JPS6446962A - Pin grid array type semiconductor device - Google Patents

Pin grid array type semiconductor device

Info

Publication number
JPS6446962A
JPS6446962A JP20471087A JP20471087A JPS6446962A JP S6446962 A JPS6446962 A JP S6446962A JP 20471087 A JP20471087 A JP 20471087A JP 20471087 A JP20471087 A JP 20471087A JP S6446962 A JPS6446962 A JP S6446962A
Authority
JP
Japan
Prior art keywords
external terminal
pga
stopper
semiconductor device
type semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20471087A
Other languages
Japanese (ja)
Inventor
Harumi Mizunashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP20471087A priority Critical patent/JPS6446962A/en
Publication of JPS6446962A publication Critical patent/JPS6446962A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To prevent effectively the destruction of soldering part of an external terminal caused by its difference in thermal expansion from a mounting substrate, by forming a stopper of the external terminal in the form of a mechanical elastic body. CONSTITUTION:Kovar(KV) is used for the external terminal 1 of a pin grid array(PGA) type semiconductor device. A material whose main component is alumina (Al2O3) is used for a ceramic substrate 4. Tungsten is sintered on a soldering part of the ceramic substrate 4, and thereon nickel (Ni) is electroplated. For the external terminal 1, a stopper 2 is formed by winding the external terminal material in the form of a one-turn coil. Thereby, elasticity is added to the external terminal 1. Therefore, even if a mechanical stress caused by the rate of thermal expansion between the ceramic substrate 4 and a mounting substrate is applied to the PGA, this stress is absorbed by the spring effect which the stopper 2 has, so that the PGA is not easily destructed.
JP20471087A 1987-08-17 1987-08-17 Pin grid array type semiconductor device Pending JPS6446962A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20471087A JPS6446962A (en) 1987-08-17 1987-08-17 Pin grid array type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20471087A JPS6446962A (en) 1987-08-17 1987-08-17 Pin grid array type semiconductor device

Publications (1)

Publication Number Publication Date
JPS6446962A true JPS6446962A (en) 1989-02-21

Family

ID=16495031

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20471087A Pending JPS6446962A (en) 1987-08-17 1987-08-17 Pin grid array type semiconductor device

Country Status (1)

Country Link
JP (1) JPS6446962A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998014038A1 (en) * 1996-09-25 1998-04-02 Melcher Ag Device for mounting hybrid connections on printed circuit boards

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998014038A1 (en) * 1996-09-25 1998-04-02 Melcher Ag Device for mounting hybrid connections on printed circuit boards

Similar Documents

Publication Publication Date Title
US2635199A (en) Piezoelectric crystal apparatus
GB1001171A (en) Semiconductor devices
IE53953B1 (en) Packages for enclosing semiconductor elements
GB1067333A (en) Thermoelectric apparatus
JPS6446962A (en) Pin grid array type semiconductor device
JPS5766655A (en) Lead frame for semiconductor device
JPS54124678A (en) Lead frame
GB920001A (en) Semiconductor arrangement
US3526814A (en) Heat sink arrangement for a semiconductor device
GB1020151A (en) Electrical semiconductor device
US3805348A (en) Method of making an encapsulated piezoelectric ceramic resonator device
GB1100737A (en) Semiconductor device junction stabilization
JPS52108776A (en) Pattern sticking device
US3076078A (en) Thermal relay device
US3644797A (en) Semiconductor assembly including aperture-mounted diaphragm-supported wafer
GB1210584A (en) Semiconductor device and method of manufacturing the same
JPS5624964A (en) Semiconductor device
GB1487854A (en) Header assembly for printed circuit board
JPS57114242A (en) Semiconductor device
JPS57184239A (en) Substrate for semiconductor device
JPS5575247A (en) Semiconductor device package
JPH0878602A (en) Semiconductor integrated circuit device
JPS6428845A (en) Semiconductor device
JPS568855A (en) Container for semiconductor
US2388596A (en) Piezoelectric crystal