JPS6459948A - Semiconductor mounting substrate - Google Patents
Semiconductor mounting substrateInfo
- Publication number
- JPS6459948A JPS6459948A JP21723387A JP21723387A JPS6459948A JP S6459948 A JPS6459948 A JP S6459948A JP 21723387 A JP21723387 A JP 21723387A JP 21723387 A JP21723387 A JP 21723387A JP S6459948 A JPS6459948 A JP S6459948A
- Authority
- JP
- Japan
- Prior art keywords
- conductor pin
- hole
- pin
- conductor
- section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE:To prevent a substrate and a through-hole from damage by a method wherein a conductor pin is fixed to the through-hole, whose diameter is smaller than the breadth of the flat section of the conductor pin, formed at the required position of a printed wiring plate under a condition that the pin is fitted into the through-hole. CONSTITUTION:A conductor pin 5 has a tapered section between a flat section 7 and a collar section 6, and when the conductor pin 5 is made to be inserted into the through-hole by pressure, even if position deviation of the conductor pin 5 from the through-hole takes place, position adjustment is performed by the conductor pin itself, so that the conductor pin is smoothly inserted into the through-hole and consequently fixed to a printed wiring plate assuredly. Therefore, a base material and a through-hole are completely prevented from damage when this type of a conductor pin is used as compared with a conventional conductor pin.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62217233A JP2579495B2 (en) | 1987-08-31 | 1987-08-31 | Semiconductor mounting substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62217233A JP2579495B2 (en) | 1987-08-31 | 1987-08-31 | Semiconductor mounting substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6459948A true JPS6459948A (en) | 1989-03-07 |
JP2579495B2 JP2579495B2 (en) | 1997-02-05 |
Family
ID=16700936
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62217233A Expired - Lifetime JP2579495B2 (en) | 1987-08-31 | 1987-08-31 | Semiconductor mounting substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2579495B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0621257U (en) * | 1991-12-12 | 1994-03-18 | 日本ミクロン株式会社 | Surface Mounted Plastic Pinglit Array |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62130544A (en) * | 1985-11-30 | 1987-06-12 | Ibiden Co Ltd | Substrate for placing semiconductor |
-
1987
- 1987-08-31 JP JP62217233A patent/JP2579495B2/en not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62130544A (en) * | 1985-11-30 | 1987-06-12 | Ibiden Co Ltd | Substrate for placing semiconductor |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0621257U (en) * | 1991-12-12 | 1994-03-18 | 日本ミクロン株式会社 | Surface Mounted Plastic Pinglit Array |
Also Published As
Publication number | Publication date |
---|---|
JP2579495B2 (en) | 1997-02-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
EXPY | Cancellation because of completion of term |