JPS6448096U - - Google Patents
Info
- Publication number
- JPS6448096U JPS6448096U JP14395787U JP14395787U JPS6448096U JP S6448096 U JPS6448096 U JP S6448096U JP 14395787 U JP14395787 U JP 14395787U JP 14395787 U JP14395787 U JP 14395787U JP S6448096 U JPS6448096 U JP S6448096U
- Authority
- JP
- Japan
- Prior art keywords
- hybrid
- heat sink
- circuit board
- printed circuit
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims 3
- 239000000758 substrate Substances 0.000 claims 3
- 239000004020 conductor Substances 0.000 claims 1
Landscapes
- Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図は本考案の一実施例を示す正面図ａおよ
び側面図ｂ、第２図〜第４図は他の実施例を示す
正面図ａおよび側面図ｂ、第５図は従来例を示す
断面図である。
１，１′……ハイブリツドＩＣ、２……表面実
装部品、５……放熱板、６ａ，６ｂ……リードピ
ン、７……プリント基板。
Fig. 1 is a front view a and a side view b showing one embodiment of the present invention, Figs. 2 to 4 are a front view a and side view b showing other embodiments, and Fig. 5 is a conventional example. FIG. 1, 1'...hybrid IC, 2...surface mount component, 5...heat sink, 6a, 6b...lead pin, 7...printed board.
Claims (1)
が搭載され、他方の面に放熱板が固定されたハイ
ブリツドＩＣをプリント基板に取付ける際の固定
構造において、前記放熱板は導電材からなり前記
セラミツク基板より大きな面積を有するとともに
、前記放熱板は前記プリント基板に垂直に配置さ
れ、前記放熱板を前記プリント基板のアース電極
に接続し、前記ハイブリツドＩＣのアース電極を
前記放熱板に接続したことを特徴とするハイブリ
ツドＩＣの固定構造。 (2) 前記放熱板に同軸ケーブルまたはその他の
ケーブルを固定し、ハイブリツドＩＣの入出力端
に前記ケーブルの電線を直接接続するようにした
ことを特徴とする実用新案登録第１項記載のハイ
ブリツドＩＣの固定構造。 (3) 前記放熱板を前記プリント基板へ固定した
ことを特徴とする実用新案登録第１項記載のハイ
ブリツドＩＣの固定構造。 (4) 前記セラミツク基板のリードピンを前記プ
リント基板へ固定したことを特徴とする実用新案
登録第１項記載のハイブリツドＩＣの固定構造。[Claims for Utility Model Registration] (1) In a fixing structure for mounting a hybrid IC on a printed circuit board, in which a surface mount component is mounted on one surface of a ceramic substrate and a heat sink is fixed on the other surface, The plate is made of a conductive material and has a larger area than the ceramic substrate, and the heat sink is arranged perpendicularly to the printed circuit board, and the heat sink is connected to the ground electrode of the printed circuit board, and the ground electrode of the hybrid IC is connected to the ground electrode of the hybrid IC. A fixing structure for a hybrid IC, characterized in that it is connected to the heat sink. (2) The hybrid IC according to paragraph 1 of the utility model registration, characterized in that a coaxial cable or other cable is fixed to the heat sink, and the electric wire of the cable is directly connected to the input/output terminal of the hybrid IC. fixed structure. (3) A fixing structure for a hybrid IC according to item 1 of the utility model registration, characterized in that the heat sink is fixed to the printed circuit board. (4) The hybrid IC fixing structure according to item 1 of the utility model registration, characterized in that lead pins of the ceramic substrate are fixed to the printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14395787U JPS6448096U (en) | 1987-09-21 | 1987-09-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14395787U JPS6448096U (en) | 1987-09-21 | 1987-09-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6448096U true JPS6448096U (en) | 1989-03-24 |
Family
ID=31411243
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14395787U Pending JPS6448096U (en) | 1987-09-21 | 1987-09-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6448096U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02146487U (en) * | 1989-05-15 | 1990-12-12 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS614463B2 (en) * | 1979-04-30 | 1986-02-10 | Matsushita Electric Works Ltd |
-
1987
- 1987-09-21 JP JP14395787U patent/JPS6448096U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS614463B2 (en) * | 1979-04-30 | 1986-02-10 | Matsushita Electric Works Ltd |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02146487U (en) * | 1989-05-15 | 1990-12-12 |
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