JP2011091204A - Method for manufacturing led light source device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing an LED (light-emitting diode) light source device having a satisfactory mixed color performance and which has less color unevenness. <P>SOLUTION: The method for manufacturing the LED light source device having a resin layer covering the LED element includes forming the resin layer, by partially hardening a resin member around the LED element by the energy generated, when the LED element is made to emit light; and forming a fluorescent material layer having a uniform film thickness, by making the fluorescent material settle down on the surface of the resin layer with the resin layer in an uncured state. As a result of this, the fluorescent material layer having a uniform film thickness around the LED element to manufacture the LED light source device which is evenly colored and moreover, and which uses the fluorescent in an effective way. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a method for manufacturing an LED light source device including a resin layer containing a phosphor that emits wavelength-converted light when excited by receiving light emitted from a light emitting element.

  Conventionally, light-emitting diodes (hereinafter abbreviated as LEDs), which are compound semiconductors, are widely used as light source devices by taking advantage of their long life and miniaturization. In addition, LEDs that emit blue light using gallium nitride-based compound semiconductors (hereinafter abbreviated as GaN-based semiconductors) have been developed and commercialized, so that a resin that seals LED elements contains a phosphor that emits yellow light. LED light source devices that obtain pseudo white light by mixing blue light and yellow light have been put into practical use. In addition, LEDs having a peak wavelength from ultraviolet light to near ultraviolet light (for example, 350 to 410 nm) have been developed by GaN-based semiconductors, and are excited by receiving this ultraviolet light to near ultraviolet light, thereby causing red light, green light, An LED light source device that obtains white light using three types of phosphors that emit blue light is also disclosed.

  In such a white LED, a manufacturing method is disclosed in which after the photocurable phosphor-containing composition is applied to the LED element, the LED element emits light to cure the photocurable phosphor-containing composition (for example, Patent Document 1). The manufacturing method of this white LED light source device includes a step of forming a photocurable phosphor-containing composition layer on the surface of the LED element, a step of causing the LED element to emit light and curing the photocurable phosphor-containing composition, And a step of removing the uncured product so as to leave a cured product of the photocurable phosphor-containing composition after the curing step.

  And even if uneven mixing of the phosphor particles contained in the photocurable phosphor-containing composition occurs, in the optical path where there are a lot of phosphor particles, the curing of the composition does not proceed, the cured region becomes thin, It has been shown that in an optical path with few phosphor particles, the cured region becomes thicker as the composition is cured. Thereby, it is shown that the converted light from the phosphor is adjusted to suppress uneven color and uneven light emission.

JP 2008-159756 A (pages 4 and 10)

However, the manufacturing method of the white LED light source device of Patent Document 1 has the following problems.
In the production method of removing the uncured product by leaving the LED element to emit light and curing the photocurable phosphor-containing composition, and then leaving the cured product of the photocurable phosphor-containing composition, in the step of removing It is difficult to completely remove the resin in the cured portion, and there is a concern about contamination due to adhesion of the phosphor to other than the cured product, that is, the base material or the electrode. Moreover, when uncured resin has adhered to the surface of the cured portion, color unevenness occurs due to the phosphor in the adhered uncured resin.

  Moreover, in the manufacturing method of the white LED light source device of patent document 1, when the LED element self-emits and the photocurable phosphor-containing composition is cured, the phosphor layer formed by curing has the light emission intensity of the LED element. Since it is formed depending on the LED element, it becomes a substantially semispherical shape with the LED element as the center, and there is a problem that uneven color due to the emission angle occurs. The reason will be described below.

FIG. 18 shows an example of a conventional LED light source device for explaining the above problem. As shown in FIG. 18, reference numeral 100 is an example of a conventional LED light source device disclosed in Patent Document 1 or the like.
In the LED light source device 100, an LED element 102 is mounted on a substrate 101, and the LED element 102 is covered. The phosphor layer 110 containing the phosphor 111 is composed of a light-curable phosphor-containing composition that emits light from the LED element. The region is cured by the above, and is formed in a substantially semispherical shape according to the light emission intensity of the LED element 102.

  That is, since the emitted light 120a emitted from the LED element 102 in the vertical direction has a high emission intensity, the phosphor layer 110 is cured to a distance far from the emission surface 102a of the LED element 102. Further, since the emitted light 120b emitted from the LED element 102 in the diagonal direction on the left side in the drawing has a low emission intensity, the curing of the phosphor layer 110 stops at a relatively close distance from the emission surface 102a of the LED element 102. Further, since the emitted light 120c emitted from the LED element 102 in the lateral direction on the right side in the drawing has a low emission intensity, the curing of the phosphor layer 110 stops at a relatively close distance from the emission surface 102a of the LED element 102. As described above, the phosphor layer 110 has a substantially hemispherical shape centered on the LED element 102 because the vertical distance from the LED element 102 becomes longer and the oblique direction and the lateral direction gradually become shorter from the LED element 102. It is formed.

  Here, when the LED light source device 100 is driven, the emitted light 120a emitted vertically from the LED element 102 is emitted to the outside through the phosphor layer 110, and the emission surface 102a of the LED element 102 at that time is emitted. The length from the first through the phosphor layer 110 is defined as a path length 121a. Similarly, the emitted light 120b emitted from the LED element 102 in the diagonal direction on the left side of the drawing is similarly emitted obliquely through the phosphor layer 110 and emitted from the emission surface 102a of the LED element 102 at that time. A length passing through the body layer 110 is defined as a path length 121b. Similarly, the emitted light 120c emitted from the LED element 102 in the lateral direction on the right side in the drawing similarly passes through the phosphor layer 110 in the lateral direction and is emitted to the outside, and from the emission surface 102a of the LED element 102 at that time. A length passing through the phosphor layer 110 is defined as a path length 121c.

