JPS6439378A - Production of thin silicon film - Google Patents

Production of thin silicon film

Info

Publication number
JPS6439378A
JPS6439378A JP19460087A JP19460087A JPS6439378A JP S6439378 A JPS6439378 A JP S6439378A JP 19460087 A JP19460087 A JP 19460087A JP 19460087 A JP19460087 A JP 19460087A JP S6439378 A JPS6439378 A JP S6439378A
Authority
JP
Japan
Prior art keywords
substrate
silicon film
thin silicon
hydrogen
atmosphere
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19460087A
Other languages
Japanese (ja)
Other versions
JPH0660401B2 (en
Inventor
Kenichi Ishii
Yutaka Hayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Institute of Advanced Industrial Science and Technology AIST
Original Assignee
Agency of Industrial Science and Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agency of Industrial Science and Technology filed Critical Agency of Industrial Science and Technology
Priority to JP19460087A priority Critical patent/JPH0660401B2/en
Publication of JPS6439378A publication Critical patent/JPS6439378A/en
Publication of JPH0660401B2 publication Critical patent/JPH0660401B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Chemical Vapour Deposition (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

PURPOSE:To form the title high-quality thin silicon film on the surface of a substrate by treating the substrate at a temp. equal to the deposition temp. of the thin silicon film in the atmosphere of a gaseous mixture of hydrogen and chlorine at the time of pretreating the substrate to be deposited with the thin silicon film. CONSTITUTION:The substrate is cleaned by the conventional process to remove the natural-oxidation film by a hydrofluoric acid soln., and then dried in an nitrogen atmosphere. The substrate is then pretreated at 400-600 deg.C in an electric furnace filled with the atmosphere contg. a gaseous mixture of chlorine and hydrogen or further gaseous hydrogen chloride and an inert gas, if necessary, while preventing the formation of the natural-oxidation film. The substrate must have a silicon crystal on at least a part of the surface. The substrate is isolated from the external air, monosilane kept at 500-600 deg.C or a higher silane kept at 400-600 deg.C is supplied onto the substrate, and a thin silicon film is formed on the substrate.
JP19460087A 1987-08-04 1987-08-04 Silicon thin film manufacturing method Expired - Lifetime JPH0660401B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19460087A JPH0660401B2 (en) 1987-08-04 1987-08-04 Silicon thin film manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19460087A JPH0660401B2 (en) 1987-08-04 1987-08-04 Silicon thin film manufacturing method

Publications (2)

Publication Number Publication Date
JPS6439378A true JPS6439378A (en) 1989-02-09
JPH0660401B2 JPH0660401B2 (en) 1994-08-10

Family

ID=16327243

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19460087A Expired - Lifetime JPH0660401B2 (en) 1987-08-04 1987-08-04 Silicon thin film manufacturing method

Country Status (1)

Country Link
JP (1) JPH0660401B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0445754B1 (en) * 1990-03-06 1996-02-14 Sumitomo Electric Industries, Ltd. Method for growing a diamond or c-BN thin film
JP2005294690A (en) * 2004-04-02 2005-10-20 Hitachi Kokusai Electric Inc Method for manufacturing semiconductor device and substrate processing apparatus
US7357274B2 (en) 2001-06-18 2008-04-15 Hewett Christopher B Tissue dispenser

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000357659A (en) * 1999-06-14 2000-12-26 Nec Corp Manufacture of semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0445754B1 (en) * 1990-03-06 1996-02-14 Sumitomo Electric Industries, Ltd. Method for growing a diamond or c-BN thin film
US7357274B2 (en) 2001-06-18 2008-04-15 Hewett Christopher B Tissue dispenser
JP2005294690A (en) * 2004-04-02 2005-10-20 Hitachi Kokusai Electric Inc Method for manufacturing semiconductor device and substrate processing apparatus

Also Published As

Publication number Publication date
JPH0660401B2 (en) 1994-08-10

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term