JPS6432653A - Substrate for loading semiconductor - Google Patents

Substrate for loading semiconductor

Info

Publication number
JPS6432653A
JPS6432653A JP18965387A JP18965387A JPS6432653A JP S6432653 A JPS6432653 A JP S6432653A JP 18965387 A JP18965387 A JP 18965387A JP 18965387 A JP18965387 A JP 18965387A JP S6432653 A JPS6432653 A JP S6432653A
Authority
JP
Japan
Prior art keywords
substrate
tip section
section
plating
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18965387A
Other languages
Japanese (ja)
Other versions
JP2517302B2 (en
Inventor
Masatome Takada
Katsumi Mabuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP62189653A priority Critical patent/JP2517302B2/en
Publication of JPS6432653A publication Critical patent/JPS6432653A/en
Application granted granted Critical
Publication of JP2517302B2 publication Critical patent/JP2517302B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To shut off the tip section of a lead for plating completely from an external atmosphere, and to prevent the intrusion of moisture by chamfering the outer circumference of a substrate, retreating the tip section of the lead for plating and coating the tip section of the lead for plating with a resin mask. CONSTITUTION:A semiconductor-element loading section and a conductor circuit 4 are formed onto a substrate 1 for loading a semiconductor. A chamfering section 10 is shaped by executing chamfering working to the outer circumference of the substrate 1 in the substrate 1. The tip section 3 of a lead for plating is cut, and the tip section 3 is brought to the state in which the tip section 3 is positioned at a section inner than the edge face of the outer circumference of the substrate 1. The surface of the substrate 1 including the tip section 3 is masked with a resin. Accordingly, the tip section 3 is shut off completely from an external atmosphere, thus preventing the intrusion of moisture.
JP62189653A 1987-07-28 1987-07-28 Semiconductor mounting board Expired - Lifetime JP2517302B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62189653A JP2517302B2 (en) 1987-07-28 1987-07-28 Semiconductor mounting board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62189653A JP2517302B2 (en) 1987-07-28 1987-07-28 Semiconductor mounting board

Publications (2)

Publication Number Publication Date
JPS6432653A true JPS6432653A (en) 1989-02-02
JP2517302B2 JP2517302B2 (en) 1996-07-24

Family

ID=16244918

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62189653A Expired - Lifetime JP2517302B2 (en) 1987-07-28 1987-07-28 Semiconductor mounting board

Country Status (1)

Country Link
JP (1) JP2517302B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015046571A (en) * 2013-08-02 2015-03-12 日本特殊陶業株式会社 Wiring board and method for producing the same

Also Published As

Publication number Publication date
JP2517302B2 (en) 1996-07-24

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