JPS6457965A - Production of spiral part by spray forming of aluminum alloy - Google Patents
Production of spiral part by spray forming of aluminum alloyInfo
- Publication number
- JPS6457965A JPS6457965A JP21620987A JP21620987A JPS6457965A JP S6457965 A JPS6457965 A JP S6457965A JP 21620987 A JP21620987 A JP 21620987A JP 21620987 A JP21620987 A JP 21620987A JP S6457965 A JPS6457965 A JP S6457965A
- Authority
- JP
- Japan
- Prior art keywords
- aluminum alloy
- spraying
- preform
- molten aluminum
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21620987A JPS6457965A (en) | 1987-08-27 | 1987-08-27 | Production of spiral part by spray forming of aluminum alloy |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21620987A JPS6457965A (en) | 1987-08-27 | 1987-08-27 | Production of spiral part by spray forming of aluminum alloy |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6457965A true JPS6457965A (en) | 1989-03-06 |
Family
ID=16684985
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21620987A Pending JPS6457965A (en) | 1987-08-27 | 1987-08-27 | Production of spiral part by spray forming of aluminum alloy |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6457965A (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5022455A (en) * | 1989-07-31 | 1991-06-11 | Sumitomo Electric Industries, Ltd. | Method of producing aluminum base alloy containing silicon |
JP2009149997A (ja) * | 1995-10-12 | 2009-07-09 | Toshiba Corp | スパッタターゲットの製造方法 |
USRE45481E1 (en) | 1995-10-12 | 2015-04-21 | Kabushiki Kaisha Toshiba | Interconnector line of thin film, sputter target for forming the wiring film and electronic component using the same |
CN108788102A (zh) * | 2017-06-07 | 2018-11-13 | 上海交通大学 | 增材法快速凝固全等轴晶铝合金铸锭的制备方法及装置 |
WO2020093276A1 (zh) * | 2018-11-07 | 2020-05-14 | 上海交通大学 | 增材法快速凝固全等轴晶铝合金铸锭的制备方法及装置 |
-
1987
- 1987-08-27 JP JP21620987A patent/JPS6457965A/ja active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5022455A (en) * | 1989-07-31 | 1991-06-11 | Sumitomo Electric Industries, Ltd. | Method of producing aluminum base alloy containing silicon |
JP2009149997A (ja) * | 1995-10-12 | 2009-07-09 | Toshiba Corp | スパッタターゲットの製造方法 |
USRE45481E1 (en) | 1995-10-12 | 2015-04-21 | Kabushiki Kaisha Toshiba | Interconnector line of thin film, sputter target for forming the wiring film and electronic component using the same |
CN108788102A (zh) * | 2017-06-07 | 2018-11-13 | 上海交通大学 | 增材法快速凝固全等轴晶铝合金铸锭的制备方法及装置 |
WO2020093276A1 (zh) * | 2018-11-07 | 2020-05-14 | 上海交通大学 | 增材法快速凝固全等轴晶铝合金铸锭的制备方法及装置 |
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