  Here, the path length 121a in the vertical direction and the path lengths 121b and 121c in the oblique direction and the horizontal direction are different depending on the direction from the emission surface 102a of the LED element 102 to the end of the phosphor layer 110 as described above. It can be understood that the vertical path length 121a is long and the diagonal and horizontal path lengths 121b and 121c are short. Thereby, the outgoing light 120a in the vertical direction is incident on and absorbed by many phosphors 111 in the phosphor layer 110 because the path length 121a is long. In addition, since the path lengths 121b and 121c are short, the outgoing lights 120b and 120c in the oblique direction and the lateral direction are incident on and absorbed by the few phosphors 111 in the phosphor layer 110. Accordingly, the wavelength conversion ratio of the emitted light varies depending on the emission angle of the emitted light from the LED element 102.

  That is, the emitted light 120a in the vertical direction of the LED element 102 has a high ratio of wavelength conversion, and thus the amount of converted light increases. However, the emitted light 120b and 120c in the oblique and lateral directions of the LED element 102 are converted in wavelength. The amount of converted light is small because the ratio of the generated light is small. As a result, color unevenness occurs depending on the emission angle of the emitted light, which is a problem.

  Moreover, since this conventional method for manufacturing an LED light source device includes a step of removing uncured material after the curing step, the resin and expensive phosphor contained in the uncured portion are wasted, and the member is removed. It cannot be used efficiently. Even if the removed phosphor is recovered by some method, a recovery process is required, which complicates the process.

  Accordingly, an object of the present invention is to solve the above problems and provide a method for manufacturing an LED light source device without removing uncured resin containing a phosphor and having less color unevenness.

  In order to solve the above-mentioned problems, the manufacturing method of the LED light source device of the present invention employs the following means.

  The manufacturing method of the LED light source device of the present invention is a manufacturing method of an LED light source device that is formed by curing a sealing resin containing a phosphor that covers the LED element. A step of covering and applying, a step of partially curing the sealing resin around the LED element by causing the LED element to emit light, and a step of precipitating the phosphor contained in the uncured sealing resin A step of curing the uncured sealing resin by causing the LED element to self-emit after the phosphor is precipitated.

  Moreover, the manufacturing method of the LED light source device of this invention performs the process which hardens uncured sealing resin by making the said LED element self-light-emit.

  Moreover, the manufacturing method of the LED light source device of this invention makes an LED element self-light-emit by supplying an electric current to an LED element through the wire which electrically connected the electrode part and LED element which were provided in the board | substrate. The sealing resin is partially cured.

  Moreover, the manufacturing method of the LED light source device of the present invention is such that the sealing resin is a thermosetting resin, and the thickness of the partially cured sealing resin is determined by the amount of heat when the LED element emits light. It is a film thickness.

  Moreover, the manufacturing method of the LED light source device of the present invention is such that the sealing resin is a photocurable resin, and the thickness of the partially cured sealing resin is a film thickness determined by the emission intensity distribution of the LED element. It is characterized by being.

  In addition, the manufacturing method of the LED light source device of the present invention is characterized in that the step of curing the uncured sealing resin is performed by simultaneously causing a plurality of LED elements arranged on the collective substrate to self-emit. To do.

  Since the manufacturing method of the LED light source device of the present invention does not include the step of removing the resin containing the phosphor in the uncured portion unlike the conventional manufacturing method, the uncured resin adheres to the base material or the electrode. It is possible to prevent the occurrence of color unevenness due to dirt caused by the adhesion of the phosphors contained in the uncured resin. In addition, the members can be used effectively without wasting resin materials or phosphors.

  In addition, according to the present invention, the phosphor layer can be formed with a substantially uniform thickness with respect to the LED element. For this reason, the probability that the light beam from the LED element is incident on the phosphor element in any direction. The same is true. Therefore, the LED light source device manufactured by the present invention is an LED light source device without color unevenness.

  Further, in the present invention, the LED element is self-luminous, the resin around the LED element is cured by thermal energy or light energy when the LED element is caused to emit light, and the phosphor is settled thereon to form a phosphor layer. The phosphor layer can be formed without being affected by the wire that electrically connects the LED element and the substrate, and is a manufacturing method suitable for mounting by wire bonding.

In addition, a plurality of LED elements are mounted on a collective substrate, and a large number of phosphor layers are simultaneously formed around each LED element by simultaneously emitting a plurality of LED elements and then allowing the phosphors to settle. Therefore, LED light source devices with little color unevenness and stable characteristics can be manufactured in large quantities in a lump.

