WO1998014038A1 - Device for mounting hybrid connections on printed circuit boards - Google Patents

Device for mounting hybrid connections on printed circuit boards Download PDF

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Publication number
WO1998014038A1
WO1998014038A1 PCT/CH1997/000060 CH9700060W WO9814038A1 WO 1998014038 A1 WO1998014038 A1 WO 1998014038A1 CH 9700060 W CH9700060 W CH 9700060W WO 9814038 A1 WO9814038 A1 WO 9814038A1
Authority
WO
WIPO (PCT)
Prior art keywords
recesses
component
circuit board
printed circuit
longitudinal axis
Prior art date
Application number
PCT/CH1997/000060
Other languages
German (de)
French (fr)
Inventor
Hansjürg HUNZIKER
Original Assignee
Melcher Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Melcher Ag filed Critical Melcher Ag
Publication of WO1998014038A1 publication Critical patent/WO1998014038A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308—Adaptations of leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1031—Surface mounted metallic connector elements
    • H05K2201/10318—Surface mounted metallic pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10704—Pin grid array [PGA]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10848—Thinned leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

Definitions

  • the present invention relates to a device as an aid for assembling hybrid circuits or sub-assemblies based on printed circuit boards on electrical circuit boards.
  • Such devices or aids are known per se, but mostly relate to those which have the task of building elements with relatively large thermal expansion on printed circuit boards or aluminum oxide ceramic (AOK).
  • Printed circuit boards are generally made of glass fiber reinforced plastic or (for the so-called hybrid thick film technology), for example, of aluminum oxide ceramic (AOK).
  • the connections of electrical or electronic components consist of additional flexible wires. However, the connections are more often directly formed by the connection pins of the components themselves. These connection pins are passed through holes in the printed circuit board during assembly and are soldered to the conductor tracks on the same or different side of the printed circuit board using the wave soldering technique.
  • the object that is achieved with the present invention is to find a device for inexpensive, low-side-effects and stable assembly of electrical and electronic components on printed circuit boards, which the electrical and mechanical connections between the conductor tracks of the circuit board and the component, especially for large ones Ensures differences in the thermal expansion between component and printed circuit board, in a wide temperature range and with respect to every direction in the room and at the same time makes it possible to compensate for manufacturing-related deviations from target dimensions.
  • the solution to this problem is given in the characterizing part of claim 1 and in further claims 2 and 3 relating to preferred embodiments of the device. It is further explained with the aid of the following figures. Show it
  • a housing 1 which consists, for example, of metal, plastic or a combination of such materials, contains an electrical or electronic component 17, which consists here, for example, of a first printed circuit board 2 made of aluminum oxide ceramic with electronic components.
  • the component 17 is with the Housing 1 connected in a known manner.
  • the housing 1 is used in particular for heat dissipation and to protect the printed circuit board 2 from environmental influences. In one variant, the housing 1 is completely dispensed with.
  • the first circuit board 2 contains conductor tracks 5 on its lower side and conductor tracks 6 on its upper side, which are each firmly connected to the first circuit board 2.
  • the underside of this first printed circuit board 2 is equipped with electronic components 3, its upper side with electronic components 4 in a known manner such that the electrical connections of the components 3, 4 are soldered to the conductor tracks 5, 6.
  • a number of connecting pins 11 according to the invention are fixedly and electrically conductively connected to the lower conductor tracks 5 at one end, for example in such a way that they are butt-soldered onto the conductor tracks 5 with soldering points 14. However, they can also be soldered to the conductor tracks 5 or 6 in bores in the printed circuit board 2.
  • the second circuit board 7 contains conductor tracks 8 on its upper side and conductor tracks 9 on its underside, which are each firmly connected to the second circuit board 7. It also contains a number of holes 10 which corresponds to the number of connecting pins 11 and which corresponds to the geometric arrangement of the connecting pins 11.
  • the holes 10 are preferably plated through here and electrically conductively connected to each of the conductor tracks 8 or 9.
  • the connecting pins 11 are inserted through the holes 10 during assembly and are therefore located inside the plated-through holes 10. By means of soldering points 13, they are firmly and electrically conductively connected to at least one of the conductor tracks 8, 9.
  • Each of the connecting pins 11 contains four recesses 15 in its upper part, the floor plans of which are each 90 ° around the Long axis of the connecting pin 11 are rotated against each other.
  • the connecting pin 11 shows a longitudinal section through a first embodiment of the connecting pin 11 according to the invention. It consists of an elongated, here for example cylindrical pin made of metal with a base circle radius £ and a longitudinal axis denoted by AA. In its central area, the connecting pin 11 contains four recesses 15, which are denoted here by 15a, 15b, 15c and 15d. Each corresponds to a flat section perpendicular to the longitudinal axis AA of the connecting pin 11, which is deeper than the radius r of the base circle and has a cutting width b.
