JPS6441255A - Multi-chip package - Google Patents
Multi-chip packageInfo
- Publication number
- JPS6441255A JPS6441255A JP19762387A JP19762387A JPS6441255A JP S6441255 A JPS6441255 A JP S6441255A JP 19762387 A JP19762387 A JP 19762387A JP 19762387 A JP19762387 A JP 19762387A JP S6441255 A JPS6441255 A JP S6441255A
- Authority
- JP
- Japan
- Prior art keywords
- terminals
- substrate
- carrier
- lsi chip
- power supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
Landscapes
- Semiconductor Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19762387A JPS6441255A (en) | 1987-08-07 | 1987-08-07 | Multi-chip package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19762387A JPS6441255A (en) | 1987-08-07 | 1987-08-07 | Multi-chip package |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6441255A true JPS6441255A (en) | 1989-02-13 |
Family
ID=16377560
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19762387A Pending JPS6441255A (en) | 1987-08-07 | 1987-08-07 | Multi-chip package |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6441255A (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5978228A (en) * | 1996-12-31 | 1999-11-02 | Intel Corporation | Apparatus for mounting a very large scale integration (VLSI) chip to a computer chassis for cooling |
US6137688A (en) * | 1996-12-31 | 2000-10-24 | Intel Corporation | Apparatus for retrofit mounting a VLSI chip to a computer chassis for current supply |
EP2061289A1 (en) * | 2007-11-13 | 2009-05-20 | St Microelectronics S.A. | Interconnection of embedded passive components and substrates |
JP2015005557A (ja) * | 2013-06-19 | 2015-01-08 | 富士通株式会社 | パッケージ実装構造 |
-
1987
- 1987-08-07 JP JP19762387A patent/JPS6441255A/ja active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5978228A (en) * | 1996-12-31 | 1999-11-02 | Intel Corporation | Apparatus for mounting a very large scale integration (VLSI) chip to a computer chassis for cooling |
US6137688A (en) * | 1996-12-31 | 2000-10-24 | Intel Corporation | Apparatus for retrofit mounting a VLSI chip to a computer chassis for current supply |
US6462943B1 (en) | 1996-12-31 | 2002-10-08 | Intel Corporation | Method and apparatus for retrofit mounting a VLSI chip to a computer chassis for current supply |
EP2061289A1 (en) * | 2007-11-13 | 2009-05-20 | St Microelectronics S.A. | Interconnection of embedded passive components and substrates |
JP2015005557A (ja) * | 2013-06-19 | 2015-01-08 | 富士通株式会社 | パッケージ実装構造 |
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