JPS6459948A - Semiconductor mounting substrate - Google Patents

Semiconductor mounting substrate

Info

Publication number
JPS6459948A
JPS6459948A JP21723387A JP21723387A JPS6459948A JP S6459948 A JPS6459948 A JP S6459948A JP 21723387 A JP21723387 A JP 21723387A JP 21723387 A JP21723387 A JP 21723387A JP S6459948 A JPS6459948 A JP S6459948A
Authority
JP
Japan
Prior art keywords
conductor pin
hole
pin
conductor
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21723387A
Other languages
Japanese (ja)
Other versions
JP2579495B2 (en
Inventor
Takakazu Ishikawa
Masanori Kawade
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP62217233A priority Critical patent/JP2579495B2/en
Publication of JPS6459948A publication Critical patent/JPS6459948A/en
Application granted granted Critical
Publication of JP2579495B2 publication Critical patent/JP2579495B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308—Adaptations of leads

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To prevent a substrate and a through-hole from damage by a method wherein a conductor pin is fixed to the through-hole, whose diameter is smaller than the breadth of the flat section of the conductor pin, formed at the required position of a printed wiring plate under a condition that the pin is fitted into the through-hole. CONSTITUTION:A conductor pin 5 has a tapered section between a flat section 7 and a collar section 6, and when the conductor pin 5 is made to be inserted into the through-hole by pressure, even if position deviation of the conductor pin 5 from the through-hole takes place, position adjustment is performed by the conductor pin itself, so that the conductor pin is smoothly inserted into the through-hole and consequently fixed to a printed wiring plate assuredly. Therefore, a base material and a through-hole are completely prevented from damage when this type of a conductor pin is used as compared with a conventional conductor pin.
JP62217233A 1987-08-31 1987-08-31 Semiconductor mounting substrate Expired - Lifetime JP2579495B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62217233A JP2579495B2 (en) 1987-08-31 1987-08-31 Semiconductor mounting substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62217233A JP2579495B2 (en) 1987-08-31 1987-08-31 Semiconductor mounting substrate

Publications (2)

Publication Number Publication Date
JPS6459948A true JPS6459948A (en) 1989-03-07
JP2579495B2 JP2579495B2 (en) 1997-02-05

Family

ID=16700936

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62217233A Expired - Lifetime JP2579495B2 (en) 1987-08-31 1987-08-31 Semiconductor mounting substrate

Country Status (1)

Country Link
JP (1) JP2579495B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0621257U (en) * 1991-12-12 1994-03-18 日本ミクロン株式会社 Surface Mounted Plastic Pinglit Array

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62130544A (en) * 1985-11-30 1987-06-12 Ibiden Co Ltd Substrate for placing semiconductor

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62130544A (en) * 1985-11-30 1987-06-12 Ibiden Co Ltd Substrate for placing semiconductor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0621257U (en) * 1991-12-12 1994-03-18 日本ミクロン株式会社 Surface Mounted Plastic Pinglit Array

Also Published As

Publication number Publication date
JP2579495B2 (en) 1997-02-05

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