JPS6444645U - - Google Patents

Info

Publication number
JPS6444645U
JPS6444645U JP1988119739U JP11973988U JPS6444645U JP S6444645 U JPS6444645 U JP S6444645U JP 1988119739 U JP1988119739 U JP 1988119739U JP 11973988 U JP11973988 U JP 11973988U JP S6444645 U JPS6444645 U JP S6444645U
Authority
JP
Japan
Prior art keywords
lead
pair
housing
parts
dimension
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988119739U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS6444645U publication Critical patent/JPS6444645U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W70/481—
    • H10W74/111—
    • H10W72/5524—
    • H10W72/932—
    • H10W74/00—
    • H10W90/756—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Packaging Frangible Articles (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
JP1988119739U 1981-04-06 1988-09-12 Pending JPS6444645U (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/251,268 US4642419A (en) 1981-04-06 1981-04-06 Four-leaded dual in-line package module for semiconductor devices

Publications (1)

Publication Number Publication Date
JPS6444645U true JPS6444645U (enExample) 1989-03-16

Family

ID=22951202

Family Applications (2)

Application Number Title Priority Date Filing Date
JP57058431A Pending JPS57177548A (en) 1981-04-06 1982-04-06 Module for semiconductor device
JP1988119739U Pending JPS6444645U (enExample) 1981-04-06 1988-09-12

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP57058431A Pending JPS57177548A (en) 1981-04-06 1982-04-06 Module for semiconductor device

Country Status (5)

Country Link
US (1) US4642419A (enExample)
JP (2) JPS57177548A (enExample)
DE (1) DE3212442A1 (enExample)
FR (1) FR2503454B1 (enExample)
GB (1) GB2096394B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014093411A (ja) * 2012-11-02 2014-05-19 Toshiba Corp 半導体装置

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT8224533A0 (it) * 1982-12-01 1982-12-01 Ora Sgs Microelettronica Spa S Contenitore in metallo e resina ad elevata affidabilita' per dispositivo a semiconduttore.
JPS5996844U (ja) * 1982-12-21 1984-06-30 日本インタ−ナショナル整流器株式会社 半導体装置用リ−ドフレ−ム
JPH073848B2 (ja) * 1984-09-28 1995-01-18 株式会社日立製作所 半導体装置
JPS63201347U (enExample) * 1987-06-17 1988-12-26
DE4031051C2 (de) * 1989-11-14 1997-05-07 Siemens Ag Modul mit mindestens einem Halbleiterschaltelement und einer Ansteuerschaltung
JP2745933B2 (ja) * 1992-02-17 1998-04-28 日本電気株式会社 Ｔａｂ−集積回路
US5337216A (en) * 1992-05-18 1994-08-09 Square D Company Multichip semiconductor small outline integrated circuit package structure
USD353575S (en) 1993-03-29 1994-12-20 Cornell Dubilier Electronics, Inc. Flatpack capacitor
US5798287A (en) * 1993-12-24 1998-08-25 Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno Method for forming a power MOS device chip
DE69321966T2 (de) * 1993-12-24 1999-06-02 Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno, Catania Leistungs-Halbleiterbauelement
DE69321965T2 (de) * 1993-12-24 1999-06-02 Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno, Catania MOS-Leistungs-Chip-Typ und Packungszusammenbau
TW354859B (en) * 1994-02-07 1999-03-21 Siemens Ag A storage unit of semiconductor assembled of multi-memory chips and its manufacturing method a semiconductor memory system is composed with several single memory chips or different designed memory units
US5647124A (en) * 1994-04-25 1997-07-15 Texas Instruments Incorporated Method of attachment of a semiconductor slotted lead to a substrate
EP0697728B1 (en) * 1994-08-02 1999-04-21 STMicroelectronics S.r.l. MOS-technology power device chip and package assembly
JP3426801B2 (ja) * 1995-08-15 2003-07-14 株式会社ミツバ 電子部品
US6476549B2 (en) * 2000-10-26 2002-11-05 Mu-Chin Yu Light emitting diode with improved heat dissipation
US7573159B1 (en) 2001-10-22 2009-08-11 Apple Inc. Power adapters for powering and/or charging peripheral devices
DE102008048259B4 (de) * 2008-09-22 2024-10-02 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Gehäuse für ein optoelektronisches Bauteil, seitlich emittierendes Bauteil mit einem Gehäuse und Verfahren zur Herstellung eines Gehäuses
DE102010038988A1 (de) * 2009-08-05 2011-02-10 Continental Teves Ag & Co. Ohg Sensoranordnung und Chip mit zusätzlichen Befestigungsbeinen
US20130081845A1 (en) * 2011-09-30 2013-04-04 Edward Siahaan Housing for electronic components
KR102015966B1 (ko) 2016-06-30 2019-08-29 유겐가이샤 쇼난 엔지니어링 마그넷식 칩 컨베이어
US11923344B2 (en) 2021-11-11 2024-03-05 Wolfspeed, Inc. Compact power module
US12150258B2 (en) 2022-05-04 2024-11-19 Wolfspeed, Inc. Dual inline power module

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS495388A (enExample) * 1972-05-01 1974-01-18

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3522490A (en) * 1965-06-28 1970-08-04 Texas Instruments Inc Semiconductor package with heat conducting mounting extending from package on side opposite conductor extensions
NL157456B (nl) * 1968-07-30 1978-07-17 Philips Nv Halfgeleiderinrichting in een isolerende kunststofomhulling.
US3668299A (en) * 1971-04-29 1972-06-06 Beckman Instruments Inc Electrical circuit module and method of assembly
US3839660A (en) * 1973-02-05 1974-10-01 Gen Motors Corp Power semiconductor device package
US4023053A (en) * 1974-12-16 1977-05-10 Tokyo Shibaura Electric Co., Ltd. Variable capacity diode device
FR2368868A7 (fr) * 1976-10-21 1978-05-19 Ates Componenti Elettron Dispositif a semi conducteurs en forme de boitier
US4203792A (en) * 1977-11-17 1980-05-20 Bell Telephone Laboratories, Incorporated Method for the fabrication of devices including polymeric materials
JPS5623759A (en) * 1979-08-01 1981-03-06 Hitachi Ltd Resin-sealed semiconductor device and manufacture thereof

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS495388A (enExample) * 1972-05-01 1974-01-18

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014093411A (ja) * 2012-11-02 2014-05-19 Toshiba Corp 半導体装置

Also Published As

Publication number Publication date
FR2503454A1 (fr) 1982-10-08
DE3212442A1 (de) 1982-11-04
GB2096394A (en) 1982-10-13
US4642419A (en) 1987-02-10
DE3212442C2 (enExample) 1992-08-06
FR2503454B1 (fr) 1986-04-04
GB2096394B (en) 1985-02-20
JPS57177548A (en) 1982-11-01

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