JPS6450453A - Glass sealed diode - Google Patents

Glass sealed diode

Info

Publication number
JPS6450453A
JPS6450453A JP20628487A JP20628487A JPS6450453A JP S6450453 A JPS6450453 A JP S6450453A JP 20628487 A JP20628487 A JP 20628487A JP 20628487 A JP20628487 A JP 20628487A JP S6450453 A JPS6450453 A JP S6450453A
Authority
JP
Japan
Prior art keywords
stud
cost
glass
sealed diode
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20628487A
Other languages
Japanese (ja)
Inventor
Hajime Terakado
Heiji Moroshima
Hiroyuki Fukazawa
Akihiro Koike
Yoshinori Murata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP20628487A priority Critical patent/JPS6450453A/en
Publication of JPS6450453A publication Critical patent/JPS6450453A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To reduce the cost of a glass-sealed diode, by composing the stud of a slug lead only of ion-nickel alloy. CONSTITUTION:A pair of slug leads 1 are formed of studs 1a made only of Fe-Ni alloy, and leads 1b connected to the studs 1a. The Ni content of the Fe-Ni alloy for forming the stud 1a is so selected that the thermal expansion coefficients of the stud 1a and sealing glass 3 are matched, and is concretely preferably of a value within the range of 48-58wt.%. Thus, the material cost of copper and the cost required to cover the cover can be reduced as compared with the case that a dumet wire is employed as the stud of the slug lead to decrease the cost of a glass-sealed diode.
JP20628487A 1987-08-21 1987-08-21 Glass sealed diode Pending JPS6450453A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20628487A JPS6450453A (en) 1987-08-21 1987-08-21 Glass sealed diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20628487A JPS6450453A (en) 1987-08-21 1987-08-21 Glass sealed diode

Publications (1)

Publication Number Publication Date
JPS6450453A true JPS6450453A (en) 1989-02-27

Family

ID=16520761

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20628487A Pending JPS6450453A (en) 1987-08-21 1987-08-21 Glass sealed diode

Country Status (1)

Country Link
JP (1) JPS6450453A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11135662A (en) * 1997-08-29 1999-05-21 Motorola Inc Electronic structure and manufacture thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11135662A (en) * 1997-08-29 1999-05-21 Motorola Inc Electronic structure and manufacture thereof

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