JPS6439057A - Semiconductor storage device - Google Patents
Semiconductor storage deviceInfo
- Publication number
- JPS6439057A JPS6439057A JP62195572A JP19557287A JPS6439057A JP S6439057 A JPS6439057 A JP S6439057A JP 62195572 A JP62195572 A JP 62195572A JP 19557287 A JP19557287 A JP 19557287A JP S6439057 A JPS6439057 A JP S6439057A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- groove
- embedded
- type
- sidewall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title 1
- 239000003990 capacitor Substances 0.000 abstract 2
- 239000004020 conductor Substances 0.000 abstract 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
- H10B12/37—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells the capacitor being at least partially in a trench in the substrate
- H10B12/373—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells the capacitor being at least partially in a trench in the substrate the capacitor extending under or around the transistor
Landscapes
- Semiconductor Memories (AREA)
Abstract
PURPOSE:To simplify a structure and to improve a cutoff characteristic, by combining a switching MOS transistor, which is formed on the surface of an element forming region partitioned with grid shaped grooves, and a capacitor, which comprises an embedded layer in the element forming region and a conductor layer in the groove through a dielectric layer that is provided on the sidewall of the groove. CONSTITUTION:A P-type epitaxial layer 3, which is partitioned using grooves formed in a grid shape, is provided on the surface of a P-type silicon substrate 1. An N-type embedded layer 2 is embedded beneath the surface of the P-type epitaxial layer 3 in contact with a part of the sidewall of the groove. A dielectric layer 5 is provided on the inner wall of the groove. A conductor layer 6 forms a capacitor through the dielectric layer 5 together with the N-type embedded layer 2, which is embedded at the inner side of the groove. A gate insulating film 8 is provided on the surface of the P-type epitaxial layer 3. A gate electrode 9 is selectively provided on the film 8. An apposite conductivity type source and drain regions 10 and 11 are provided to the P-type epitaxial layer 3 and the gate electrode 9 in a self-alignment manner. An opposite conductivity type connecting region 4 is provided along the sidewall of the groove so as to connect the embedded regions. Thus the structure is simplified, and a cutoff characteristic can be improved.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62195572A JPS6439057A (en) | 1987-08-04 | 1987-08-04 | Semiconductor storage device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62195572A JPS6439057A (en) | 1987-08-04 | 1987-08-04 | Semiconductor storage device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6439057A true JPS6439057A (en) | 1989-02-09 |
Family
ID=16343356
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62195572A Pending JPS6439057A (en) | 1987-08-04 | 1987-08-04 | Semiconductor storage device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6439057A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0782186A3 (en) * | 1995-12-27 | 1999-08-04 | Siemens Aktiengesellschaft | Method to form a buried, implanted plate for dram trench storage capacitors |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62105467A (en) * | 1985-10-30 | 1987-05-15 | インターナショナル ビジネス マシーンズ コーポレーション | Capacitor integrated circuit structural unit |
JPS63254763A (en) * | 1987-04-10 | 1988-10-21 | Matsushita Electric Ind Co Ltd | Semiconductor memory device |
-
1987
- 1987-08-04 JP JP62195572A patent/JPS6439057A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62105467A (en) * | 1985-10-30 | 1987-05-15 | インターナショナル ビジネス マシーンズ コーポレーション | Capacitor integrated circuit structural unit |
JPS63254763A (en) * | 1987-04-10 | 1988-10-21 | Matsushita Electric Ind Co Ltd | Semiconductor memory device |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0782186A3 (en) * | 1995-12-27 | 1999-08-04 | Siemens Aktiengesellschaft | Method to form a buried, implanted plate for dram trench storage capacitors |
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