  • the recesses 15a, 15b, 15c and 15d thereby have parallel base and top surfaces and have cross-sectional areas which are larger than half the cross-sectional area of the connecting pin 11.
  • recesses 15a, 15b, 15c and 15d follow here in the direction of the longitudinal axis AA m, for example, equal distances a. They are rotated relative to each other by right angles or multiples thereof about the longitudinal axis AA.
  • the first two recesses 15a, b are rotated with respect to one another by 180 °
  • the second two recesses 15c, d are likewise rotated by 90 ° or 270 ° with respect to the direction of the recesses 15a, b.
  • both the outer two recesses 15a and 15d and the inner two recesses 15b and 15c e are rotated by 180 ° with respect to one another and with one another by 90 °.
  • the recesses 15a, b, c, d are rotated relative to one another by 90 °.
  • the connecting pin 11 contains only three recesses 15 in its central region instead of four, each of which is rotated relative to one another by an angle of 120 ° about the longitudinal axis AA.
  • the connecting pin 11 contains a whole number n> 4 recesses 15 in its central region, each of the n recesses 15 over any other by natural multiples of the win
  • FIG. 3 shows the floor plan of the third variant of an embodiment of the connecting pin 11 according to the invention with recesses 15a, 15b, 15c and 15d, which each have the connecting pin 11 only in a small, peripheral segment of a circle 16a, 16b, 16c and 16d, each with an arrow height h ⁇ r left intact.
  • each parallel to the longitudinal axis AA in the connecting pin 11 is interrupted at least once by a recess 15 on a piece of length b. It is thereby achieved that the two ends of the connecting pin 11 are not only movable relative to one another in any direction perpendicular to its longitudinal axis AA, but also in particular in the direction of its longitudinal axis AA, since two or more of the recesses 15 together as one in the direction of the Longitudinal axis AA compressible or expandable spring act.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

This invention concerns a device for mounting electrical and electronic components (17) on printed circuit boards or hybrids (7) with different thermal expansion characteristics. The component (17), for instance, out of high-alumina ceramics, has several connecting pins (11) as connecting and mounting elements. These pins are butt-soldered with a conductor path (5) of the component (17). Each connecting pin (11) has a number of recesses (15) in its upper part. The form and arrangement of these recesses (15) effects a certain freedom of movement in all directions for the upper end of the connecting pin (11). This permits compensation for differences in the thermal expansion between component (17) and circuit board (7) and deviations from standard dimensions of both parts resulting from the production. Thus, the connecting pins (11) can be directly soldered into plated throughholes (10) in the circuit board (17).

Description

Vorrichtung zur Montage von Hybridschaltungen auf Leiterplatten Device for mounting hybrid circuits on printed circuit boards
Die vorliegende Erfindung betrifft eine Vorrichtung als Hilfsmittel zur Montage von Hybridschaltungen oder auf Leiterplatten aufgebauten Unterbaugruppen auf Elektromklei- terplatten nach dem Oberbegriff des Patentanspruches 1. Solche Vorrichtungen bzw. Hilfsmittel sind an sich bekannt, betreffen jedoch meist solche, die die Aufgabe haben, Leis- tungselemente mit relativ grosser Warmeausdehnung auf Leiterplatten oder Aluminium-Oxid-Keramik (AOK) aufzubauen. Leiterplatten werden in der Regel aus glasfaserverstärktem Kunststoff oder (für die sogenannte Hybrid-Dickfllm-Tech- nik) beispielsweise aus Alu inium-Oxid-Keramik (AOK) herge- stellt. Die Anschl sse von elektrischen oder elektronischen Bauteilen bestehen aus zusätzlichen flexiblen Drahten. Häufiger werden die Anschlüsse aber direkt durch die Anschlussstifte der Bauteile selbst gebildet. Diese Anschlussstifte werden bei der Montage durch Locher in der Leiterplatte hindurchgefuhrt und auf der gleichen oder anderen Seite der Leiterplatte mit den dort vorhandenen Leiterbahnen mittels der Technik der Schwallotung verlotet. In Leiterplatten für oberflachenmontierbare Bauelemente (SMD) oder solchen, die aus AOK bestehen, sind Locher aus Stabi- litats- und fertigungstechnischen Gründen, aber auch wegen der grossen Kosten, meist unerwünscht. Die Anschlüsse der