JPS6473078A - C.v.d. device - Google Patents

C.v.d. device

Info

Publication number
JPS6473078A
JPS6473078A JP22870987A JP22870987A JPS6473078A JP S6473078 A JPS6473078 A JP S6473078A JP 22870987 A JP22870987 A JP 22870987A JP 22870987 A JP22870987 A JP 22870987A JP S6473078 A JPS6473078 A JP S6473078A
Authority
JP
Japan
Prior art keywords
reaction furnace
furnace
vessel
reaction
raw material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22870987A
Other languages
Japanese (ja)
Inventor
Hiroaki Oshima
Takeshi Okamoto
Seijiro Tanaka
Tatsuo Kawakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JFE Refractories Corp
Original Assignee
Kawasaki Refractories Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kawasaki Refractories Co Ltd filed Critical Kawasaki Refractories Co Ltd
Priority to JP22870987A priority Critical patent/JPS6473078A/en
Publication of JPS6473078A publication Critical patent/JPS6473078A/en
Pending legal-status Critical Current

Links

Landscapes

  • Chemical Vapour Deposition (AREA)

Abstract

PURPOSE:To prevent the adhesion of the deposit of CVD reaction by a gaseous raw material to the inside wall of a CVD reaction furnace which contains a material to be treated and has an induction heating coil on the outside by putting the above-mentioned reaction furnace into a vessel and passing a cooling medium between the vessel and the reaction furnace. CONSTITUTION:A graphite material or the like is put as the base material 4 to be treated into the reaction furnace 6 made of quartz, Al2O3, etc., and Si(CH3)2 is supplied as the gaseous raw material together with an N2 carrier gas from a gas introducing port 2 into the furnace. The material 4 is heated to, for example, 1,300 deg.C by the induction heating coil 7 on the outside of the reaction furnace and the film of SiC is formed on the surface thereof by the CVD reaction of the gaseous raw material. An inert gas such as N2 or Ar is introduced simultaneously as the cooling medium into the space between the vessel 1 and the reaction furnace 6 to cool the reaction furnace 6, by which the deposition and adhesion of the SiC on the inside wall of the reaction furnace 6 are prevented.
JP22870987A 1987-09-11 1987-09-11 C.v.d. device Pending JPS6473078A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22870987A JPS6473078A (en) 1987-09-11 1987-09-11 C.v.d. device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22870987A JPS6473078A (en) 1987-09-11 1987-09-11 C.v.d. device

Publications (1)

Publication Number Publication Date
JPS6473078A true JPS6473078A (en) 1989-03-17

Family

ID=16880578

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22870987A Pending JPS6473078A (en) 1987-09-11 1987-09-11 C.v.d. device

Country Status (1)

Country Link
JP (1) JPS6473078A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5690050A (en) * 1995-05-10 1997-11-25 Anelva Corporation Plasma treating apparatus and plasma treating method
JP2008159945A (en) * 2006-12-25 2008-07-10 Tokyo Electron Ltd Apparatus and method for forming film
CN102312219A (en) * 2010-06-30 2012-01-11 鸿富锦精密工业(深圳)有限公司 Coating device
US8784564B2 (en) 2010-06-29 2014-07-22 Hon Hai Precision Industry Co., Ltd. Film coating apparatus

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5690050A (en) * 1995-05-10 1997-11-25 Anelva Corporation Plasma treating apparatus and plasma treating method
JP2008159945A (en) * 2006-12-25 2008-07-10 Tokyo Electron Ltd Apparatus and method for forming film
US8784564B2 (en) 2010-06-29 2014-07-22 Hon Hai Precision Industry Co., Ltd. Film coating apparatus
CN102312219A (en) * 2010-06-30 2012-01-11 鸿富锦精密工业(深圳)有限公司 Coating device

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