It is a flowchart which shows the process of the manufacturing method of the LED light source device concerning Example 1 of this invention. It is the top view and sectional drawing which show the manufacturing process of the aggregate substrate concerning Example 1 of this invention. It is the top view and enlarged side view which show the mounting process of the LED element concerning Example 1 of this invention. It is a circuit diagram which shows the connection of the LED element formed by the mounting process concerning Example 1 of this invention. It is an expanded sectional view which shows the potting process which apply | coats the resin member concerning Example 1 of this invention. It is the top view and enlarged sectional view which show the partial hardening process of the resin member concerning Example 1 of this invention. It is typical sectional drawing which shows the partial hardening part of resin concerning Example 1 of this invention. It is typical sectional drawing which shows the sedimentation process of the fluorescent substance concerning Example 1 of this invention. It is a perspective view which shows the fluorescent substance layer formed on the aggregate substrate concerning Example 1 of this invention. It is a perspective view which shows the cutting process which isolate | separates many LED light source devices completed on the aggregate substrate concerning Example 1 of this invention, and the single LED light source device completed by the cutting process. It is sectional drawing which shows the LED light source device concerning Example 1 of this invention. It is a flowchart which shows the process of the manufacturing method of the LED light source device concerning Example 2 of this invention. It is sectional drawing which shows the process of settling the fluorescent substance concerning Example 2 of this invention. It is sectional drawing which shows the partial hardening process of the resin member concerning Example 2 of this invention. It is typical sectional drawing which shows the partial hardening part of resin concerning Example 2 of this invention. It is typical sectional drawing which shows the sedimentation process of the fluorescent substance concerning Example 2 of this invention. It is sectional drawing which shows the LED light source device concerning Example 2 of this invention. It is sectional drawing which shows the path | route length of the emitted light of the conventional LED light source device.

  Hereinafter, specific embodiments of the LED light source device manufacturing method of the present invention and modifications thereof will be described in detail with reference to the drawings.

[Description of Manufacturing Method of LED Light Source Device of Example 1: FIG. 1]
The outline of the manufacturing method of the LED light source device in a present Example is demonstrated with reference to FIG. FIG. 1 is a flowchart showing an overall outline of the manufacturing process of the LED light source device according to the first embodiment of the present invention. Details of each manufacturing process will be described later.

  As shown in FIG. 1, first, a collective substrate manufacturing process for manufacturing a collective substrate for mounting a plurality of LED elements is performed (process M1).

  Next, an LED element mounting step is performed in which a plurality of LED elements are fixed on the completed aggregate substrate, and each LED element is electrically connected to the electrode portion of the aggregate substrate by wire bonding or the like (process M2).

Next, a potting step of covering the plurality of LED elements mounted on the aggregate substrate with the resin member containing the phosphor is performed (step M3). In addition, the resin member in a present Example shall be photocurable resin.

  Next, a resin is partially cured by causing a predetermined current to flow through each of the mounted LED elements to cause the LED elements to emit light and partially curing the resin member around the LED elements (process M4).

  Next, a phosphor sedimentation step is performed in which the phosphor contained in the resin member of the uncured portion is precipitated in the resin portion of the uncured portion (Step M5).

  Next, a resin curing step of curing the entire resin including the uncured resin is performed (step M6).

  Finally, the collective substrate sealed with the resin member is cut at a predetermined cutting position to complete a plurality of LED light source devices (step M7).

[Description of Assembly Substrate Manufacturing Process (Process M1) of Example 1: FIG. 2]
Next, details of the manufacturing process of the collective substrate of Example 1 of the present invention will be described with reference to FIG. FIG. 2 shows a collective substrate of the LED light source device manufactured according to the present invention, FIG. 2 (a) is a plan view of the collective substrate, and FIG. 2 (b) is a section line AA ′ of FIG. 2 (a). It is sectional drawing of the collective substrate cut | disconnected by.

  First, as shown in FIGS. 2 (a) and 2 (b), electrodes 2a to 2e are arranged on a substrate 1 made of an insulating material such as an epoxy material, and the electrodes 2a to 2e pass through through holes 3a to 3e, respectively. Thus, the front surface side and the back surface side of the substrate 1 are connected. Here, as shown in the figure, the electrode 2a is vertically arranged on the substrate 1 at a predetermined interval on the substrate, and the electrode 2b is adjacent to the electrode 2a. To form. Similarly, the electrodes 2c to 2e are formed vertically on the substrate 1 at predetermined intervals on the drawing.

  As a result, the electrodes 2a to 2e are formed in a matrix on the substrate 1. In FIG. 2, a total of 30 electrodes 2a to 2e are formed in 5 rows in the horizontal direction on the drawing and 6 rows in the vertical direction on the drawing. However, the number of the electrodes 2a to 2e is not limited to this number, and may be formed in an arbitrary number depending on the size of the substrate 1, the electrode shape, or the like. Note that the electrodes 2a to 2e are formed on the back surface of the substrate 1 in the same manner as the electrodes 2a to 2e on the front surface.

  Here, the through hole 3a is formed at a position closer to the left side in the drawing within the region of the electrode 2a, and electrically connects the electrode 2a on the front surface of the substrate 1 and the electrode 2a on the back surface. The through hole 3b is formed at a position closer to the left side in the drawing within the region of the electrode 2b, and electrically connects the electrode 2b on the front surface of the substrate 1 and the electrode 2b on the back surface. Similarly, the through holes 3c to 3e are formed at positions on the left side in the drawing within the respective regions of the electrodes 2c to 2e, and the electrodes 2c to 2e on the front surface of the substrate 1 and the electrodes 2c to 2e on the back surface are respectively electrically connected. Connect.

  Reference numerals 11 and 12 denote electrode terminals, which are formed in a line shape in contact with the electrodes 2a and 2e at the left and right ends on the substrate 1 in the drawing. Here, since the electrode terminal 11 is formed in contact with the end of the electrode 2 a, all the electrodes 2 a are electrically connected by the electrode terminal 11. Further, since the electrode terminals 12 are formed in contact with the end portions of the electrodes 2e, all the electrodes 2e are electrically connected by the electrode terminals 12. The electrode terminals 11 and 12 are used as terminals for supplying current to the LED elements mounted on the collective substrate, and details will be described later. In addition, the electrode pattern of the collective substrate shown in FIG. 2 shows an example, and the configuration of the electrode pattern is not limited to this.

