JPS6453497A - Multilayer printed wiring board and manufacture thereof - Google Patents

Multilayer printed wiring board and manufacture thereof

Info

Publication number
JPS6453497A
JPS6453497A JP20994187A JP20994187A JPS6453497A JP S6453497 A JPS6453497 A JP S6453497A JP 20994187 A JP20994187 A JP 20994187A JP 20994187 A JP20994187 A JP 20994187A JP S6453497 A JPS6453497 A JP S6453497A
Authority
JP
Japan
Prior art keywords
oxidizer
filler
insulating layer
wiring board
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP20994187A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0533840B2 (enrdf_load_stackoverflow
Inventor
Motoo Asai
Shigeki Matsuhisa
Toshihiko Yasue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP20994187A priority Critical patent/JPS6453497A/ja
Publication of JPS6453497A publication Critical patent/JPS6453497A/ja
Publication of JPH0533840B2 publication Critical patent/JPH0533840B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0773—Dissolving the filler without dissolving the matrix material; Dissolving the matrix material without dissolving the filler

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP20994187A 1987-08-24 1987-08-24 Multilayer printed wiring board and manufacture thereof Granted JPS6453497A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20994187A JPS6453497A (en) 1987-08-24 1987-08-24 Multilayer printed wiring board and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20994187A JPS6453497A (en) 1987-08-24 1987-08-24 Multilayer printed wiring board and manufacture thereof

Publications (2)

Publication Number Publication Date
JPS6453497A true JPS6453497A (en) 1989-03-01
JPH0533840B2 JPH0533840B2 (enrdf_load_stackoverflow) 1993-05-20

Family

ID=16581197

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20994187A Granted JPS6453497A (en) 1987-08-24 1987-08-24 Multilayer printed wiring board and manufacture thereof

Country Status (1)

Country Link
JP (1) JPS6453497A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04250607A (ja) * 1991-01-25 1992-09-07 Taiyo Yuden Co Ltd チップ状電子部品
JP2013135134A (ja) * 2011-12-27 2013-07-08 Kyocera Corp 配線基板およびその実装構造体
JP2023151281A (ja) * 2022-03-31 2023-10-16 Tdk株式会社 圧電素子
JP2023151284A (ja) * 2022-03-31 2023-10-16 Tdk株式会社 圧電素子

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04250607A (ja) * 1991-01-25 1992-09-07 Taiyo Yuden Co Ltd チップ状電子部品
JP2013135134A (ja) * 2011-12-27 2013-07-08 Kyocera Corp 配線基板およびその実装構造体
JP2023151281A (ja) * 2022-03-31 2023-10-16 Tdk株式会社 圧電素子
JP2023151284A (ja) * 2022-03-31 2023-10-16 Tdk株式会社 圧電素子

Also Published As

Publication number Publication date
JPH0533840B2 (enrdf_load_stackoverflow) 1993-05-20

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