JPS6442549A - Low thermal expansion aluminum-silicon alloy - Google Patents

Low thermal expansion aluminum-silicon alloy

Info

Publication number
JPS6442549A
JPS6442549A JP19945587A JP19945587A JPS6442549A JP S6442549 A JPS6442549 A JP S6442549A JP 19945587 A JP19945587 A JP 19945587A JP 19945587 A JP19945587 A JP 19945587A JP S6442549 A JPS6442549 A JP S6442549A
Authority
JP
Japan
Prior art keywords
alloy
low thermal
powders
metallic
thermal conductivity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19945587A
Other languages
Japanese (ja)
Inventor
Nobuya Amano
Yoshinobu Takeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP19945587A priority Critical patent/JPS6442549A/en
Publication of JPS6442549A publication Critical patent/JPS6442549A/en
Pending legal-status Critical Current

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  • Manufacture Of Alloys Or Alloy Compounds (AREA)
  • Powder Metallurgy (AREA)

Abstract

PURPOSE:To obtain an Al-Si alloy having low thermal expansibility and high thermal conductivity by specifying the compsn. consisting of Al or Al alloy and metallic Si. CONSTITUTION:The titled alloy consists of, by weight, 20-50% Al or Al alloy and the balance metallic Si and retains excellent thermal conductivity and lightness. As said Al alloy, that contg. <=6% total of one or more kinds among Cu, Mg and Mn can be used. The above-mentioned alloy can be obtd. by powder metallurgy in which Al or Al alloy powders and metallic Si powders having about <=50mum average grain size are mixed in the specific ratios and the powders are cold molded and are subjected to hot plastic working to solidify. Said Al-Si alloy has low thermal expansibility, has good thermal conductivity and is suitable as the heat sink material of a semiconductor apparatus.
JP19945587A 1987-08-10 1987-08-10 Low thermal expansion aluminum-silicon alloy Pending JPS6442549A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19945587A JPS6442549A (en) 1987-08-10 1987-08-10 Low thermal expansion aluminum-silicon alloy

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19945587A JPS6442549A (en) 1987-08-10 1987-08-10 Low thermal expansion aluminum-silicon alloy

Publications (1)

Publication Number Publication Date
JPS6442549A true JPS6442549A (en) 1989-02-14

Family

ID=16408097

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19945587A Pending JPS6442549A (en) 1987-08-10 1987-08-10 Low thermal expansion aluminum-silicon alloy

Country Status (1)

Country Link
JP (1) JPS6442549A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5780213A (en) * 1993-12-22 1998-07-14 Fuji Photo Film Co., Ltd. Photographic printing paper support

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5780213A (en) * 1993-12-22 1998-07-14 Fuji Photo Film Co., Ltd. Photographic printing paper support

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