[Description of LED Element Mounting Step (Step M2) of Example 1: FIGS. 3 and 4]
Next, details of the mounting process of the LED element according to the first embodiment of the present invention will be described with reference to FIGS. FIG. 3 shows a mounting process of the LED element of Example 1 of the present invention, FIG. 3 (a) is a plan view of the collective substrate on which the LED element is mounted, and FIG. 3 (b) is a mounting of the LED element. It is an enlarged side view of an aggregate substrate.

  As shown in FIGS. 3 (a) and 3 (b), first, as a mounting process of the LED element, the LED element is placed in a region on the substantially right half of the electrodes 2a to 2d (that is, a region other than the through holes 3a to 3d). 4 is fixed and mounted with an adhesive or the like (not shown). That is, as shown in the figure, six electrodes 2a to 2d are formed vertically, so that a total of 24 LED elements 4 in six rows and four columns are mounted on one collective substrate. It is not mounted on the electrode 2e at the right end in the drawing. Here, in Example 1, the LED element 4 is a blue diode having an emission wavelength of about 450 nm as an example.

  Next, the mounted LED element 4 is wire-bonded by a wire bonder (not shown), and is electrically connected to the electrodes 2a to 2e by wires 5a and 5b made of gold fine wires as connection members. That is, as illustrated, the anode (not shown) of the LED element 4 mounted on the electrode 2a is electrically connected to the electrode 2a by the wire 5a, and the cathode (not shown) of the LED element 4 is connected by the wire 5b. It is electrically connected to the adjacent electrode 2b.

  Similarly, the anode (not shown) of the LED element 4 mounted on the electrode 2b is electrically connected to the electrode 2b by the wire 5a, and the cathode (not shown) of the LED element 4 is adjacent to the side by the wire 5b. It is electrically connected to the electrode 2c. Similarly, the LED element 4 mounted on the electrode 2c and the LED element 4 mounted on the electrode 2d are also electrically connected to the respective electrodes by wires 5a and 5b.

  As a result, the four rows of LED elements 4 in the drawing are connected in series between the electrode terminals 11 and 12 via the electrodes 2a to 2e. Similarly, since the LED elements 4 are mounted in six rows in the vertical direction in the drawing, the LED elements 4 in all six rows are also connected to the electrodes 2a to 2e by wires 5a and 5b. As a result, a circuit composed of a total of 24 LED elements 4 is formed, which is composed of six parallel connection groups in which the four LED elements 4 between the electrode terminals 11 and 12 are connected in series.

  FIG. 4 shows a connection circuit of the LED elements 4 mounted on the collective substrate described with reference to FIG. Here, as described above, the four LED elements 4 are connected in series as one group, and further, since these six groups are connected in parallel, a predetermined positive voltage is applied to the electrode terminal 11, When a zero voltage is applied to the electrode terminal 12, a drive current flows from the anode to the cathode of all the LED elements 4, and all the LED elements 4 can be turned on.

  The connection of the LED elements 4 is not limited to the illustrated example, and all the LED elements 4 can be connected in series by devising the connection pattern of the electrode terminals 11 and 12. Here, if all the LED elements 4 are connected in series, the current value flowing through all the LED elements 4 can be made the same. Therefore, in the resin curing step described later, the resin curing conditions for the individual LED elements 4 are matched. However, even in the case of the series-parallel connection as in the first embodiment, the characteristics of the LED elements 4 are averaged within the group, so that almost the same curing conditions can be achieved.

[Description of Potting Step (Step M3) of Resin Member of Example 1: FIG. 5]
Next, details of the potting process of the first embodiment of the present invention will be described with reference to FIG. FIG. 5 is an enlarged cross-sectional view for explaining a potting process according to the first embodiment of the present invention. As shown in FIG. 5, a resin member 20 containing a phosphor 7 is applied by a dispenser 13 as a sealing resin that covers all the LED elements 4 mounted on the surface of the collective substrate.

  Here, the phosphor 7 is a phosphor that converts the wavelength of blue light from the LED element 4 into yellow light, and the resin member 20 is made of a thermosetting silicone resin that is cured by thermal energy. In addition, it is good to discharge resin, moving the dispenser 13 with respect to an aggregate board so that the resin member 20 may be apply | coated to the whole surface of an aggregate board surface, and may cover all the LED elements 4. FIG. Thereby, it is possible to cover all the LED elements 4 on the collective substrate.

[Description of Resin Partial Curing Process (Process M4) of Resin Member of Example 1: FIGS. 6 and 7]
Next, details of the resin partial curing step of Example 1 of the present invention will be described with reference to FIGS. FIG. 6 shows the resin curing process of Example 1 of the present invention, and FIG. 6 (a) is a plan view showing that a DC power source is connected to the aggregate substrate coated with the resin member 20, and FIG. 6 (b). FIG. 4 is an enlarged cross-sectional view schematically showing that the LED element 4 on the aggregate substrate emits light spontaneously to cure the resin member 20. FIG. 7 is a cross-sectional view after the resin partial curing step.

  As shown in FIG. 6A, a DC power source 15 that outputs a predetermined voltage is connected to the electrode terminals 11 and 12 of the aggregate substrate on which the resin member 20 is applied on the entire surface. That is, the plus line 16a of the DC power source 15 is connected to the electrode terminal 11 connected to the anode of the LED element 4 via the electrode 2a via the switch SW, and the electrode connected to the cathode of the LED element 4 via the electrode 2e. The negative line 16 b of the DC power supply 15 is connected to the terminal 12. The switch SW has a function of turning on / off the current from the DC power supply 15 and controls the LED element 4 so as to supply a drive current for a predetermined time.

