GB2096394B - Four-lead dual in-line package module for semiconductor devices - Google Patents

Four-lead dual in-line package module for semiconductor devices

Info

Publication number
GB2096394B
GB2096394B GB8210174A GB8210174A GB2096394B GB 2096394 B GB2096394 B GB 2096394B GB 8210174 A GB8210174 A GB 8210174A GB 8210174 A GB8210174 A GB 8210174A GB 2096394 B GB2096394 B GB 2096394B
Authority
GB
United Kingdom
Prior art keywords
semiconductor devices
package module
line package
lead dual
dual
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8210174A
Other languages
English (en)
Other versions
GB2096394A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies Americas Corp
Original Assignee
International Rectifier Corp USA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Rectifier Corp USA filed Critical International Rectifier Corp USA
Publication of GB2096394A publication Critical patent/GB2096394A/en
Application granted granted Critical
Publication of GB2096394B publication Critical patent/GB2096394B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
GB8210174A 1981-04-06 1982-04-06 Four-lead dual in-line package module for semiconductor devices Expired GB2096394B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/251,268 US4642419A (en) 1981-04-06 1981-04-06 Four-leaded dual in-line package module for semiconductor devices

Publications (2)

Publication Number Publication Date
GB2096394A GB2096394A (en) 1982-10-13
GB2096394B true GB2096394B (en) 1985-02-20

Family

ID=22951202

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8210174A Expired GB2096394B (en) 1981-04-06 1982-04-06 Four-lead dual in-line package module for semiconductor devices

Country Status (5)

Country Link
US (1) US4642419A (enExample)
JP (2) JPS57177548A (enExample)
DE (1) DE3212442A1 (enExample)
FR (1) FR2503454B1 (enExample)
GB (1) GB2096394B (enExample)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT8224533A0 (it) * 1982-12-01 1982-12-01 Ora Sgs Microelettronica Spa S Contenitore in metallo e resina ad elevata affidabilita' per dispositivo a semiconduttore.
JPS5996844U (ja) * 1982-12-21 1984-06-30 日本インタ−ナショナル整流器株式会社 半導体装置用リ−ドフレ−ム
JPH073848B2 (ja) * 1984-09-28 1995-01-18 株式会社日立製作所 半導体装置
JPS63201347U (enExample) * 1987-06-17 1988-12-26
DE4031051C2 (de) * 1989-11-14 1997-05-07 Siemens Ag Modul mit mindestens einem Halbleiterschaltelement und einer Ansteuerschaltung
JP2745933B2 (ja) * 1992-02-17 1998-04-28 日本電気株式会社 Ｔａｂ−集積回路
US5337216A (en) * 1992-05-18 1994-08-09 Square D Company Multichip semiconductor small outline integrated circuit package structure
USD353575S (en) 1993-03-29 1994-12-20 Cornell Dubilier Electronics, Inc. Flatpack capacitor
DE69321966T2 (de) * 1993-12-24 1999-06-02 Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno, Catania Leistungs-Halbleiterbauelement
US5798287A (en) * 1993-12-24 1998-08-25 Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno Method for forming a power MOS device chip
DE69321965T2 (de) * 1993-12-24 1999-06-02 Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno, Catania MOS-Leistungs-Chip-Typ und Packungszusammenbau
TW354859B (en) * 1994-02-07 1999-03-21 Siemens Ag A storage unit of semiconductor assembled of multi-memory chips and its manufacturing method a semiconductor memory system is composed with several single memory chips or different designed memory units
US5647124A (en) * 1994-04-25 1997-07-15 Texas Instruments Incorporated Method of attachment of a semiconductor slotted lead to a substrate
DE69418037T2 (de) * 1994-08-02 1999-08-26 Consorzio Per La Ricerca Sulla Microelettronica Ne Leistungshalbleitervorrichtung aus MOS-Technology-Chips und Gehäuseaufbau
JP3426801B2 (ja) * 1995-08-15 2003-07-14 株式会社ミツバ 電子部品
US6476549B2 (en) * 2000-10-26 2002-11-05 Mu-Chin Yu Light emitting diode with improved heat dissipation
US7573159B1 (en) 2001-10-22 2009-08-11 Apple Inc. Power adapters for powering and/or charging peripheral devices
DE102008048259B4 (de) * 2008-09-22 2024-10-02 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Gehäuse für ein optoelektronisches Bauteil, seitlich emittierendes Bauteil mit einem Gehäuse und Verfahren zur Herstellung eines Gehäuses
EP2462616A1 (de) * 2009-08-05 2012-06-13 Continental Teves AG & Co. oHG Sensoranordnung und chip mit zusätzlichen befestigungsbeinen
US20130081845A1 (en) * 2011-09-30 2013-04-04 Edward Siahaan Housing for electronic components
JP6058353B2 (ja) * 2012-11-02 2017-01-11 株式会社東芝 半導体装置
US10625946B2 (en) 2016-06-30 2020-04-21 Shounan Engineering Inc. Magnetic chip conveyor
US11923344B2 (en) 2021-11-11 2024-03-05 Wolfspeed, Inc. Compact power module
US12150258B2 (en) * 2022-05-04 2024-11-19 Wolfspeed, Inc. Dual inline power module

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3522490A (en) * 1965-06-28 1970-08-04 Texas Instruments Inc Semiconductor package with heat conducting mounting extending from package on side opposite conductor extensions
NL157456B (nl) * 1968-07-30 1978-07-17 Philips Nv Halfgeleiderinrichting in een isolerende kunststofomhulling.
US3668299A (en) * 1971-04-29 1972-06-06 Beckman Instruments Inc Electrical circuit module and method of assembly
JPS495388A (enExample) * 1972-05-01 1974-01-18
US3839660A (en) * 1973-02-05 1974-10-01 Gen Motors Corp Power semiconductor device package
US4023053A (en) * 1974-12-16 1977-05-10 Tokyo Shibaura Electric Co., Ltd. Variable capacity diode device
FR2368868A7 (fr) * 1976-10-21 1978-05-19 Ates Componenti Elettron Dispositif a semi conducteurs en forme de boitier
US4203792A (en) * 1977-11-17 1980-05-20 Bell Telephone Laboratories, Incorporated Method for the fabrication of devices including polymeric materials
JPS5623759A (en) * 1979-08-01 1981-03-06 Hitachi Ltd Resin-sealed semiconductor device and manufacture thereof

Also Published As

Publication number Publication date
DE3212442C2 (enExample) 1992-08-06
JPS57177548A (en) 1982-11-01
FR2503454A1 (fr) 1982-10-08
DE3212442A1 (de) 1982-11-04
GB2096394A (en) 1982-10-13
FR2503454B1 (fr) 1986-04-04
US4642419A (en) 1987-02-10
JPS6444645U (enExample) 1989-03-16

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19960406