Bauteile werden bei diesen Leiterplatten darum mit der sogenannten SMD-Tech ik stumpf auf eine Leiterbahn der Leiterplatte aufgelotet. Dieses Verfahren ist problemlos, solange die Bauteile keine Verlustleistung aufnehmen oder den gleichen thermischen Ausdehnungskoeffizienten aufweisen wie die Leiterplatte, und solange keine Ausdehnungen in Längsrichtung der An¬ schlussstifte auftreten. Andernfalls führt eine Erwärmung oder eine Abkühlung, zumal auf die in der Regel geforderten Extremwerte zwischen -40°C und +100°C, zu einer relativen Ausdehnung respektive Kontraktion des Bauteils gegenüber der Leiterplatte. Dies ist in besonders grossem Mass der Fall, wenn Leiterplatten aus konventionellem Material und AOK-Bauteile, die einen sehr geringen thermischen Ausdehnungskoeffizienten aufweisen, aufeinander befestigt werden sollen, oder wenn vergossene Baugruppen befestigt werden. Dabei können an den Lötstellen grosse Kräfte auftreten, die zum Unterbruch der elektrischen Verbindung und damit zur Funktionsunfähigkeit des Bauteils führen können. Dieses Problem ist an sich bekannt. Zu seiner Lösung werden bei Hybrid-Kunststoff-Ko binationen in der Regel die elek- frischen Anschlüsse der Bauteile als Stelzen oder als dünne, flache Bänder ausgestaltet, die entsprechend verformbar sind, wie dies in den Druckschriften JP 03' 134' 980 oder in EP 0'162'149 AI dargelegt ist. Diese Lösungen weisen aber bei Bauteilen, die vergleichs- weise grosse Abmessungen oder eine grosse Masse haben, gewisse Nachteile auf: Durch die Stelzen resp. die Bänder kann keine genügende mechanische Stabilität der Befestigung des Bauteils erreicht werden, und thermisch induzierte oder gewöhnliche mechanische Schwingungen des Bauteils können zu mikrofonischen Effekten oder zur Ermüdung von Lötstellen führen. Weitere Nachteile liegen in der schwierigen und kostenaufwendigen Montage der Bauteile, in der unerwünscht grossen Bauhöhe und auch darin, dass die so ausgestalteten Zuleitungen relativ viel Platz auf der Leiterplatte bean- spruchen. Andere Lösungen, wie z.B. die in WO 91/01041 vorgeschlagenen Feder-Halterungen für thermisch beanspruchte Bauteile, haben zusätzlich den Nachteil, dass diese Halterungen selber bereits eine grosse Masse aufweisen, viel Platz beanspruchen und Handlötung erfordern. Eine wesentliche Verbesserung in der mechanischen Stabilität der Verbindung und in der Kompensation unterschiedlicher thermischer Ausdehnungen von Platine und Bauteil ergibt sich durch die in der Patentanmeldung CH 1208/96 vorgestellte Lösung: Die als stelzenartige Metallstifte ausge- bildeten Verbindungen zwischen Bauteil und Platine weisen dort mindestens eine Sollbiegestelle auf, wodurch das Bauteil gegenüber der Platine eine gewisse Bewegungsfreiheit erhalt, die sich allerdings im wesentlichen auf Richtungen senkrecht zur Achse des Metallstifts beschrankt. Die Aufgabe, die mit der vorliegenden Erfindung gelost wird, besteht darin, eine Vorrichtung zur kostengünstigen, nebeneffektarmen und stabilen Montage elektrischer und elektronischer Bauteile auf Leiterplatten zu finden, die die elektrischen und mechanischen Verbindungen zwischen den Leiterbahnen der Leiterplatte und dem Bauteil, insbesondere bei grossen Unterschieden in der thermischen Ausdehnung zwischen Bauteil und Leiterplatte, in einem grossen Temperaturbereich und betreffend jeder Richtung im Raum sicherstellt und es gleichzeitig ermöglicht, fertigungsbedingte Abweichungen von Sollabmessungen auszugleichen. Die Losung dieser Aufgabe ist wiedergegeben im kennzeich- nenden Teil des Anspruchs 1 und in den weiteren Ansprüchen 2 und 3 betreffend bevorzugter Ausfuhrungen der Vorrichtung. Sie wird anhand der folgenden Figuren weiter erläutert. Es zeigenThe present invention relates to a device as an aid for assembling hybrid circuits or sub-assemblies based on printed circuit boards on electrical circuit boards. Such devices or aids are known per se, but mostly relate to those which have the task of building elements with relatively large thermal expansion on printed circuit boards or aluminum oxide ceramic (AOK). Printed circuit boards are generally made of glass fiber reinforced plastic or (for the so-called hybrid thick film technology), for example, of aluminum oxide ceramic (AOK). The connections of electrical or electronic components consist of additional flexible wires. However, the connections are more often directly formed by the connection pins of the components themselves. These connection pins are passed through holes