JPS6424495A - Method for mounting semiconductor - Google Patents

Method for mounting semiconductor

Info

Publication number
JPS6424495A
JPS6424495A JP18087087A JP18087087A JPS6424495A JP S6424495 A JPS6424495 A JP S6424495A JP 18087087 A JP18087087 A JP 18087087A JP 18087087 A JP18087087 A JP 18087087A JP S6424495 A JPS6424495 A JP S6424495A
Authority
JP
Japan
Prior art keywords
semiconductor
wiring board
frame
printed wiring
pushed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18087087A
Other languages
Japanese (ja)
Inventor
Yasuhiro Shiobara
Takao Ikeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shiojiri Kogyo KK
Original Assignee
Shiojiri Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shiojiri Kogyo KK filed Critical Shiojiri Kogyo KK
Priority to JP18087087A priority Critical patent/JPS6424495A/en
Publication of JPS6424495A publication Critical patent/JPS6424495A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To simplify a mounting process and facilitate replacement a semiconductor and repair of a defective by a method wherein a semiconductor is mounted on a printed wiring board through a pressure welding. CONSTITUTION:For instance, a semiconductor 1 is placed on a printed wiring board 2, and a frame 4 is pushed in the printed wiring board 2 after an elastic component 3 formed of silicone rubber or the like is set on a lead frame 4 of the semiconductor 1, so that the semiconductor can be mounted. An embedding dimension of the frame 4 is set in such a manner as the frame 4 is decreased in volume by 10-40% when it is compressed as it is pushed in the printed wiring board, so that the lead frame of the semiconductor 1 is continuously in pressured contact with the contact face of the wiring board 2 and therefore an electric conductivity is kept. And, when an electrically conductive sheet or the like is inserted between the frame of the semiconductor 1 and the contact face of the printed wiring board, the electric conductivity is further improved.
JP18087087A 1987-07-20 1987-07-20 Method for mounting semiconductor Pending JPS6424495A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18087087A JPS6424495A (en) 1987-07-20 1987-07-20 Method for mounting semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18087087A JPS6424495A (en) 1987-07-20 1987-07-20 Method for mounting semiconductor

Publications (1)

Publication Number Publication Date
JPS6424495A true JPS6424495A (en) 1989-01-26

Family

ID=16090787

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18087087A Pending JPS6424495A (en) 1987-07-20 1987-07-20 Method for mounting semiconductor

Country Status (1)

Country Link
JP (1) JPS6424495A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003109143A (en) * 2001-09-28 2003-04-11 Nohmi Bosai Ltd Smoke applying tester of smoke sensor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003109143A (en) * 2001-09-28 2003-04-11 Nohmi Bosai Ltd Smoke applying tester of smoke sensor

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