  Next, in FIG. 6B, when the aforementioned switch SW is turned on for a predetermined time, the drive current is supplied to all the LED elements 4 on the collective substrate via the wires 5a and 5b, and the LED elements 4 are Light is emitted and light energy 14 is emitted accordingly. Then, since the resin member 20 that covers the LED element 4 is a photocurable resin as described above, curing starts from the region of the resin member 20 near the LED element 4.

  By driving the LED element 4 for a predetermined time as described above, the first of the thickness corresponding to the light amount distribution around the LED element 4 as shown in FIG. 7 according to the magnitude of the light energy 14. A phosphor layer 6a is formed. The first phosphor layer 6 a has a substantially dome shape, and the resin member 20 includes the phosphor 7. In FIG. 6 and FIG. 7, the phosphor 7 contained in the resin member 20 and the first phosphor layer 6a is omitted for easy viewing of the drawings.

[Description of Phosphor Sedimentation Step (Step M5) in Example 1: FIG. 8]
Next, details of the phosphor sedimentation step of Example 1 of the present invention will be described with reference to FIG. FIG. 8A is a schematic cross-sectional view showing the phosphor sedimentation step of Example 1 of the present invention, and FIG. 8B is a schematic cross-sectional view after the phosphor sedimentation step.

The phosphor 7 contained in the resin member 20 can move through the resin member 20 because the resin member 20 has fluidity. Here, the specific gravity of the resin in the resin member 20 is about 1.0 g / cm ³ , and the specific gravity of the phosphor 7 is about 4.4 g / cm ³ . Therefore, if the resin member 20 is left in an uncured state, as shown in FIG. 8A, the phosphor 7 moves downward in the figure, that is, sinks. As another method for precipitating the phosphor 7, a method of heating the resin member 20 to a temperature at which the viscosity of the resin is lowered to promote sedimentation of the phosphor 7, or the resin member 2
For example, when 0 is in an uncured state, the phosphor 7 is forced to settle by centrifugation. At this time, since the substantially dome-shaped first phosphor layer 6a exists on the LED element 4, the phosphor 7 is deposited on the first phosphor layer 6a, as shown in FIG. 8B. Then, the second phosphor layer 6b including the same phosphor as the phosphor 7 included in the first phosphor layer 6a is formed. In this way, the transparent resin layer 6c can be formed on the phosphor layer 6b by allowing the phosphor 7 to settle. Therefore, most of the phosphors 7 in the resin member 20 potted in the potting process are contained in the second phosphor layer 6b, and the concentration of the phosphor 7 in the second phosphor layer 6b is as follows. Compared with the concentration of the phosphor 7 in the first phosphor layer 6a, the concentration becomes sufficiently high. In FIG. 8B, the phosphor 7 is not shown for easy viewing of the drawing.

[Description of Resin Curing Step of Example 1 (Step M6): FIGS. 8B and 9]
Next, details of the resin curing step of Example 1 of the present invention will be described with reference to FIGS. FIG. 9 is a perspective view for explaining the resin curing step of Example 1 of the present invention.
As shown in FIG. 8B, after the first phosphor layer 6a, the second phosphor layer 6b, and the transparent resin layer 6c are formed on the substrate 1, the LED element 4 emits light by self-light emission. By performing, the whole resin part (the 2nd fluorescent substance layer 6b and the transparent resin layer 6c) is hardened completely. In addition, you may perform the hardening process of the whole resin part which consists of this 2nd fluorescent substance layer 6b and the transparent resin layer 6c with the light from the outside. Through this process, as shown in FIG. 9, the LED element 4, the wires 5a and 5b, and the entire surface of the substrate 1 are sealed, electrically and mechanically protected, and an LED light source device having excellent environmental resistance is obtained. Can be manufactured. In FIG. 9, the first phosphor layer, the phosphor, and the wires are not shown in order to make the drawing easy to see.

[Description of Cutting Process (Process M7) of Example 1: FIG. 10]
Next, the cutting process of Example 1 of the present invention will be described with reference to FIG. FIG. 10 shows a cutting process according to the first embodiment of the present invention, and FIG. 10A is a perspective view showing a part of the collective substrate for explaining a cutting process for separating a large number of LED light source devices completed on the collective board. FIG. 10B is a perspective view showing an example of a single LED light source device completed by the cutting process.

  As shown in FIG. 10A, the collective substrate sealed by the resin member is cut and separated by a dicing device (not shown) or the like along predetermined cutting lines X and Y, and a plurality of LED light source devices are obtained. Complete. The cutting line X is set between the electrodes 2a to 2e on the substrate 1, and the cutting line Y is set to pass through the centers of the through holes 3a to 3e on the collective substrate.

  As shown in FIG. 10B, in the completed LED light source device 30, electrodes 2a and 2b are formed on the substrate 1 cut and separated from the collective substrate. The electrodes 2a and 2b include through holes 3a and 3b cut at the center, and are electrically connected to the electrodes 2a and 2b (not shown) on the back surface of the substrate 1 through the through holes 3a and 3b. Further, the LED element 4 is mounted on the surface of the electrode 2a, and the LED element 4 is electrically connected to the electrodes 2a and 2b by the two wires 5a and 5b as described above.