in the printed circuit board during assembly and are soldered to the conductor tracks on the same or different side of the printed circuit board using the wave soldering technique. In circuit boards for surface-mountable components (SMD) or those made of AOK, holes are mostly undesirable for reasons of stability and manufacturing technology, but also because of the high costs. The connections of the components are therefore bluntly soldered onto a printed circuit board of the printed circuit board using the so-called SMD technology. This method is problem-free as long as the components do not absorb any power loss or have the same coefficient of thermal expansion as the printed circuit board, and as long as there are no expansions in the longitudinal direction of the connecting pins . Otherwise, heating or cooling, especially to the extreme values usually required between -40 ° C and + 100 ° C, leads to a relative expansion or contraction of the component with respect to the printed circuit board. This is particularly the case Case when printed circuit boards made of conventional material and AOK components that have a very low coefficient of thermal expansion are to be attached to one another, or when potted assemblies are attached. Large forces can occur at the solder joints, which can lead to the interruption of the electrical connection and thus to the inoperability of the component. This problem is known per se. To solve this problem in hybrid plastic combinations, the electrical connections of the components are generally designed as stilts or as thin, flat strips which can be deformed accordingly, as described in JP 03 '134' 980 or in EP 0'162'149 AI is set out. However, these solutions have certain disadvantages for components that have comparatively large dimensions or a large mass. sufficient mechanical stability of the fastening of the component cannot be achieved, and thermally induced or ordinary mechanical vibrations of the component can lead to microphone effects or fatigue of soldered joints. Further disadvantages lie in the difficult and costly assembly of the components, in the undesirably large overall height and also in the fact that the feed lines designed in this way take up a relatively large amount of space on the printed circuit board. Other solutions, such as the spring mounts for thermally stressed components proposed in WO 91/01041, have the additional disadvantage that these mounts themselves already have a large mass, take up a lot of space and require manual soldering. A significant improvement in the mechanical stability of the connection and in the compensation of different thermal expansions of the circuit board and component results from the solution presented in patent application CH 1208/96: The connections between the component and circuit board, which are designed as stilt-like metal pins, have at least one there Target bending point, which gives the component a certain freedom of movement compared to the board receive, which is essentially limited to directions perpendicular to the axis of the metal pin. The object that is achieved with the present invention is to find a device for inexpensive, low-side-effects and stable assembly of electrical and electronic components on printed circuit boards, which the electrical and mechanical connections between the conductor tracks of the circuit board and the component, especially for large ones Ensures differences in the thermal expansion between component and printed circuit board, in a wide temperature range and with respect to every direction in the room and at the same time makes it possible to compensate for manufacturing-related deviations from target dimensions. The solution to this problem is given in the characterizing part of claim 1 and in further claims 2 and 3 relating to preferred embodiments of the device. It is further explained with the aid of the following figures. Show it
Fig. 1 einen Schnitt senkrecht durch eine Leiterplatte und ein damit in erfindungsgemasser Weise verbundenes Bauteil,1 shows a section perpendicularly through a printed circuit board and a component connected thereto in the manner according to the invention,
Fig. 2 einen Längsschnitt durch einen der erfmdungsgemas- sen Verbindungsstifte,2 shows a longitudinal section through one of the connecting pins according to the invention,
Fig. 3 den Grundπss der erfmdungsgemassen Verbindungsstifte.3 shows the basic principle of the connecting pins according to the invention.
