JPS6448453A - Lead frame material for semiconductor apparatus - Google Patents
Lead frame material for semiconductor apparatusInfo
- Publication number
- JPS6448453A JPS6448453A JP20578487A JP20578487A JPS6448453A JP S6448453 A JPS6448453 A JP S6448453A JP 20578487 A JP20578487 A JP 20578487A JP 20578487 A JP20578487 A JP 20578487A JP S6448453 A JPS6448453 A JP S6448453A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- materials
- resin
- element concentration
- solder wettability
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Solid-Phase Diffusion Into Metallic Material Surfaces (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE:To obtain a novel material for a lead frame having excellent solder wettability and superior resin sealing properties by respectively bringing Zn and Sn diffused and permeated to the surface of a base material to specific surface element concentration. CONSTITUTION:A board material composed of a Cu-0.1%Sn alloy is used as a base material, materials in which the surfaces of the base materials are coated with proper quantities of Zn and Sn are thermally treated respectively in an N2 gas atmosphere, and these materials are cold-rolled separately up to 0.25mm thickness, thus acquiring a board material, a composition of which differs in a surface layer and at a central section. The element concentration of the surface is brought to 3-15% Zn and 0-10% Sn through the diffusion and permeation. Accordingly, a material having excellent solder wettability and superior adhesive properties with a resin such as an epoxy resin can be acquired by using a lead frame material.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20578487A JPS6448453A (en) | 1987-08-19 | 1987-08-19 | Lead frame material for semiconductor apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20578487A JPS6448453A (en) | 1987-08-19 | 1987-08-19 | Lead frame material for semiconductor apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6448453A true JPS6448453A (en) | 1989-02-22 |
Family
ID=16512618
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20578487A Pending JPS6448453A (en) | 1987-08-19 | 1987-08-19 | Lead frame material for semiconductor apparatus |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6448453A (en) |
-
1987
- 1987-08-19 JP JP20578487A patent/JPS6448453A/en active Pending
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