, since the wavelength selection filter 60 has a quadrangular pyramid shape, the mounting substrate 20 can be positioned with reference to the side surface 62 of the wavelength selection filter 60. When manufacturing the light emitting device 2, the LED element 30 is mounted on the mounting substrate 20 in advance, the mounting substrate 20 is bonded to the heat conducting member 25, and the phosphor layer 40 is formed on the upper surface 11 of the base 10. The Then, the wavelength selection filter 60 is disposed on the phosphor layer 40, and the mounting substrate 20 is disposed on the base 10 so as to overlap the wavelength selection filter 60. In general, if the substrate is inclined, it is difficult to adjust the angle and the assemblability deteriorates. However, in the light emitting device 2, the mounting substrate 20 is positioned using the wavelength selection filter 60 having a truncated pyramid shape. be able to. For this reason, in the light-emitting device 2, since assembly becomes easy and assembly property improves, there exists an advantage that possibility that the LED element 30 will be damaged will become low.

  Further, each wavelength variation selection filter 50 bonded to the LED element 30 in the light emitting device 1 is formed in a trapezoidal shape, and the sides of the wavelength variation selection filters 50 in the height direction are aligned on the upper surface 11 and the side sides are aligned. The wavelength selection filter 50 may be formed in a hollow quadrangular frustum shape like the wavelength selection filter 60 of the light-emitting device 2 by bonding. Even in such a case, since the four mounting substrates 20 can be positioned with reference to the wavelength selection filter, the assemblability is improved similarly.

  FIG. 9 is a vertical end view of another light emitting device 2A. FIG. 10 is a vertical end view of another light emitting device 2B. Light emitting devices 2A and 2B shown in FIGS. 9 and 10 are obtained by replacing the wavelength selective filter 50 of the light emitting devices 1A and 1B shown in FIGS. 5 and 6 with a wavelength selective filter 60, respectively. In other respects, the light emitting devices 2A and 2B have the same configuration as the light emitting devices 1A and 1B. The light emitting devices 2A and 2B also have the same heat conducting member 25 as that of the light emitting devices 1 and 2, but the heat conducting member 25 is not shown in FIGS. 9 and 10 for simplicity.

  As shown in FIGS. 9 and 10, even when the wavelength selection filter 60 having a quadrangular frustum shape is used, the electrodes 23 and 24 are disposed on the upper surface 22A opposite to the mounting surface of the mounting substrate 20, or the mounting substrate 20B may be bent and the electrodes 23 and 24 may be arranged on the horizontal plane 22B. Thereby, also in the light emitting devices 2A and 2B, the area where the mounting substrate 20 contacts the bases 10A and 10B and the heat conducting member 25 is increased, which is advantageous in terms of heat dissipation.

1, 1A, 1B, 2, 2A, 2B Light emitting device 3 Opening portion 10, 10A, 10B Base 20, 20B Mounting substrate 21 Mounting surface 23, 24 Electrode 25 Thermal conduction member 30 LED element 40 Phosphor layer 50, 60 Wavelength Selection filter 61 Opening

Claims (8)

A base with a reflective surface formed on the top surface;
A plurality of substrates disposed on the base so as to be inclined with respect to the base and to form an opening in the center;
A plurality of light emitting elements mounted on an inclined mounting surface facing the base of the plurality of substrates;
Containing a phosphor excited by light emitted from the plurality of light emitting elements, and a phosphor layer disposed on the reflecting surface of the base below the opening;
A surface that is in contact with the upper surface of the base and is inclined along the mounting surface between the plurality of light-emitting elements and the phosphor layer, transmits light emitted from the plurality of light-emitting elements, and transmits the fluorescence. A wavelength selective filter that reflects fluorescence from the body layer;
A light emitting device comprising:   2. The light emitting device according to claim 1, wherein the wavelength selection filter is a hollow pyramid frustum having a shape in which an upper surface and a bottom surface are opened, and is placed on the phosphor layer.   The light emitting device according to claim 1, wherein the wavelength selection filter is a plurality of flat plate-like members, and is bonded to a light emitting element on the substrate in each of the plurality of substrates.   The heat conducting member according to any one of claims 1 to 3, further comprising a heat conductive member disposed on the base and in contact with an upper surface of the base and a surface opposite to the mounting surface of the plurality of substrates. The light-emitting device of description. The plurality of substrates have a set of electrodes connected to an external power source to supply power to the plurality of light emitting elements,
5. The light-emitting device according to claim 1, wherein the one set of electrodes is disposed on a peripheral side of the plurality of light-emitting elements and the phosphor layer on the base. The base has a step that is one step higher on the lower side of the opening,
The phosphor layer is disposed on an upper stage of the step,
The light emitting device according to claim 5, wherein the one set of electrodes is disposed above a lower stage of the step.   The light emitting device according to claim 5, wherein the one set of electrodes is disposed on a surface of the plurality of substrates opposite to the mounting surface. The plurality of substrates have a horizontal plane at the peripheral portion by bending the peripheral portion with respect to the inclined mounting surface,
The light emitting device according to claim 7, wherein the set of electrodes is disposed on the horizontal plane.

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