In Fig. 1 ist ein Schnitt senkrecht durch eine Leiterplatte und ein damit in erfindungsgemasser Weise verbundenes Bauteil dargestellt. Ein Gehäuse 1, das beispielsweise aus Metall, aus Kunststoff oder aus einer Kombination solcher Materialien besteht, enthalt ein elektrisches oder elektronisches Bauteil 17, das hier beispielsweise aus einer mit Elektronikkomponenten bestuckten ersten Leiterplatte 2 aus Aluminium-Oxid-Keramik besteht. Das Bauteil 17 ist mit dem Gehäuse 1 in bekannter Weise verbunden. Das Gehäuse 1 dient insbesondere der Wärmeableitung und dem Schutz der Leiterplatte 2 vor Umwelteinflüssen. In einer Variante wird auf das Gehäuse 1 vollständig verzichtet. Parallel zu der Ebene der ersten Leiterplatte 2 liegt unter dieser eine zweite Leiterplatte 7, die hier aus glasfaserverstärktem Kunststoff besteht. Die erste Leiterplatte 2 enthält auf ihrer unteren Seite Leiterbahnen 5 und auf ihrer oberen Seite Leiterbahnen 6, die je mit der ersten Leiterplatte 2 fest verbunden sind. Die Unterseite dieser ersten Leiterplatte 2 ist mit elektronischen Komponenten 3, ihre Oberseite mit elektronischen Komponenten 4 in bekannter Weise so bestückt, dass die elektrischen Anschlüsse der Komponenten 3, 4 mit den Leiterbahnen 5, 6 verlötet sind. Mit den unteren Leiterbahnen 5 sind eine Anzahl von erfindungsgemässen Verbindungsstiften 11 mit ihrem einen Ende fest und elektrisch leitend verbunden, beispielsweise so, dass diese mit Lötstellen 14 stumpf auf die Leiterbahnen 5 aufgelötet sind. Sie können aber auch in Bohrungen in der Leiterplatte 2 mit den Leiterbahnen 5 oder 6 verlötet sein. Durch Löcher 16 im Gehäuse 1 ragen diese Verbindungsstifte 11 im wesentlichen senkrecht zur ersten Leiterplatte 2 aus dem Gehäuse 1 hervor. Die zweite Leiterplatte 7 enthält auf ihrer Oberseite Leiterbahnen 8 und auf ihrer Unterseite Leiterbahnen 9, die je mit der zweiten Leiterplatte 7 fest verbunden sind. Sie enthält weiter eine der Zahl der Verbindungsstifte 11 entsprechende Anzahl von Löchern 10, welche mit der geometrischen Anordnung der Verbindungsstifte 11 übereinstimmen. Die Löcher 10 sind hier vorzugsweise durchplattiert und mit je einer der Leiterbahnen 8 oder 9 elektrisch leitend verbunden. Die Verbindungsstifte 11 werden bei der Montage durch die Löcher 10 hindurchgesteckt und befinden sich dadurch im Innern der durchplattierten Löcher 10. Mittels Lötstellen 13 sind sie mit mindestens einer der Leiterbah- nen 8, 9 fest und elektrisch leitend verbunden. Jeder der Verbindungsstifte 11 enthält in seinem oberen Teil vier Ausnehmungen 15, deren Grundrisse jeweils um 90° um die Langsachse des Verbindungsstifts 11 gegeneinander verdreht sind.1 shows a section perpendicular through a printed circuit board and a component connected thereto in the manner according to the invention. A housing 1, which consists, for example, of metal, plastic or a combination of such materials, contains an electrical or electronic component 17, which consists here, for example, of a first printed circuit board 2 made of aluminum oxide ceramic with electronic components. The component 17 is with the Housing 1 connected in a known manner. The housing 1 is used in particular for heat dissipation and to protect the printed circuit board 2 from environmental influences. In one variant, the housing 1 is completely dispensed with. Parallel to the plane of the first printed circuit board 2, there is a second printed circuit board 7 below it, which here consists of glass fiber reinforced plastic. The first circuit board 2 contains conductor tracks 5 on its lower side and conductor tracks 6 on its upper side, which are each firmly connected to the first circuit board 2. The underside of this first printed circuit board 2 is equipped with electronic components 3, its upper side with electronic components 4 in a known manner such that the electrical connections of the components 3, 4 are soldered to the conductor tracks 5, 6. A number of connecting pins 11 according to the invention are fixedly and electrically conductively connected to the lower conductor tracks 5 at one end, for example in such a way that they are butt-soldered onto the conductor tracks 5 with soldering points 14. However, they can also be soldered to the conductor tracks 5 or 6 in bores in the printed circuit board 2. Through holes 16 in the housing 1, these connecting pins 11 protrude from the housing 1 essentially perpendicular to the first printed circuit board 2. The second circuit board 7 contains conductor tracks 8 on its upper side and conductor tracks 9 on its underside, which are each firmly connected to the second circuit board 7. It also contains a number of holes 10 which corresponds to the number of connecting pins 11 and which corresponds to the geometric arrangement of the connecting pins 11. The holes 10 are preferably plated through here and electrically conductively connected to each of the conductor tracks 8 or 9. The connecting pins 11 are inserted through the holes 10 during assembly and are therefore located inside the plated-through holes 10. By means of soldering points 13, they are firmly and electrically conductively connected to at least one of the conductor tracks 8, 9. Each of the connecting pins 11 contains four recesses 15 in its upper part, the floor plans of which are each 90 ° around the Long axis of the connecting pin 11 are rotated against each other.
