JPS6448453A - Lead frame material for semiconductor apparatus - Google Patents

Lead frame material for semiconductor apparatus

Info

Publication number
JPS6448453A
JPS6448453A JP20578487A JP20578487A JPS6448453A JP S6448453 A JPS6448453 A JP S6448453A JP 20578487 A JP20578487 A JP 20578487A JP 20578487 A JP20578487 A JP 20578487A JP S6448453 A JPS6448453 A JP S6448453A
Authority
JP
Japan
Prior art keywords
lead frame
materials
resin
element concentration
solder wettability
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20578487A
Other languages
Japanese (ja)
Inventor
Yasuyuki Igo
Hajime Sasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP20578487A priority Critical patent/JPS6448453A/en
Publication of JPS6448453A publication Critical patent/JPS6448453A/en
Pending legal-status Critical Current

Links

Landscapes

  • Solid-Phase Diffusion Into Metallic Material Surfaces (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To obtain a novel material for a lead frame having excellent solder wettability and superior resin sealing properties by respectively bringing Zn and Sn diffused and permeated to the surface of a base material to specific surface element concentration. CONSTITUTION:A board material composed of a Cu-0.1%Sn alloy is used as a base material, materials in which the surfaces of the base materials are coated with proper quantities of Zn and Sn are thermally treated respectively in an N2 gas atmosphere, and these materials are cold-rolled separately up to 0.25mm thickness, thus acquiring a board material, a composition of which differs in a surface layer and at a central section. The element concentration of the surface is brought to 3-15% Zn and 0-10% Sn through the diffusion and permeation. Accordingly, a material having excellent solder wettability and superior adhesive properties with a resin such as an epoxy resin can be acquired by using a lead frame material.
JP20578487A 1987-08-19 1987-08-19 Lead frame material for semiconductor apparatus Pending JPS6448453A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20578487A JPS6448453A (en) 1987-08-19 1987-08-19 Lead frame material for semiconductor apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20578487A JPS6448453A (en) 1987-08-19 1987-08-19 Lead frame material for semiconductor apparatus

Publications (1)

Publication Number Publication Date
JPS6448453A true JPS6448453A (en) 1989-02-22

Family

ID=16512618

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20578487A Pending JPS6448453A (en) 1987-08-19 1987-08-19 Lead frame material for semiconductor apparatus

Country Status (1)

Country Link
JP (1) JPS6448453A (en)

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