  With this connection, when a drive voltage is supplied to the electrodes 2a and 2b from the outside, a drive current flows to the LED element 4 via the wires 5a and 5b, and the LED element 4 emits light. In the completed LED light source device 30, the electrodes 2a and 2b become the electrodes 2b and 2c, the electrodes 2c and 2d, or the electrodes 2d and 2e depending on the position separated from the collective substrate. Similarly, the through holes 3a and 3b become through holes 3b and 3c, through holes 3c and 3d, or through holes 3d and 3e depending on the positions separated from the collective substrate. Of course, the LED light source device 30 is the same. Thus, this invention can manufacture many LED light source devices collectively. In FIG. 10, the first phosphor layer 6a and the phosphor 7 are not shown in order to make the drawing easy to see.

[Description of Configuration and Operation of LED Light Source Device Manufactured by Example 1: FIG. 11]
The configuration of the LED light source device manufactured according to Example 1 of the present invention will be described with reference to FIG. In FIG. 11, the LED light source device 30 manufactured in the present embodiment has electrodes 2a and 2b arranged on a substrate 1, and the electrodes 2a and 2b are on the surface side of the substrate 1 through through holes 3a and 3b, respectively. And the back side is connected. The substrate 1 is formed of an insulating substrate such as epoxy, and the electrodes 2a and 2b are made of conductive copper foil or the like. The LED element 4 is mounted on a substrate and is electrically connected to the electrodes 2a and 2b by wires 5a and 5b. In this embodiment, it is assumed that the LED element 4 is mounted on the electrode 2a. In addition, as a method of electrically connecting the LED element 4 and the electrodes 2a and 2b, flip-chip mounting can be used without using the wires 5a and 5b.

  Moreover, the LED element 4 is coat | covered with the 1st fluorescent substance layer 6a, the 2nd fluorescent substance layer 6b, and the transparent resin layer 6c in order from the LED element 4 side. The resin material in the present embodiment is a photo-curable resin, and the first phosphor layer 6a covers the periphery of the LED element 4 with a thickness determined by the light energy generated when the LED element 4 emits light. Is formed. The second phosphor layer 6b is formed by the phosphor 7 being settled on the first phosphor layer 6a, and is a substantially uniform film on the first phosphor layer 6a and the substrate 1. It is formed with a thickness. Further, the transparent resin layer 6c is formed to be transparent as the phosphor 7 settles in the second phosphor layer 6b. Here, as described above, the concentration of the phosphor 7 in the second phosphor layer 6b is sufficiently higher than the concentration of the phosphor 7 in the first phosphor layer 6a. Yes.

  Here, in the present embodiment, the LED element 4 is a blue light emitting LED element, and the phosphor 7 is a phosphor that absorbs blue light such as YAG and emits yellow light. A part of the light enters the phosphor 7 in the first phosphor layer 6a or the second phosphor layer 6b, and is wavelength-converted into yellow light. Therefore, the light emitted from the LED light source device 30 is a mixture of the blue light 10B and the yellow light 10Y, and the LED light source device 30 emits pseudo white light 10W.

  At this time, the concentration of the phosphor 7 in the first phosphor layer 6a and the second phosphor layer 6b is sufficiently higher in the second phosphor layer 6b as described above. The wavelength conversion into light is mainly caused by the second phosphor layer 6b formed with a uniform film thickness. For this reason, the blue light emitted from the LED element 4 passes through the phosphor layer having a uniform film thickness in any direction, and substantially the same ratio when passing through the second phosphor layer 6b. Is converted to yellow light. Therefore, the light emitted from the LED light source device 30 has the same ratio of blue light and yellow light in any direction, and the color unevenness of the LED light source device 30 is very small.

  Moreover, in the manufacturing method of the LED light source device of Example 1 of this invention, since the process of removing uncured resin containing the fluorescent substance 7 is not included, adhesion of uncured resin to the substrate 1 and the electrodes 2a to 2e. It is possible to prevent the occurrence of stains due to, for example, color unevenness due to adhesion of the phosphor 7 contained in the uncured resin. Furthermore, it is possible to effectively utilize a particularly expensive phosphor without wasting the resin member 20 or the phosphor 7.

  Moreover, in the manufacturing method of the LED light source device of Example 1 of this invention, the LED element 4 and the electrode 2a, 2b of a board | substrate are electrically connected by hardening the resin around LED element 4 by self-light-emission of LED element 4. Both the first phosphor layer 6 a and the second phosphor layer 6 b can be formed even in the gap between the wires 5 a, 5 b and the substrate 1 without being affected by the wires 5 a, 5 b connected to. Therefore, the directivity and color mixing of the pseudo white light 10W emitted from the LED light source device 30 is good, and the color unevenness can be reduced. In this way, the present invention is suitable for an LED light source device mounted with wire bonding.

  Further, according to the first embodiment of the present invention, a large number of LED elements 4 are mounted on a collective substrate, and a large number of LED elements 4 are self-luminous at the same time. Thick phosphor layers can be formed at once. Therefore, a plurality of LED light source devices 30 with little variation in characteristics such as color unevenness can be manufactured in a large amount in a lump.

  In addition, in the manufacturing method of the LED light source device 30 of Example 1 of this invention, although photocuring resin is used, using thermosetting resin and using the thermal energy produced when the LED element 4 is made to light-emit. It can also be formed. As in the case of using the ultraviolet curable resin, the region of the resin member 20 in the vicinity of the LED element 4 is partially cured by the heat energy generated in the LED element 4, The phosphor layer 6a can be formed with a film thickness corresponding to this thermal energy. In this way, it is possible to manufacture an LED light source device that has little color unevenness and that effectively uses the phosphor 7.