Fig. 2 zeigt einen Längsschnitt durch eine erste Ausfuh- rungsform des erfindungsgemassen Verbindungsstifts 11. Er besteht aus einem länglichen, hier beispielsweise zylindrischen Stift aus Metall mit Grundkreisradius £ und einer mit AA bezeichneten Längsachse. In seinem mittleren Bereich enthalt der Verbindungsstift 11 vier Ausnehmungen 15, die hier mit 15a, 15b, 15c und 15d bezeichnet werden. Jede entspricht einem ebenen Schnitt senkrecht zur Längsachse AA des Verbindungsstifts 11, welcher tiefer ist als der Radius r des Grundkreises und eine Schnittbreite b aufweist. Die Ausnehmungen 15a, 15b, 15c und 15d weisen dadurch parallele Grund- und Deckflächen auf und haben Querschnittsflachen, die e grόsser sind als die halbe Querschnittsflache des Verbindungsstiftes 11. Diese Ausnehmungen 15a, 15b, 15c und 15d folgen sich hier in der Richtung der Langsachse AA m beispielsweise gleichen Abstanden a. Sie sind jeweils ge- genemander um rechte Winkel oder Vielfache davon um die Längsachse AA verdreht. In einer ersten erfindungsgemassen Variante sind die ersten zwei Ausnehmungen 15a, b um 180° gegeneinander verdreht, die zweiten zwei Ausnehmungen 15c, d ebenfalls, jedoch gegenüber der Richtung der Ausnehmungen 15a, b um 90° bzw. 270° verdreht. In einer zweiten Variante sind sowohl die äusseren beiden Ausnehmungen 15a und 15d als auch die innern beiden Ausnehmungen 15b und 15c e um 180° gegeneinander und untereinander um 90° verdreht. In einer dritten Variante sind die Ausnehmungen 15a, b, c, d der Reihe nach je um 90° gegeneinander verdreht.2 shows a longitudinal section through a first embodiment of the connecting pin 11 according to the invention. It consists of an elongated, here for example cylindrical pin made of metal with a base circle radius £ and a longitudinal axis denoted by AA. In its central area, the connecting pin 11 contains four recesses 15, which are denoted here by 15a, 15b, 15c and 15d. Each corresponds to a flat section perpendicular to the longitudinal axis AA of the connecting pin 11, which is deeper than the radius r of the base circle and has a cutting width b. The recesses 15a, 15b, 15c and 15d thereby have parallel base and top surfaces and have cross-sectional areas which are larger than half the cross-sectional area of the connecting pin 11. These recesses 15a, 15b, 15c and 15d follow here in the direction of the longitudinal axis AA m, for example, equal distances a. They are rotated relative to each other by right angles or multiples thereof about the longitudinal axis AA. In a first variant according to the invention, the first two recesses 15a, b are rotated with respect to one another by 180 °, the second two recesses 15c, d are likewise rotated by 90 ° or 270 ° with respect to the direction of the recesses 15a, b. In a second variant, both the outer two recesses 15a and 15d and the inner two recesses 15b and 15c e are rotated by 180 ° with respect to one another and with one another by 90 °. In a third variant, the recesses 15a, b, c, d are rotated relative to one another by 90 °.
In einer vierten, nicht gezeichneten Variante enthalt der Verbindungsstift 11 in seinem mittleren Bereich statt vier nur drei Ausnehmungen 15, die gegeneinander je um einen Winkel von 120° um die Längsachse AA verdreht sind. In wei- teren, ebenfalls nicht gezeichneten Varianten enthalt der Verbindungsstift 11 in seinem mittleren Bereich eine ganze Anzahl n > 4 Ausnehmungen 15, wobei jede der n Ausnehmungen 15 gegenüber jeder anderen um natürliche Vielfache des Win-In a fourth variant, not shown, the connecting pin 11 contains only three recesses 15 in its central region instead of four, each of which is rotated relative to one another by an angle of 120 ° about the longitudinal axis AA. In further variants, also not shown, the connecting pin 11 contains a whole number n> 4 recesses 15 in its central region, each of the n recesses 15 over any other by natural multiples of the win
360° kels um die Längsachse AA verdreht ist. nIs rotated 360 ° around the longitudinal axis AA. n
Fig. 3 zeigt den Grundriss der dritten Variante einer Aus- führungsform des erfindungsgemassen Verbindungsstifts 11 mit Ausnehmungen 15a, 15b, 15c und 15d, welche den Verbindungsstift 11 je nur in einem kleinen, peripheren Kreissegment 16a, 16b, 16c und 16d mit je einer Pfeilhöhe h < r intakt belässt. Durch die Verdrehung der Ausnehmungen 15a, 15b, 15c und 15d um rechte Winkel sind deren Grundrisse gleichmässig so um die Längsachse AA verteilt, dass jeder Quadrant der Grundrissfläche genau eines der Kreissegmente 16a, 16b, 16c, 16d enthält. Durch die Form und die Anordnung der Ausnehmungen 15 wird jede Parallele zur Längsachse AA im Verbindungsstift 11 mindestens einmal durch eine Ausnehmung 15 auf einem Stück der Länge b unterbrochen. Dadurch wird erreicht, dass die beiden Enden des Verbindungsstifts 11 nicht nur in beliebigen Richtungen senkrecht zu seiner Längsachse AA gegenein- ander beweglich sind, sondern auch insbesondere in Richtung seiner Längsachse AA, da jeweils zwei oder mehrere der Ausnehmungen 15 zusammen wie eine in Richtung der Längsachse AA komprimier- respektive expandierbare Feder wirken. Dadurch wird, auch bei grossen Unterschieden in der thermi- sehen Ausdehnung und fertigungsbedingten Abweichungen von Sollabmessungen zwischen Bauteil 17 und zweiter Leiterplatte 7, eine zuverlässige mechanische und elektrische Verbindung zwischen der zweiten Leiterplatte 7 und dem Bauteil 17 betreffend jeder beliebigen Richtung im Raum in ei- nem grossen Temperaturbereich sichergestellt. 