JPH0415249U - - Google Patents
Info
- Publication number
- JPH0415249U JPH0415249U JP5539090U JP5539090U JPH0415249U JP H0415249 U JPH0415249 U JP H0415249U JP 5539090 U JP5539090 U JP 5539090U JP 5539090 U JP5539090 U JP 5539090U JP H0415249 U JPH0415249 U JP H0415249U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- terminal
- wide
- pad electrode
- terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Multi-Conductor Connections (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の表面実装用電子部品の端子構
造の一実施例を示す電子部品の実装状態斜視図、
第２図は第１図のＡ矢視図、第３図は従来の表面
実装用電子部品の端子構造を示す電子部品の実装
状態斜視図、第４図は第３図のＢ矢視図である。
１……電子部品筺体、２……後端部、３……プ
リント基板、４……パツド電極面、５……先端フ
ラツト部、６……ワイヤ、７……チツプ、８……
半田、２０……端子。
FIG. 1 is a perspective view of an electronic component mounted state showing an embodiment of the terminal structure of a surface-mounted electronic component of the present invention;
Fig. 2 is a view taken in the direction of arrow A in Fig. 1, Fig. 3 is a perspective view of the mounted electronic component showing the terminal structure of a conventional surface-mounted electronic part, and Fig. 4 is a view taken in the direction of arrow B in Fig. 3. be. DESCRIPTION OF SYMBOLS 1... Electronic component housing, 2... Rear end, 3... Printed circuit board, 4... Pad electrode surface, 5... Tip flat part, 6... Wire, 7... Chip, 8...
Solder, 20...terminal.
Claims (1)
させてなる混成集積回路に使用される表面実装用
電子部品の端子構造において、 電子部品の筺体から突出させた上記複数の端子
の先端フラツト部を、該電子部品が実装されるプ
リント基板のパツド電極面に対して、その幅広面
を垂直になるように形成したことを特徴とする表
面実装用電子部品の端子構造。 (2) パツド電極面に対して、端子の先端フラツ
ト部を曲げ加工して、その幅広面を垂直になるよ
うい形成したことを特徴とする請求項(1)記載の
表面実装用電子部品の端子構造。[Scope of Claim for Utility Model Registration] (1) In the terminal structure of a surface-mounted electronic component used in a hybrid integrated circuit, in which a plurality of horizontally wide terminals protrude from the side surface, the terminals protrude from the housing of the electronic component. A terminal of an electronic component for surface mounting, characterized in that the flat end portions of the plurality of terminals are formed such that their wide surfaces are perpendicular to the pad electrode surface of the printed circuit board on which the electronic component is mounted. structure. (2) The surface mount electronic component according to claim (1), wherein the flat end of the terminal is bent so that its wide surface is perpendicular to the pad electrode surface. Terminal structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5539090U JPH0415249U (en) | 1990-05-29 | 1990-05-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5539090U JPH0415249U (en) | 1990-05-29 | 1990-05-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0415249U true JPH0415249U (en) | 1992-02-06 |
Family
ID=31578297
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5539090U Pending JPH0415249U (en) | 1990-05-29 | 1990-05-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0415249U (en) |
-
1990
- 1990-05-29 JP JP5539090U patent/JPH0415249U/ja active Pending
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