[Description of Manufacturing Method of LED Light Source Device of Example 2: FIG. 12]
Next, the outline of the manufacturing method of the LED light source device in a present Example is demonstrated with reference to FIG. FIG. 12 is a flowchart showing an overall outline of the manufacturing process of the LED light source device according to the second embodiment of the present invention. Details of each manufacturing process will be described later.

  In FIG. 12, the collective substrate manufacturing process (process M1), the LED element mounting process (process M2), and the potting process (process M3) are performed in the same manner as in the first embodiment.

  Next, the aggregate substrate that has been subjected to the potting step is disposed in the upside down direction, and the phosphor is allowed to settle toward the surface direction of the resin member that is opposite to the LED element (step M8).

  Next, a resin partial curing step is performed in which a predetermined current is supplied to each of the mounted LED elements to cause the LED elements to emit light and a resin member around the LED elements is partially cured (process M4 ').

  Next, the aggregate substrate is returned to the original direction, and a phosphor sedimentation step is performed in which the phosphor contained in the resin member of the uncured portion is precipitated in the resin portion of the uncured portion (step M5 ').

  Finally, similarly to Example 1, a resin curing step (step M6) and a cutting step (step M7) are performed to complete a plurality of LED light source devices.

[Description of Manufacturing Process of Example 2: FIG. 13]
Next, details of a series of steps in Embodiment 2 of the present invention will be described with reference to FIG. FIG. 13 is a schematic cross-sectional view showing the phosphor after the reverse sedimentation step.

First, similarly to Example 1, after performing the collective substrate manufacturing process (process M1), the LED element mounting process (process M2, FIG. 3), and the potting process (M3), the phosphor reverse sedimentation process (M8) is performed. .
In this potting process (M3, FIG. 5), the film 17 is arranged on the potted resin member 20, and the up and down direction is turned over in the opposite direction to that in the potting process. Then, as shown in FIG. 13, since the specific gravity of the phosphor 7 in the resin member 20 is larger than that of the resin member 20, the phosphor 7 sinks downward in the figure. As another method for precipitating the phosphor 7, a method of heating the resin 7 to a temperature at which the viscosity of the resin is lowered to accelerate the sedimentation of the phosphor 7, and when the resin member 20 is in an uncured state, it is subjected to centrifugation. There is a method of forcibly precipitating the phosphor 7. By this process, the upper part in the resin member 20, that is, the periphery of the LED element 4 is only the transparent resin not including the phosphor 7. Here, the film 17 is for preventing the resin member 20 from flowing down in an inverted state, and may be another member as long as it is a member that acts in the same manner.

[Description of Resin Partial Curing Step of Example 2 (Step M4 ′): FIGS. 14 and 15]
Next, details of the resin partial curing step of Example 2 of the present invention will be described with reference to FIGS. FIG. 14 is an enlarged sectional view schematically showing that the LED element 4 on the collective substrate spontaneously emits light and cures the resin member, and FIG. 15 shows the resin partial curing process of Example 2 of the present invention. It is sectional drawing which shows a partial hardening process.

  As in the first embodiment, when a current is supplied to the LED element 4 for a predetermined time, the LED element 4 emits light as shown in FIG. Thereby, since the resin member 20 which coat | covers the LED element 4 is a photocurable resin as mentioned above, hardening starts from the area | region of the resin member 20 of the LED element 4 vicinity.

  At this time, since the periphery of the LED element 4 is made of a transparent resin in the phosphor reverse sedimentation process (process M8), the light energy 14 is increased by driving the LED element 4 for a predetermined time as described above. Accordingly, as shown in FIG. 15, a substantially dome-shaped first transparent resin layer 8 a is formed around the LED element 4.

[Description of Phosphor Precipitation Step of Example 2 (Step M5 ′): FIG. 16]
Next, details of the phosphor sedimentation step of Example 1 of the present invention will be described with reference to FIG. FIG. 16A is a schematic cross-sectional view showing the phosphor sedimentation step of Example 2 of the present invention, and FIG. 16B is a schematic side view after the phosphor sedimentation step.

  As shown in FIG. 16A, the vertical direction of the substrate is returned to the same direction as in the potting step after the resin partial curing step. At this time, since the phosphor 7 contained in the resin member 20 has the fluidity and the specific gravity is larger than that of the resin member 20, the resin member 20 is moved downward in the figure (first transparent resin). Moves to the surface of the layer 8a), that is, settles. As another method for precipitating the phosphor 7 described above, it is heated to a temperature at which the viscosity of the resin is lowered to promote the sedimentation of the phosphor 7, or is subjected to centrifugation or the like when the resin member 20 is in an uncured state. For example, there is a method of forcibly precipitating the phosphor 7. At this time, since the substantially transparent dome-shaped first transparent resin layer 8a exists on the LED element 4, the phosphor 7 is deposited on the first transparent resin layer 8a, as shown in FIG. The phosphor layer 8b is formed, and the second transparent resin layer 8c is formed on the phosphor layer 8b. Therefore, the phosphor layer 8b sandwiched between the transparent resin layers is formed by this step, and the film thickness of the phosphor layer 8b is almost uniform at any location. In FIG. 16B, the phosphor 7 is not shown for easy viewing of the drawing.

  Next, the resin curing step (M6) and the cutting step (M7) of Example 2 of the present invention are performed. Since these steps are the same as those in Example 1, detailed description thereof is omitted here. And many LED light source devices can be manufactured collectively by the above series of processes.