3 shows the floor plan of the third variant of an embodiment of the connecting pin 11 according to the invention with recesses 15a, 15b, 15c and 15d, which each have the connecting pin 11 only in a small, peripheral segment of a circle 16a, 16b, 16c and 16d, each with an arrow height h <r left intact. By rotating the recesses 15a, 15b, 15c and 15d by right angles, their floor plans are evenly distributed around the longitudinal axis AA such that each quadrant of the floor plan area contains exactly one of the circle segments 16a, 16b, 16c, 16d. Due to the shape and arrangement of the recesses 15, each parallel to the longitudinal axis AA in the connecting pin 11 is interrupted at least once by a recess 15 on a piece of length b. It is thereby achieved that the two ends of the connecting pin 11 are not only movable relative to one another in any direction perpendicular to its longitudinal axis AA, but also in particular in the direction of its longitudinal axis AA, since two or more of the recesses 15 together as one in the direction of the Longitudinal axis AA compressible or expandable spring act. As a result, a reliable mechanical and electrical connection between the second printed circuit board 7 and the component 17 with regard to any direction in space in one direction, even with large differences in the thermal expansion and production-related deviations from the desired dimensions between the component 17 and the second printed circuit board 7. ensures a wide temperature range.

Claims

Patentansprüche claims
1. Vorrichtung zur Montage eines elektrischen oder elektronischen Bauteils (17), das mindestens auf einer sei- ner Flächen Leiterbahnen (5, 6) aufweist, auf einer Leiterplatte (7), die auf mindestens einer ihrer Flächen Leiterbahnen (8, 9) aufweist, und die ein anderes thermisches Ausdehnungsverhalten aufweist als das Bauteil (17), wobei sowohl das Bauteil (17) als auch die Leiterplatte (7) Hybride sein können, dadurch gekennzeichnet, dass mehrere metallische Verbindungsstifte (11) vorhanden sind, die mit ihrem einen Ende mit dem Bauteil (17) mechanisch fest verbunden sind und auf einer Seite mit ihrem anderen Ende im wesentlichen senkrecht aus diesem hervorstehen, mindestens einer der Verbindungsstifte (11) mit mindestens einer der Leiterbahnen (5, 6) des Bauteils (17) elektrisch leitend verbunden ist, - jeder der Verbindungsstift (11) zwischen Leiterplatte (7) und Bauteil (17) entlang seiner Längsachse eine ganze Anzahl n > 2 Ausnehmungen (15) aufweist, deren Querschnittsflächen je grösser sind als die halbe Querschnittsfläche des Verbindungs- stiftes (11), die Grundrisse der n Ausnehmungen (15) regel ässig um die Längsachse (AA) des Verbindungsstifts (11) angeordnet sind, die Verbindungsstifte (11) mit ihrem anderen, her- vorstehenden Ende mit den Leiterbahnen (8, 9) der1. Device for mounting an electrical or electronic component (17) which has conductor tracks (5, 6) on at least one of its surfaces, on a circuit board (7) which has conductor tracks (8, 9) on at least one of its surfaces , and which has a different thermal expansion behavior than the component (17), it being possible for both the component (17) and the printed circuit board (7) to be hybrids, characterized in that a plurality of metallic connecting pins (11) are present, one with their End are mechanically firmly connected to the component (17) and protrude from it on one side with its other end substantially perpendicularly, at least one of the connecting pins (11) with at least one of the conductor tracks (5, 6) of the component (17) being electrically conductive - each of the connecting pins (11) between the printed circuit board (7) and the component (17) has a whole number n> 2 recesses (15) along its longitudinal axis, the cross-sectional areas of which the larger than half the cross-sectional area of the connecting pin (11), the floor plans of the n recesses (15) are regularly arranged around the longitudinal axis (AA) of the connecting pin (11), the connecting pins (11) with their other, protruding end with the conductor tracks (8, 9) of
Leiterplatte (7) verlötbar sind.PCB (7) can be soldered.
2. Vorrichtung gemäss Patentanspruch 1, dadurch gekennzeichnet, dass - mindestens einer der Verbindungsstifte (11) vier Ausnehmungen (15a, b, c, d) aufweist, wobei der Grundriss von jeder der vier Ausnehmungen (15a, b, c, d) gegenüber allen anderen dieser Grundrisse um natürliche Vielfache von 90° um die Langsachse (AA) des Verbindungsstifts (11) verdreht st.2. Device according to claim 1, characterized in that - at least one of the connecting pins (11) has four recesses (15a, b, c, d), the floor plan of each of the four recesses (15a, b, c, d) opposite everyone else around these floor plans natural multiples of 90 ° around the longitudinal axis (AA) of the connecting pin (11) are rotated.
3) Vorrichtung nach Patentanspruch 1, dadurch gekennzeich- net, dass mindestens einer der Verbindungsstifte (11) m seinem mittleren Bereich drei Ausnehmungen (15) enthält, deren Grundrisse gegeneinander je um einen Winkel von 120° um die Langsachse (AA) des Verbin- dungsstifts (11) verdreht sind.3) Device according to claim 1, characterized in that at least one of the connecting pins (11) contains three recesses (15) in its central region, the ground plans of which are at an angle of 120 ° around the longitudinal axis (AA) of the connection. tion pin (11) are twisted.
4) Vorrichtung nach Patentanspruch 1, dadurch gekennzeichnet, dass mindestens einer der Verbindungsst fte (11) m sei- nem mittleren Bereich eine ganze Anzahl n > 4 Ausnehmungen (15) enthalt, wobei der Grundπss von jeder der n Ausnehmungen (15) gegenüber allen anderen dieser Grundrisse um naturliche Vielfache des Win-4) Device according to claim 1, characterized in that at least one of the connecting points (11) in its central region contains a whole number n> 4 recesses (15), the base of each of the n recesses (15) being opposite to all other of these floor plans by natural multiples of the winter
360° kels um die Längsachse (AA) des Verbindungs- n Stifts (11) verdreht ist.Is rotated 360 ° around the longitudinal axis (AA) of the connecting pin (11).
5) Vorrichtung gemäss einem der Patentansprüche 1 bis 4, dadurch gekennzeichnet, dass die Ausnehmungen (15) parallele Grund- und Deckfla- chen aufweisen. 5) Device according to one of the claims 1 to 4, characterized in that the recesses (15) have parallel base and top surfaces.
PCT/CH1997/000060 1996-09-25 1997-02-18 Device for mounting hybrid connections on printed circuit boards WO1998014038A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH234696 1996-09-25
CH2346/96 1996-09-25

Publications (1)

Publication Number Publication Date
WO1998014038A1 true WO1998014038A1 (en) 1998-04-02

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59198745A (en) * 1983-04-25 1984-11-10 Mitsubishi Electric Corp Hybrid integrated circuit device
JPS6446962A (en) * 1987-08-17 1989-02-21 Nec Corp Pin grid array type semiconductor device
US5076796A (en) * 1990-11-19 1991-12-31 Molex Incorporated Terminal pin for soldering to a printed circuit board
US5167513A (en) * 1991-08-14 1992-12-01 International Business Machines Corp. Load limited pin for an electrical connector
JPH05259334A (en) * 1992-03-12 1993-10-08 Mitsubishi Electric Corp Semiconductor device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59198745A (en) * 1983-04-25 1984-11-10 Mitsubishi Electric Corp Hybrid integrated circuit device
JPS6446962A (en) * 1987-08-17 1989-02-21 Nec Corp Pin grid array type semiconductor device
US5076796A (en) * 1990-11-19 1991-12-31 Molex Incorporated Terminal pin for soldering to a printed circuit board
US5167513A (en) * 1991-08-14 1992-12-01 International Business Machines Corp. Load limited pin for an electrical connector
JPH05259334A (en) * 1992-03-12 1993-10-08 Mitsubishi Electric Corp Semiconductor device

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Title
"Flexible power connection for array applications", IBM TECHNICAL DISCLOSURE BULLETIN, vol. 37, no. 5, May 1994 (1994-05-01), NEW YORK US, pages 1 - 2, XP000453065 *
PATENT ABSTRACTS OF JAPAN vol. 13, no. 246 (E - 769) 8 June 1989 (1989-06-08) *
PATENT ABSTRACTS OF JAPAN vol. 18, no. 22 (E - 1490) 13 January 1994 (1994-01-13) *
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