[Description of Configuration and Operation of LED Light Source Device Manufactured in Example 2: FIG. 17]
Next, the configuration of the LED light source device manufactured according to Example 2 of the present invention will be described with reference to FIG.
As shown in FIG. 17, in the LED light source device 31 manufactured in the above-described process, the electrodes 2a and 2b are arranged on the substrate 1, the LED element 4 is mounted on the electrodes 2a and 2b, and the wire 5a. 5b and electrically connected to the electrodes 2a and 2b.

The LED element 4 includes a first transparent resin layer 8a and a phosphor layer 8b in order from the LED element 4 side.
The second transparent resin layer 8c is covered. The resin material in the present embodiment is a photocurable resin, and the first transparent resin layer 8a covers the periphery of the LED element 4 with a thickness determined by the light energy generated when the LED element 4 emits light. Is formed. The phosphor layer 8b is formed when the phosphor 7 settles on the first transparent resin layer 8a, and is formed with a substantially uniform film thickness on the first transparent resin layer 8a and the substrate 1. Has been. The second transparent resin layer 8c is formed by the phosphor 7 being settled in the phosphor layer 8b.

  Here, in this embodiment, the LED element 4 is a blue light emitting LED element, and the phosphor 7 is a phosphor that absorbs blue light such as YAG and emits yellow light. Is incident on the phosphor 7 in the phosphor layer 8b and wavelength-converted to yellow light. Therefore, the light emitted from the LED light source device 31 is a mixture of the blue light 10B and the yellow light 10Y, and the LED light source device 31 emits pseudo white light 10W.

  At this time, since the phosphor layer 8b is formed with a substantially uniform thickness with respect to the LED element 4, the blue light emitted from the LED element 4 has a uniform thickness in any direction. When the light passes through the phosphor layer 8b, it is converted into yellow light at substantially the same rate. Therefore, the light emitted from the LED light source device 31 has the same proportion of blue light and yellow light in any direction, and the color unevenness of the LED light source device 31 is very small.

  Thus, since the manufacturing method of the LED light source device of Example 2 of the present invention does not include the step of removing the uncured resin containing the phosphor as in Example 1, the substrate and the electrode of the uncured resin It is possible to prevent the occurrence of stains due to adhesion to the surface and uneven color due to the adhesion of the phosphor contained in the uncured resin. Further, since the removal step is not included, it is possible to effectively use the resin or the expensive phosphor without wasting it.

  Moreover, in the manufacturing method of the LED light source device of Example 2 of this invention, although photocuring resin is used, it is not restricted to this, When using thermosetting resin and making LED element 4 light-emit, Similarly, by using the generated thermal energy, the region of the resin member 20 in the vicinity of the LED element 4 can be partially cured, and an LED light source device with less color unevenness can be manufactured.

  Moreover, although the LED light source device manufactured by the present invention has been described on the premise that the white light is emitted by the blue LED element + YAG in the embodiments, the emitted light of the LED light source device by the manufacturing method of the present invention is limited to this. The LED light source device that emits light other than white or a combination of other LED elements and phosphors may be used. Moreover, the LED light source device manufactured by this invention is not limited to the mounting by wire bonding, For example, it is applied also to the LED light source device by flip-chip mounting etc. The flowcharts, front views, cross-sectional views, and the like shown in the embodiments of the present invention are not limited to these, and may be arbitrarily changed as long as they satisfy the gist of the present invention.

  The manufacturing method of the LED light source device of the present invention can provide a white LED light source device with good color mixing and little color unevenness. Therefore, a white light source device for backlights such as liquid crystal color televisions and portable electronic devices, It is suitable as a method for manufacturing a white light source device.

DESCRIPTION OF SYMBOLS 1 Board | substrate 2a-2e Electrode 3a-3e Through-hole 4 LED element 5a, 5b Wire 6a 1st fluorescent substance layer 6b 2nd fluorescent substance layer 6c Transparent resin layer 7 Phosphor 8a 1st transparent resin layer 8b Phosphor layer 8c Second transparent resin layer 10B Blue light 10Y Yellow light 10W White light 11, 12 Electrode terminal 13 Dispenser 14 Light energy 17 Film 20 Resin member 30, 31 LED light source device

Claims (6)

In the manufacturing method of the LED light source device that covers the LED element and cures and forms the sealing resin containing the phosphor,
A step of coating the LED element with a sealing resin containing the phosphor;
A step of partially curing the sealing resin around the LED element by causing the LED element to self-emit;
A step of precipitating the phosphor contained in the uncured sealing resin;
Curing the uncured sealing resin after allowing the phosphor to settle;
The manufacturing method of the LED light source device characterized by having. The method of manufacturing an LED light source device according to claim 1, wherein the step of curing the uncured sealing resin is performed by causing the LED element to emit light. By supplying a current to the LED element through a wire electrically connecting the electrode part provided on the substrate and the LED element, the LED element is caused to self-emit, and the sealing resin is partially cured. The manufacturing method of the LED light source device of Claim 1 or 2 characterized by the above-mentioned. The sealing resin is a thermosetting resin,
4. The LED according to claim 1, wherein the thickness of the partially cured sealing resin is a film thickness determined by an amount of heat when the LED element is caused to emit light. 5. Manufacturing method of light source device. The sealing resin is a photocurable resin,
4. The LED light source device according to claim 1, wherein the thickness of the partially cured sealing resin is a film thickness determined by a light emission intensity distribution of the LED element. 5. Production method. The step of partially curing the sealing resin is performed by simultaneously causing a plurality of the LED elements arranged on a collective substrate to emit light simultaneously. The manufacturing method of the LED light source device of description.

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